Patents Examined by Gerald P. Tolin
  • Patent number: 6711018
    Abstract: In a heat-dissipating module for an electronic device, a heat-conducting unit is adapted to be disposed in close contact with a heat-generating component, and includes inner and outer tubes that cooperatively confine an enclosed chamber filled with a thermal superconductor material. A fan unit is disposed to generate currents of air through a chamber confined by the inner tube so as to dissipate the heat transferred to the heat-conducting unit from the heat-generating component. Alternatively, the heat-conducting unit can be configured into a tubular member, and a heat-dissipating unit is provided on the tubular member to help dissipate heat.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: March 23, 2004
    Inventor: Chin-Kuang Luo
  • Patent number: 6707672
    Abstract: A heat sink clip assembly includes a clip (10) and a frame (50). The clip is formed from a single strand of resilient metallic material that is bent and coiled to become generally U-shaped. The clip includes a retaining bar (11), and two confining poles (12) extending perpendicularly from opposite ends of the retaining bar. Each confining pole comprises a first resilient section (14) near a distal end of the confining pole, a fastener (18) at the distal end of the confining pole, and a second resilient section (16) adjacent the retaining bar. Each first resilient section has a pressed head (142) with a handle (30) attached thereon. The frame comprises a plurality of locking fingers (52) extending perpendicularly from a flat rectangular board. Each locking finger has a hook (53, 54) for respectively locking the retaining bar or one of the fasteners of the clip.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: March 16, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: HouBen Liu
  • Patent number: 6704200
    Abstract: The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: March 9, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roy Zeighami, Christian L. Belady
  • Patent number: 6295203
    Abstract: A clip assembly (40) for mounting a heat sink (30) to an electronic device (20) retained on a socket connector (10) includes a clip (50) and a fastener (60). The clip has an elongate spring portion (52) engaging a surface of the heat sink and two legs (54) extending from the spring portion for engaging with catches (12) of the socket connector, thereby securing the heat sink to the electronic device. The fastener includes a pair of latches (62) and a resilient connecting section (66) connected between the latches. Each latch has a protrusion (64) extending from a distal end thereof, each protrusion extending towards the opposite protrusion. The heat sink forms a plurality of fins (34) defining a slot (36) therebetween for receiving the clip and the fastener. The latches are configured to engage with grooves (38) defined in fins on opposite sides of the slot of the heat sink, thereby securely attaching the clip to the heat sink and effectively eliminating relative movement between the clip and the heat sink.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: September 25, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 5956230
    Abstract: A device which houses the active and passive nodal point modules of telecommunication installations in the ground comprises a metal container with a removable cover and a removable support for the modules housed in the container. The modules are attached in a heat-conductive manner to the internal surface of the support. The support is made of heat-conductive material and its external surface has a number of cooling fins. Through the cooling fins, the support makes heat-conductive contact with the internal surface of the container.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: September 21, 1999
    Assignee: Alcatel Alsthom Compagnie Generale d'Electicite
    Inventors: Franz Grajewski, Werner Stieb
  • Patent number: 5943220
    Abstract: A power supply apparatus includes a front panel, a rear panel and two left and right side panels which together form a housing. Opposed edges of a partition are connected to the front and rear panels to thereby divide the interior space of the housing into upper and lower chambers. The left and right side panels each have edges which are placed to abut against the corresponding edges of the other side panel.Components of a power supply circuit are appropriately distributed in the upper and lower chambers. Some of the components in the upper chambers are located beneath the upper abutting edges of said left and right side panels, and a cover is disposed to cover at least those components which are located beneath the upper abutting edges.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: August 24, 1999
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventors: Kunio Shikata, Masao Katooka, Toru Arai, Shigeru Okamoto, Kenzo Danjo
  • Patent number: 5936506
    Abstract: A delay mechanism for retarding relative movement between two members has particular application in a hinge assembly for a dropout fuseholder. In one embodiment, a pin member rotatably connecting two adjacent members is disposed through a sleeve which has a cavity filled with viscous material, such as silicon putty. Protrusions extending from the shaft of the pin engage the putty and retard the relative rotational movement of the two members. In another embodiment, a friction member, such as a washer or annular seal, is disposed between the adjacent rotatable members. The friction member has facing surfaces contacting the opposing surfaces of the rotatable members such that the frictional forces between the friction member and the rotatable members retard rotation. In still another embodiment, the hinge assembly of a dropout fuseholder includes a latch member which rotates away from the fuseholder once dropout is initiated.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: August 10, 1999
    Assignee: Cooper Industries, Inc.
