Patents Examined by Gregory E. Webb
  • Patent number: 11180716
    Abstract: A cleaning formulation has from 10 to 99 wt % water, from 0.8 to 40 wt % surfactant, optionally other additives, and from 0.2 to 20 wt % of a solvent additive of formula (I): R1—O-(AO)n—C(?O)—R2??(I) where R1 is C3 to C12 alkyl, AO is an alkylene oxide group selected from an ethylene oxide group, a propylene oxide group and a butylene oxide group. At least one AO group in the solvent additive is an ethylene oxide group. The solvent additive has a water solubility of less than 1 wt % in deionised water at 20° C. and the surfactant enables the solvent additive to dissolve and/or disperse in the cleaning formulation. In a method of cleaning an oily or waxy soil from a hard surface, the solvent additive is applied to the hard surface and optionally rinsed with water. The solvent additive is used in a cleaning formulation to improve the percentage soil removal.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: November 23, 2021
    Assignee: Croda, Inc.
    Inventors: Bingham Scott Jaynes, Xin Chen, Li Chen, Mei-Ly Chua, Joseph William Scheblein, Gregory Howard Smith
  • Patent number: 11180719
    Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: November 23, 2021
    Assignee: BASF SE
    Inventors: Daniel Loeffler, Mei Chin Shen, Sheng Hsuan Wei, Frank Pirrung, Lothar Engelbrecht, Yeni Burk, Andreas Klipp, Marcel Brill, Szilard Csihony
  • Patent number: 11168288
    Abstract: The present invention relates to a remover composition comprising, tetraalkylammonium hydroxide, a benzylic alcohol, a glycol component comprising at least one glycol compound, and a and an alkyl amine component, wherein said alkyl amine component is selected from the group consisting of a dialkyl amine, a mono-alkyl amine having structure having structure (I), and combinations thereof wherein, in said di-alkyl amine, one of the alkyl groups is a C-1 to C-4 n-alkyl and the other alkyl group is a C-16 to C-20 n-alkyl, and for said mono-alkyl amine m? and m are independently chosen from an integer ranging from 4 to 8. This invention also pertains to the process of using these compositions to remove a patterned photoresist from a substrate.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: November 9, 2021
    Assignee: Merck Patent GmbH
    Inventor: Hengpeng Wu
  • Patent number: 11149231
    Abstract: A cleaning liquid containing at least one surfactant (A) selected from the group consisting of a polyoxyalkylene alkyl ether phosphoric acid, a polyoxyalkylene alkyl ether acetic acid and a polyoxyalkylene alkyl ether sulfonic acid and a chelating agent (C), which has a pH of 8 or more, and a cleaning liquid containing an oxidizing agent (B) and a chelating agent (C), which has a pH of 8 or more.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: October 19, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Ken Harada, Yutaro Takeshita, Toshiaki Shibata, Kan Takeshita
  • Patent number: 11149235
    Abstract: A cleaning composition and process for cleaning an in-process microelectronic device substrate, e.g., by post-chemical mechanical polishing (CMP) cleaning, to remove residue from a surface thereof, wherein the cleaning composition may be especially effective for cleaning a substrate surface that includes exposed metal such as cobalt, copper, or both, along with dielectric or low k dielectric material, and wherein the cleaning composition includes corrosion inhibitor to inhibit corrosion of the exposed metal.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 19, 2021
    Assignee: Entegris, Inc.
    Inventors: Daniela White, Elizabeth Thomas, Jun Liu, Michael White, Chao-Yu Wang, Donald Frye
  • Patent number: 11131933
    Abstract: A metal resist cleaning liquid including a solvent and formic acid.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: September 28, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Tomoya Kumagai, Takahiro Akiyoshi
  • Patent number: 11131932
    Abstract: A cleaning liquid usable for cleaning a substrate provided with a metal resist, the cleaning liquid including a solvent, an organic acid, and a compound (A) represented by general formula (a-1) shown below (in the formula, Ra1 and Ra2 each independently represents an alkyl group having 1 to 3 carbon atoms).
