Patents Examined by Gerald P. Tolin
  • Patent number: 5748445
    Abstract: This invention describes a triangular heat sink and circuit enclosure for high power dissipation electronic circuits. The heat sink uses a number of cooling fins to provide cooling of the circuitry and equipment contained in the circuit enclosure and can handle power dissipation levels of up to 15 kilowatts. The circuit enclosure uses air moving devices and triangular heat sinks to provide both conduction cooling and heat transfer to a stream of air. The cooling fins of the heat sink are sealed away from the electronic components when the circuit enclosure is assembled.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: May 5, 1998
    Assignee: General Resources Corporation
    Inventors: Michael John North, Christopher Hall, Thomas Mark Cyster, Chris C. Chen
  • Patent number: 5748444
    Abstract: A portable electronic apparatus comprises a box-shaped housing. A metal-made frame is contained in the housing. The frame supports a circuit board. A circuit element, generating heat while operating, is mounted on the circuit board. A fan is contained in the housing so as to guide cooling air to the circuit element. The frame has a cooling air passage to guide cooling air thereto by the fan. The cooling air passage has a heat receiving part where heat of the circuit element is transmitted, and the heat receiving part is cooled by cooling air flowing to the cooling air passage.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: May 5, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masami Honda, Kazuya Shibasaki
  • Patent number: 5744771
    Abstract: A pressure switch has a housing with an interior bore extending from one end to the other. A rod slidable within the bore and operated by external fluid pressure extends between a piston at one end of the housing and a mechanically operated electrical switch at the other end of the housing. A spring is disposed about the rod between a first stop on the rod and a second stop on the housing. The spring provides resistance against movement of the rod under external pressure. The resistance of the spring to movement is adjusted by a sleeve engaging the spring, with the sleeve threaded into the bore of the housing for movement longitudinally within the housing. A split ring wedged between two other rings resists movement of the rod to longitudinal movement.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: April 28, 1998
    Assignee: Argus Machine Co. Ltd.
    Inventor: James Richard Ellett
  • Patent number: 5745343
    Abstract: A cubicle which houses an inverter provided a tube which is placed to creep in a zigzag along the surface of at least one wall of the cubicle, preferably the wall on which a switching element is attached, and in which a cooling liquid is flown.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: April 28, 1998
    Assignee: Fanuc, Ltd.
    Inventor: Makoto Takeshita
  • Patent number: 5740018
    Abstract: An apparatus for controlling the operating conditions of individual electic circuit boards and a circuit board cabinet for holding one or more environmentally controlled circuit packs is provided. The enclosure provides both electronic ports and cooling ports. The cooling ports may be used to circulate liquid or gaseous coolant over the surface of the circuit board thereby dissipating built up heat. The electronic ports allow the board to be externally connected to other electronic components. Additionally, the enclosure provides an electrostatic buffer that protects the enclosed circuit board from electrostatic shock during operation or while the board is being externally handled and stored. Finally, the enclosure provides a barrier against foreign particles such as dust and moisture. The cabinet allows a plurality of circuit boards to be mounted in one cabinet and cooled by a single cooling source. It also provides coolant draining capabilities and a coolant distribution system.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: April 14, 1998
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: John T. Rumbut, Jr.
  • Patent number: 5736702
    Abstract: A pneumatically actuated switching device is disclosed for forming a momentary electrical signal circuit with a receptacle of a patient call system utilizing a conductive plunger which slides in response to a pulse of pressurized air delivered to an internal chamber through a housing connection which provides for optional assembly orientations. A spring is used to maintain separation between a conductive plunger and the electrical components when the pneumatic switching device is not activated by a patient.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: April 7, 1998
    Assignee: Dwyer Precision, Inc.
    Inventors: George A. Roberts, Bert W. Wechtenheiser
  • Patent number: 5734556
    Abstract: An assembly for clamping a heat sink to an integrated circuit package that is mounted to printed circuit board. The assembly includes a pair of pin headers that are mounted to the printed circuit board. The assembly also contains a clip that is snapped onto the pin headers and presses the heat sink into the package. The pin headers each have a pair of posts that extend from a spacer. The posts are soldered to the printed circuit board to secure the headers to the board. The headers also have wire loops that extend from the spacers and capture the ends of the clip.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: March 31, 1998
    Assignee: Sun Microsystems, Inc.