    Inventors: Stephen Paul Hassler, Stephen Paul Johnson, John Lapp
  • Patent number: 5901044
    Abstract: A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: May 4, 1999
    Assignee: ILC Data Device Corporation
    Inventor: Len Marro
  • Patent number: 5892656
    Abstract: A thermoelectric generator system. The thermoelectric generator has at least one hot side heat exchanger and at least one cold side heat exchanger and at least one thermoelectric module with thermoelectric elements installed in an injection molded eggcrate. The thermoelectric modules are held in close contact with the hot side heat exchanger and the cold side heat sink with a spring force. A preferred embodiment contains eight modules held in compression between the hot and cold heat exchangers with Belville springs. The eggcrate is molded from a high temperature plastic with ridges provided for extra strength and tapered walls to permit ease of installation of the thermoelectric elements and stop tabs assure correct positioning of the elements. Electrical connections at hot and cold surfaces are preferably made by thermal spraying metallize coatings on the surfaces and then surface finishing the module to expose the walls of the eggcrate.
    Type: Grant
    Filed: May 20, 1996
    Date of Patent: April 6, 1999
    Inventor: John C. Bass
  • Patent number: 5889656
    Abstract: Computer apparatus 10 receives add-on electronic module 12 for installation into the computer apparatus. The add-on module has first end 12A and second end 12B with electrical contacts 12C therebetween for interfacing with the computer apparatus. Elongated electrical connector 14 mounted on the mother board, has first end 14A and second end 14B corresponding to the first end and second end of the add-on module. The electrical connector defines a module site within the computer apparatus for receiving the add-on module. The electrical connector has electrical contacts 14C between the ends thereof for electrically contacting corresponding electrical contacts 12C on the add-on module. First pivot base 16A secured to the mother board proximate the first end of the electrical connector defines first pivot axis 17A. Second pivot base 16B proximate the second end of the electrical connector defines second pivot axis 17B.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: March 30, 1999
    Assignee: Micronics Computers Inc.
    Inventor: Ji-Zhong Yin
  • Patent number: 5889247
    Abstract: A normally closed, fluid pressure responsive electric switch (10) has an electrically conductive body (12) formed with an orifice (12a) leading to a pressure chamber (12c) which is separated from a switch chamber by a flexible member (14). An annular support plate (18) and disc seat (20) are sandwiched in the body by crimping distal free end (12g) of body (12) over the flange (26b) of a connector body (26). A pressure/force converter (22) has a plurality of outwardly extending fingers which are interdigitated with a corresponding number of fingers extending inwardly from an aperture in the disc seat. The converter has one end (18b) engaging the membrane and an opposite end having a circular force applying surface (22g) adapted to engage a snap acting disc (24) disposed on the disc seat within a recess formed in the connector body. The disc is centered by a centering lip (22e) formed on the converter fingers.
