Abstract: A composition for stripping a color filter and a color filter regeneration method are provided. A composition for stripping the color filter according to an exemplary embodiment of the present invention includes glycol and potassium hydroxide (KOH), in which either (a) the concentration of the glycol is in the range of 83 wt % to 91 wt % and of the concentration of the potassium hydroxide satisfies the condition: (wt % of KOH)?6?(0.065*(wt % of the glycol)), or (b) the concentration of glycol is more than 91 wt % and the concentration of potassium hydroxide (KOH) is more than 0.2 wt %.

Abstract: The softener composition of the present invention comprises a compound having one or more C8-36 hydrocarbon groups and two or more groups selected from an amino group and a quaternary ammonium group in the molecule (component (a)), an anionic surfactant having a C8-36 hydrocarbon group (component (b)) and a nonionic surfactant (component (c)), wherein the molar ratio of the component (a) to the component (b) is from 90/10 to 50/50. This softener composition can endow cotton and cotton clothes in particular with a preferred softness, elasticity (fluffy feeling) and feeling of dryness with small oiliness.

Abstract: An object of the present invention is to provide washing liquid for semiconductor substrate capable of removing grinding grains of silica, alumina or the like in a polishing agent and polishing trashes of copper, and capable of leaving little organic substance due to an additive used for preventing corrosion of copper on the surface of a copper wiring after washing, while corrosion of copper is suppressed, and a method of producing a semiconductor device using this washing liquid. The object is achieved by washing liquid for a semiconductor substrate having a copper wiring, comprising a basic compound and at least one selected from the group consisting of sugar alcohols and saccharides.

Abstract: The present invention relates to contact lens care product comprising dexpanthenol. The invention similarly relates to the usage of a contact lens care compositions of this kind for cleaning and optionally disinfecting contact lenses.

Abstract: The photoresist stripping composition of the present invention contains at least one oxymethylamine compound represented by the following formula 1: wherein R1 to R3 are as defined in the specification. Of the oxymethylamine compound of the formula 1, the compound represented by the following formula 7: wherein R2 to R5 and n are as defined in the specification, is a novel compound.

Abstract: Azeotrope-like compositions comprising hexafluoropropylene dimer and a hydrocarbon or a hydrofluorocarbon, and uses thereof, are described.

Abstract: The present invention provides an O/W emulsion composition containing an electrolyte. More particularly, the invention provides an O/W emulsion composition excellent in emulsion stability despite its electrolyte content. The O/W emulsion composition of the invention can be prepared using an electrolyte, a polyglycerin fatty acid ester, an alkanoyl lactylic acid or the salt thereof, an acrylic acid-alkyl methacrylate copolymer, water, an oil, and preferably a polyhydric alcohol.

Abstract: Cleaning solutions for integrated circuit devices and methods of cleaning integrated circuit devices using the same are disclosed. The cleaning solution includes about 30% aqueous ammonia solution, acetic acid by a volume percent higher then a volume percent of the aqueous ammonia solution, and deionized water by a volume percent higher then the volume percent of the acetic acid. Additionally, disclosed are methods wherein the cleaning solution is formed on integrated circuit substrates having an exposed metal pattern formed thereon, and further providing mega-sonic energy to the film of the cleaning solution.

Abstract: The present invention is a photoresist remover composition used in order to remove photoresist during the manufacturing process of semiconductor devices, such as large-scale integrated circuits and very large-scale integrated circuits. The present invention comprises 2˜20 weight % of water-soluble hydroxylamine, 5˜15 weight % of oxime compound containing 2 or 3 hydroxyl groups, and 30˜55 weight % of alkyl amide. The photoresist remover composition according to the present invention can easily and quickly remove a photoresist layer that is cured by the processes of hard-bake, dry-etching, and ashing and a side-wall photoresist polymer that is produced from the lower metal film by the reaction of the photoresist with etching and ashing gases during these processes. Especially, the photoresist remover composition has a good property of removing the side-wall photoresist polymer produced from the layers of aluminum, aluminum alloy, and titanium nitride.

Abstract: The present invention provides an improved scale conditioning composition and method that results in improved dissolution and disruption of tube scale, hardened sludge and other deposits composed primarily of highly densified magnetite such as those found in heat exchange vessels. After treatment with the advanced scale conditioning composition, these magnetite rich deposits are more easily removed using known and commercially available high pressure hydro-mechanical cleaning techniques. The present invention further provides effective cleaning in a short period of time and at relatively low temperatures, while reducing the amount of waste produced and reducing the resulting corrosion of carbon and low alloy steel components within the steam generator during the cleaning process.

