Abstract: A gas-insulated switchgear comprising a gas-insulated first hermetic vessel, at least one electric device selected from a group consisting of an interrupter, a disconnector, a grounding switch and a load switch contained within the hermetic vessel. The switchgear also comprises a cable bushing having a first end that passes through and is secured to a lower vessel wall of the first hermetic vessel and connected to the electric device and a second end that is connectable to a cable, and bus conductor bushings mounted to the hermetic vessel. The switchgear may further comprise a second gas-insulated hermetic vessel disposed between the first vessel and the bus conductor, containing a disconnector or a disconnector and a grounding switch together, and an electrically insulated sealed terminal. The switchgear is compact and inexpensive, free from the damegaes by the explosive phenomenon due to the arc short-circuiting faults.

Abstract: A toggle heat sink clip assembly includes a support base having a first end and a second end opposite the first end. A spring member has a first end and a second end, the first end of the spring member being pivotally attached to the first end of the support base. A rigid handle has a first end and a second end, the first end of the handle being pivotally attached to the second end of the support base. A rigid pivot member has a first end and a second end, the first end of the pivot member being pivotally attached to the second end of the spring member, and the second end of the pivot member being pivotally attached to a mid portion of the handle. The clip is movable to a locked position whereby a heat sink is retained in secured engagement with a microprocessor in a computer chassis.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

Abstract: An electrically shielded housing for an electrical device and method therefor having an insert member disposed in a cavity of a non-conductive housing body member. The insert member includes a conductive inner surface portion disposed adjacent an outer surface portion of the body member cavity. A non-conductive outer surface portion of the insert member forms a housing cavity for receiving an electrical device. The conductive inner surface portion of the insert member at least partially electrically shields the electrical device, and the non-conductive outer surface portion of the insert member insulates the electrical device from the conductive inner surface portion thereof.

Abstract: A data acquisition module (1) includes an interconnection board (15) with several electronic components (3, 18) mounted on at least one side of said board. A protective cover (16) mounted opposite said side covers the electronic components (3, 18). In order to cool notably the module's analog-to-digital converters, a piston 41 connected to the protective cover (16) is pressed by a spring (43) against the upper side of at least one electronic component (3) so as to establish a thermal bridge between said electronic component and said protective cover. The piston is mounted in a piston carrier fastened on the cover (16). The diameter of the portion (410) of the piston (41) that is in contact with the electronic component (3) to be cooled is smaller than the diameter of the portion (411) of the piston that is in contact with the piston carrier (40).

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.

Abstract: A clip (10) includes a first member (12) and a second member (14). The first member includes a spring portion (122), a first leg (126) extending from one end of the spring portion, and a handle (128) extending from an opposite end of the spring portion. The spring portion has flanges (130) extending from opposite sides thereof and folded back thereover for reinforcing the clip. The handle defines a cutout (134) including a receiving section (136) and a locking section (138). The second member includes a connect portion (144) forming a plurality of teeth (148) on opposite edges thereof, and a second leg (142). The connect portion is received in the receiving section and engages in the locking section. A slot (146) in the connect portion facilitates elastic deformation. The effective length of the second member is adjustable according to the particular teeth selected to engage in the locking section.

Abstract: A circuit panel chassis having a plurality of angled slots in a top surface thereof. The angled slots improving flame containment inside the circuit panel chassis while providing for cooling the circuit components of the circuit panel.

Abstract: The present invention is a power distribution assembly for distributing power about a rack mounted server system. In particular, each chassis of a rack mounted server system is provided power through a power distribution assembly that is hinged to a back of the rack of the server system. Each of the power distribution assemblies may be in either an open position or a closed position. In a closed position, each of the power distribution assemblies is rotated to lie very close to a backplane board of a chassis of the server system. In an open position, each of the power distribution assemblies is swung around so that full access may be had to the backplane boards of the chassis in the server system.

Abstract: The electronic apparatus comprises a housing including a heat generating component and a heat sink. The housing can be displaced between a first usage form in which a ventilation port is set maintained in a standard opening shape and a second usage form in which the ventilation port is expanded to be larger than the standard opening shape. The heat sink has a plurality of heat radiation fins. The heat radiation range of the heat radiation fins expands when the housing is displaced from the first usage form to the second usage form and is reduced when the housing is displaced from the second usage form to the first usage form.

Abstract: A heat-dissipating assembly for removing a portion of heat from a heat-generating device is provided. The heat-dissipating assembly includes a heat sink having a base in contact with a surface of the heat-generating device and a plurality of fins extending upwards from the base, and a first fan and a second fan respectively disposed on a first position and a second position of the heat sink, the first fan and the second fan being hot-swappable, wherein the portion of heat is conducted from the heat-generating device to the fins via the base, and further removed by a first action of the first fan and a second action of the second fan.

Abstract: A system and method for blind-mateably electrically connecting a 1 U industrial personal computer with an industrial PC receiving bay in a rack, where the 1 U industrial personal computer has a first dedicated blind-mateable connector for standard equipment disposed on a bracket at the back end of an industrial PC and a second dedicated blind mateable connector for use with a later added expansion card, where the connectors are coupled to circuitry in the 1U industrial personal computer via jumper cables.

Abstract: A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.

Abstract: The present invention relates to an electronic assembly that includes an integrated circuit package, a heat sink, and a fastener which connects the heat sink to the integrated circuit package to cool the integrated circuit package. The fastener includes a stem that extends through the heat sink and the integrated circuit package. The fastener further includes a clamp that is connected to one end of the stem and a spring head that is connected to an opposing end of the stem. The spring head includes a first biasing member that extends around the longitudinal axis of the stem to compress the heat sink and the integrated circuit package against the clamp in order to reduce the thermal impedance between the heat sink and the integrated circuit package.

Abstract: A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50° C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.

Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.

Abstract: Improved housings for computing devices are disclosed. One improvement pertains to a multi-axis ventilation system. Another improvement pertains to a push button latch for a portable computer. Still another improvement pertains to a media bay ejection system provided with a dampener. These improvements can be provided separately or in any combination in a given computing device.

Abstract: Disclosed is a method and apparatus to increase convection heat transfer in an electrical system. The increase in convection heat transfer is achieved by applying a heat source in the vicinity of an electronic element. This effectively increases the amount of airflow across the electronic element.