    Inventors: Mohsen Saneinejad, Hassan Siahpolo
  • Patent number: 5734553
    Abstract: A fan/pins seat assembly includes a pins seat, an integrated circuit mounted on the pins seat, a finned plate mounted to an upper surface of the integrated circuit and including a plurality fins extending upwardly from an upper side thereof, and a board member mounted to the finned plate and having a fan mounted thereon. The pins seat includes a first engaging member provided thereon, and the board member includes a second engaging member formed thereon for releasably engaging with the first engaging member.
    Type: Grant
    Filed: April 23, 1996
    Date of Patent: March 31, 1998
    Inventor: Chen Fu-in Hong
  • Patent number: 5734561
    Abstract: The invention relates to an assembly rack with two side walls (10, 11) and with honeycomb plates (20) which are arranged between the side walls and connected to transverse profiled rails (15, 16). In such an assembly rack, a reliable shielding against electromagnetic interference should be safeguarded at low cost. This achieved according to the invention in that two transverse profiled rails (15, 16) together with one honeycomb plate and with two lateral profiled rails form an EMI-shielded, self-contained sub-assembly which can be previously assembled, and in that the assembly rack comprises at least two such sub-assemblies (12, 13) which are connected to the side walls with fastening elements in an EMI-shielded manner.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: March 31, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Roland Wolf, Peter Schimpl, Reinhold Seitz
  • Patent number: 5731959
    Abstract: A resistor-printed board built in a flyback transformer for a video display appliance with a reduced size as well as the resistance error of the printed resistors. A focus volume and a screen volume are printed on one surface of the resistor-printed board, and a bleeder resistor is printed on the other surface thereof, so that the size of the resistor-printed board is reduced, and a focus voltage and a screen voltage to be supplied to the appliance are stably adjusted, not affected by the printed error of the bleeder resistor.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: March 24, 1998
    Assignee: LG Electronics Inc.
    Inventor: Seok Hwa Jeong
  • Patent number: 5731955
    Abstract: A spring clip assembly having integral backbone with a plurality of the spring clip members extending from the backbone, each spring clip member having a tapered loop. The loop tapers to an inwardly facing end. If desired, a special insertion tool can be used to provide for a zero insertion force assembly.
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: March 24, 1998
    Assignee: Ford Motor Company
    Inventors: Jon Gordon Bartanen, Michael John Luettgen
  • Patent number: 5731952
    Abstract: A circuit module comprises a circuit board and a circuit element mounted on the circuit board and producing heat in operation. A heat conduction member, put in contact with the circuit element, for receiving the heat of the circuit element is attached to the circuit board. A metallic heat sink is detachably mounted on the heat conduction member. The heat sink comprises a radiation panel put in contact with the heat conduction member and a fan support portion formed integral with the radiation panel. The fan support portion supports a cooling fan for guiding a cooling air to the radiation panel.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: March 24, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keizo Ohgami, Kazuya Shibasaki, Hironori Itoh
  • Patent number: 5728987
    Abstract: The invention is directed to a gravity operated float switch wherein the gravity causes a ball to move within a raceway to contact an operating rod and move it to a position to operate a switch to start or stop the operation of a pump. Cam surfaces are provided on the top surface of the operating arm to move the arm of a contact substrate or a micro switch to an UP or a DOWN position. A novel sealing system comprising a two piece plastic part having a tapered end, and a bushing wrapping the incoming wire and locked within the cover to provide a secure seal for the wire.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: March 17, 1998
    Inventor: Gene H. Utke
  • Patent number: 5729432
    Abstract: A BGA (ball grid array) semiconductor package with improved heat dissipation and dehumidification effect is disclosed. The above BGA package is provided with an open through slot on the chip mounting portion of the printed circuit board and/or the heat sink. The above through slot is occluded by neither the heat conductive epoxy resin nor the solder mask but is simply opened, thus directly exposing the bottom surface of the semiconductor chip to the outside of the package and effectively performing heat dissipation and dehumidification without causing any pop corn phenomenon during the dehumidification reflow. The size of the open through slot is not larger than the semiconductor chip. The open through slot is selected from among a rectangular slot, a large circular slot, a plurality of small circular slots, a radial slot, a cross slot or any combination thereof.