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: September 28, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Tomoya Kumagai, Takahiro Akiyoshi
  • Patent number: 11130931
    Abstract: A composition and a method for clearing tissue for subsequent three-dimensional analysis. The clearing composition comprises: (1) a homogenizing agent such as N-methylglucamine, urea, or ethylenediamine; (2) a cytoplasmic, water-soluble refractive index adjusting agent such as iohexol, sodium thiosulfate, or polyethylene glycol; and (3) a membrane, lipid-soluble RI adjusting agent such as 2,2?-thiodiethanol (TDE) or propylene glycol. The tissue clearing composition is particularly suitable for use with long-term fixed human tissues.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 28, 2021
    Assignee: THE UNIVERSITY OF HONG KONG
    Inventors: Hei Ming Lai, Wutian Wu
  • Patent number: 11124745
    Abstract: A composition for use in cleaning metal components having Hansen Solubility Parameters for the composition of ?D?15, ?P<6, and ?H from about 5.5 to about 6.9. The composition includes a blend of organic solvents, none of which are classified as a volatile organic compound, a hazardous air pollutant, or a potential carcinogen, or exhibit a vapor pressure of less than 0.1 mmHg at 20° C. Further, the blend of organic solvents includes a halogenated aromatic solvent having one or more halide groups and from 6 to 8 carbon atoms, an organic solvent having one or more ester functional group and from 3 to 9 carbon atoms, and one or more of a linear or branched hydrocarbon solvent with 6-12 carbon atoms with a single polar moiety head group or a solvent containing one or more ketone functional groups and from 2 to 5 carbon atoms.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 21, 2021
    Assignee: VALVOLINE LICENSING AND INTELLECTUAL PROPERTY LLC
    Inventor: Jacob Bonta
  • Patent number: 11124741
    Abstract: The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 21, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Atanu K. Das, Michael White, Daniela White
  • Patent number: 11124746
    Abstract: The disclosure generally relates to a composition and process for cleaning residue and/or contaminants from microelectronic devices having said residue and contaminants thereon. The residue may include post-CMP, post-etch, and/or post-ash residue. The compositions and methods are particularly advantageous when cleaning a microelectronic surface comprising copper, low-k dielectric materials, and barrier materials comprising at least one of tantalum-containing material, cobalt-containing material, tantalum-containing, tungsten-containing, and ruthenium-containing material.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: September 21, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Daniela White, Michael White, Jun Liu, Elizabeth Thomas
  • Patent number: 11124740
    Abstract: A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: September 21, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Atanu K. Das, Michael White, Daniela White
  • Patent number: 11119410
    Abstract: A metal resist cleaning liquid including a solvent, an organic acid, and a compound (B) represented by general formula (b-1) shown below (In the formula, Rb1 and Rb2 each independently represents an alkyl group having 1 to 3 carbon atoms; Rb3 and Rb4 each independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; Yb1 represents a single bond, —O—, —S— or —N(Rb5)—; Rb5 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; Yb2 represents —O—, —S— or —N(Rb6)—; Rb6 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; and n represents an integer of 0 to 3).
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: September 14, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Tomoya Kumagai, Takahiro Akiyoshi
  • Patent number: 11104865
    Abstract: The invention is in the field of hard surface cleaning compositions. There is need for compositions that foam copiously during the washing/cleaning stage. However, during the rinse stage, the foam should rinse-off as quickly as possible in minimum number of rinses-cycles so that the process becomes sustainable. Disclosed is an aqueous cleaning composition, having a pH of 6.5 or lower, comprising (i) 3.0 to 25.0% by weight alkyl ethoxy sulphate; (ii) 1.0 to 5.0% by weight amphoteric surfactant; (iii) 0.1 to 1.0% by weight fatty acids being saturated non-hydroxy C8-12 fatty acid and a saturated non-hydroxy C14-18 fatty acid, where ratio of amount of said C8-12 fatty acid to that of said C14-18 fatty acid is from 1:0.1 to 1:10 parts by weight; and (iv) 0.5 to 5% by weight non-ionic surfactant, wherein (iii) and (iv) together an antifoaming system, and wherein amount of non-alkoxylated anionic surfactant in said composition in less than 1.0% by weight.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: August 31, 2021
    Assignee: Conopeo, Inc.
    Inventors: Punam Bandyopadhyay, Maheshwara Shiva Naik
  • Patent number: 11092895
    Abstract: The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: August 17, 2021
    Assignee: LTC Co., Ltd.
    Inventors: Hosung Choi, Kyusang Kim, Jongil Bae, Jongsoon Lee, Sangku Ha, Yunmo Yang
  • Patent number: 11085011
    Abstract: The invention provides a removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: August 10, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Elizabeth Thomas, Michael White, Daniela White, Atanu Kumar Das
  • Patent number: 11078447
    Abstract: A multi-purpose surface cleaning solution includes sodium percarbonate having a chemical formula of 2Na2CO3.3H2O2 that may be selectively provided in a range of concentrations, from 0.001% through 99.997%. In an aqueous solution, sodium percarbonate decomposes and yields soda ash [Na2CO3] and hydrogen peroxide [H2O2], with additional decomposition of hydrogen peroxide to water [H2O] and diatomic oxygen [O2]. The combination of soda ash, hydrogen peroxide, and diatomic oxygen chemically weaken and release the bonds of the contaminants from the surface(s) to which the contaminants have become attached.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: August 3, 2021
    Inventor: W. Curt Brandau
  • Patent number: 11078451
    Abstract: The present disclosure relates to water-soluble unit dose articles made from a combination of chemically different water-soluble films and containing household care compositions that are at least partially enclosed by the water-soluble films in at least one compartment.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: August 3, 2021
    Assignee: The Procter & Gamble Company
    Inventors: Florence Catherine Courchay, Regine Labeque, Steven George Friedrich, David M Lee, Shinsuke Nii, Lee Kon Yeung, Thomas J Yogan, Marc Rene Bert Renmans
  • Patent number: 11072767
    Abstract: A treatment liquid for a semiconductor device is a treatment liquid including water, an organic solvent, and two or more nitrogen-containing aromatic heterocyclic compounds.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: July 27, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Tomonori Takahashi, Tetsuya Kamimura
  • Patent number: 11066627
    Abstract: According to the present invention, there is provided a cleaning agent composition for a semiconductor device substrate including at least one of wiring and an electrode in which the wiring and the electrode contain cobalt or a cobalt alloy, the cleaning agent composition including a component (A): at least one compound selected from the group consisting of specific compounds; and a component (B): water.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 20, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tomohiro Kusano, Ken Harada, Yasuhiro Kawase