    Type: Grant
    Filed: April 17, 1997
    Date of Patent: March 30, 1999
    Assignee: Texas Instruments Incorporated
    Inventor: Stanley G. Homol
  • Patent number: 5875098
    Abstract: A thermoelectric module having a gapless insulating eggcrate providing insulated spaces for a large number of p-type and n-type thermoelectric elements. The absence of gaps in the walls of the spaces virtually eliminates the possibility of interwall shorts between the elements. Electrical connections on both the hot and cold sides of the module electrically connect the elements in series or in parallel as desired. Usually, most or all of the elements will be connected in series. In a preferred embodiment, the gapless eggcrate is formed from a high temperature plastic. In a preferred embodiment, two lead wires are added before adding the hot and cold side electrical connections. In this embodiment, electrical connections on the hot and cold sides comprise a thin layer of molybdenum and a coating of aluminum over the molybdenum. The surfaces are ground down to expose the insulating eggcrate walls except where connections between the elements are desired.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: February 23, 1999
    Assignee: Hi-Z Corporation
    Inventors: Frederick A. Leavitt, John C. Bass, Norbert B. Elsner
  • Patent number: 5872699
    Abstract: An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: February 16, 1999
    Assignee: Fujitsu Limited
    Inventors: Kota Nishii, Kouichi Kimura, Masanobu Ishizuki, Katsura Adachi, Hiroki Uchida
  • Patent number: 5870285
    Abstract: An assembly support mount includes at least two flexible, retention posts spaced apart with ends to engage a heat sink frictionally to support the heat sink relative to an electronic device. The flexible retention posts are attached to a substrate without the need for holes in the substrate and extend past a heat generating device into openings in a heat sink where they are attached by any number of means, preferrably by frictionally engaging the openings in the heat sink.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: February 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: Stephen John Kosteva, Bahgat Ghaleb Sammakia
  • Patent number: 5864470
    Abstract: A flexible circuit board for a ball grid array semiconductor package including a flexible resin film, a plurality of electrically conductive traces formed on an upper surface of the resin film, the conductive traces having solder ball pads, and a die flag including a semiconductor chip paddle located on a central portion of the circuit board, the chip paddle having a plurality of heat-discharging and grounding solder ball pads, and a plurality of lattice-shaped traces adapted to electrically connect the solder ball pads, the traces being shaped into a lattice to prevent a bleed-out of a silver-filled epoxy resin, a ground bonding rim located around the chip paddle, and a plurality of radial traces adapted to electrically connect the chip paddle to the ground bonding rim, and the flexible resin film being perforated to define solder ball lands on lower surfaces of the solder ball pads.
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: January 26, 1999
    Assignees: Anam Semiconductor Inc., Amkor Technology, Inc.
    Inventors: Il Kwon Shim, Young Wook Heo, Robert Francis Darveaux
  • Patent number: 5859764
    Abstract: A thermally conductive wedgelock having improved thermal conductivity is used to secure a circuit card assembly in a card guide slot formed in a housing of an electronics package. The circuit card assembly has a thermal mounting plate that is used to secure the assembly in the slot. The thermally conductive wedgelock secures the circuit card assembly in the housing and conductively couples heat from the circuit card assembly to the housing by way of the card guide slot. The wedgelock provides a secondary heat path to the card guide slot to housing in addition to the primary heat path through the thermal mounting plate. Apparatus is provide for expanding the wedgelock in the card guide slot to secure the circuit card assembly therein. The thermally conductive wedgelock may be made of copper or other metal having high thermal conductivity. The wedgelock preferably comprises two tapered wedges, and has a guide that prevents rotation between the adjacent wedges.
    Type: Grant
    Filed: February 27, 1997
    Date of Patent: January 12, 1999
    Assignee: Raytheon Company
    Inventors: Richard F. Davis, Lawrence S. Mills
  • Patent number: 5859759
    Abstract: The semiconductor pressure sensor has a pressure sensor unit with a pressure sensor chip for detecting pressure, peripheral circuitry for converting the pressure detected by the pressure sensor unit to an electrical signal and processing the electrical signal, a lead frame for fastening and electrically connecting peripheral circuitry, a package in which the peripheral circuitry and lead frame are integrated in a resin molding including a cavity in which the pressure sensor unit is housed, a cover for closing the opening of the cavity in which the pressure sensor unit is housed, and a pressure opening for conveying a pressure-conveying medium to the pressure sensor chip. The pressure sensor unit is fastened to the inside bottom of the cavity and is electrically connected to a particular part of the lead frame exposed inside the cavity.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: January 12, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kyoichi Moriyama, Katsumi Sakabe, Motomi Ichihashi
  • Patent number: 5847928
    Abstract: A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: December 8, 1998
    Assignee: Thermalloy, Inc.
    Inventors: Howard G. Hinshaw, Matthew C. Smithers
  • Patent number: 5847929
    Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of to C. for 1,000 cycles and C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: December 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: William Emmett Bernier, Michael Anthony Gaynes, Irving Memis, Hussain Shaukatuallah
  • Patent number: 5847927
    Abstract: An electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: December 8, 1998
    Assignee: Raytheon Company
    Inventors: Charles P. Minning, Douglas W. Wolfe, John H. Schroeder