    Type: Grant
    Filed: January 18, 1996
    Date of Patent: March 17, 1998
    Assignees: Anam Industrial Col, Ltd., Amkor Electronics, Inc.
    Inventors: Il Kwon Shim, Young Wook Heo
  • Patent number: 5729433
    Abstract: An assembly for electronic components having heat spreaders on two sides comprises a mother board on which to mount electronic components, having a top side with an array of board contacts. A multiple chip integrated circuit module carries integrated circuits. The multiple chip module consists of a first substrate, such as aluminum, with a multi-layer interconnect structure on one surface of the aluminum substrate. The integrated circuits are mounted on the interconnect structure on the first substrate. A second substrate manufactured using printed wiring board technology, surrounds the first substrate, and includes an interconnect structure and an array of circuit contacts. Conductors connect the interconnect structure on the first substrate with the interconnect structure on the second substrate. A thermally conductive baseplate is coupled with the multiple chip module on the side opposite the array of circuit contacts.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: March 17, 1998
    Assignee: MicroModule Systems, Inc.
    Inventor: Sammy L. Mok
  • Patent number: 5729431
    Abstract: A passive heat sink for use in a portable personal computer includes a thermal mass, such as an aluminum plate, that is adapted to make thermal contact with the CPU or IC, whose temperature is to be regulated. The thermal mass is formed to enable excess heat from the CPU or integrated circuit to be channeled away by thermal conduction from the CPU or IC and dissipated or released in the computer housing, such as the keyboard, which can tolerate limited amounts of heat. In order to accommodate CPU's and IC's of different thicknesses, a thermally conductive spacer, for example, formed from copper, may be secured to the CPU or integrated circuit by way of a thermally conductive adhesive, and, in turn, placed in contact with the thermal mass. With such a configuration, the space requirements for the heat sink within the portable personal computer for cooling are minimized, while the expense of more expensive cooling systems such as heat tubes and Oasis-type cooling systems is obviated.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: March 17, 1998
    Assignee: Packard Bell NEC
    Inventors: Ramesh Marwah, Elisa E. Zappacosta
  • Patent number: 5726858
    Abstract: An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a facing interior side surface portion of the housing. The shielded heat sink assembly includes a resilient block of thermally conductive, high dielectric strength silicon material pressed into contact with a thermally conductive copper heat transfer band wrapped around the housing of the transformer. From its contact area with the copper band the silicon block extends through an opening in a black-colored plastic radiant shield sheet and is adhered to the inner side of a copper heat sink sheet with a thermally conductive adhesive material that also adheres the outer side of the plastic shield sheet to the inner side of the copper heat sink sheet. The outer side of the copper heat sink sheet is adhered to the facing interior side surface portion of the housing with thermally conductive adhesive material.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: March 10, 1998
    Assignee: Compaq Computer Corporation
    Inventors: Darryl K. Smith, Alfred Faust
  • Patent number: 5726857
    Abstract: An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: March 10, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Stephen A. Bowen
  • Patent number: 5725085
    Abstract: An interlock arrangement between a pair of industrial rated circuit breakers in adjoining circuit breaker compartments utilizes a pair of circuit breaker interlock units, one mounted on the rear surface of each circuit breaker. A corresponding pair of compartment interlock units are arranged within the circuit breaker compartments for interaction between the two circuit breaker interlock units to open the contacts within one of the circuit breakers when an attempt is made to electrically connect the circuit breaker within one compartment when the circuit breaker in the adjoining compartment is already electrically connected within the adjoining compartment.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: March 10, 1998
    Assignee: General Electric Company
    Inventors: Raymond K. Seymour, Michael C. Guerrette, William H. Calder, Dennis J. Doughty
  • Patent number: 5724229
    Abstract: A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.
    Type: Grant
    Filed: March 27, 1996
    Date of Patent: March 3, 1998
    Assignee: Unisys Corporation
    Inventors: Jerry Ihor Tustaniwskyi, Leonard Harry Alton, Ronald Jack Kuntz, Ronald Allen Norell