Abstract: A process for removing contaminants from the surface of a substrate comprises contacting the substrate with a cleaning composition comprising at least one mono-, di-, or trialkoxy-substituted perfluoroalkane, perfluorocycloalkane, perfluorocycloalkyl-containing perfluoroalkane, or perfluorocycloalkylene-containing perfluoroalkane compound, the compound optionally containing additional catenary heteroatoms. The compounds exhibit good solvency properties while being environmentally acceptable.

Abstract: A cleaning agent which comprises 0.1 to 60% by weight of an oxidizing agent and 0.0001 to 5% by weight of a chelating agent. In the process for producing semiconductor integrated circuits, a pattern layer of a photoresist used as an etching mask and residues formed from the photoresist by dry etching can be easily removed with the cleaning agent. In the process for producing substrates for liquid crystal display panels, residues derived from a conductive thin film formed by dry etching can also be easily removed. In the cleaning processes using the cleaning agent, wiring materials or insulating materials in thin film circuit devices or other materials used for producing substrates of semiconductor integrated circuits and liquid crystal panels are not corroded.

Abstract: Disclosed are azeotrope-like compositions comprising 1,1,1,3,3-pentafluorobutane, water and a hydrocarbon selected from the group consisting of n-pentane, isopentane, cyclopentane, n-hexane, and isohexane., said compositions are environmentally desirable for use as refrigerants, aerosol propellants, metered dose inhalers, blowing agents for polymer foam, heat transfer media, and gaseous dielectrics.

Abstract: The invention relates to a method for increasing the efficiency of surfactants and to a method for suppressing lamellar mesophases in microemulsions. Additive block co-polymers with a water-soluble block A and a water-insoluble part B are added to the surfactants. The efficiency of surfactants can be in-creased to a substantial extent by using said compounds as additives. The formation of undesirable lamellar mesophases in microemulsions is suppressed by adding said block co-polymers.

Abstract: A method of washing dishware/tableware in an automatic dishwashing machine having a single or multi-compartment product dispenser which is normally closed and sealed after charging the machine and prior to delivery of the dishwashing product into the wash liquor and wherein the dishwashing product comprises one or more dishwashing compositions in a unit dose form having a degree of deformability greater than about 10% and a shape and size such that the dishwashing product occupies more than about 60%, preferably more than about 85% of the volume of the corresponding compartment of the product dispenser in its closed state. The method allows for optimum delivery of active components across different washing machine types.

Abstract: Tertiary-butyl acetate does not produce vapors which are considered as hazardous or polluting as those of other common organic solvents. Accordingly, the present invention discloses a general purpose cleaning composition that is formed by emulsifying t-butyl acetate with water. In another embodiment of the present invention, a general purpose cleaning composition is formed by mixing t-butyl acetate with more traditional solvents. The present invention also discloses liquid compositions for direct use in cleaning metals, processes for preparing such liquid compositions, and processes for cleaning metal and/or plastic surfaces with a composition according to the invention.

Abstract: A solution capable of removing adherent organic material from the surface of a solid substrate at room temperature. The solution includes a first solvent, preferably water, having dissolved therein: up to 2% alkali metal silicates, a source of alkalinity that is substantially free of alkali metal hydroxide ions, an organic solvent, and an amount of hydrotrope effective to render the organic solvent or solvents soluble in the solution, an amino alcohol may be included, at least one surfactant, and a corrosion inhibitor may be included. The solution should have an alkaline pH less than about 12. The solution is used to remove the adherent organic material by soaking the object having such material thereon in such a solution, preferably at room temperature.

Abstract: An apparatus for feeding slurry to an external device. The apparatus includes a preparation tank for preparing the slurry. A circulation pipe is connected to the preparation tank to circulate the slurry. A feeding pipe is connected between the preparation tank and the external device to feed the external device with the slurry. A pump sends the chemical solution in the preparation tank to the circulation pipe and the feeding pipe. A concentration detector is arranged downstream to the pump to detect the concentration of the slurry. A controller controls the concentration of the chemical solution in the preparation tank in accordance with the detection value of the concentration detector and controls the feeding of the chemical solution.

Abstract: A semiconductor wafer cleaning formulation, including 2-98% wt. organic amine, 0-50% wt. water, 0.1-60% wt. 1,3-dicarbonyl compound chelating agent, 0-25% wt. of additional different chelating agent(s), 0.5-40% wt. nitrogen-containing carboxylic acid or an imine, and 2-98% wt polar organic solvent. The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.

Abstract: This invention relates to improved stabilizing compositions for n-propyl bromide. More particularly, the cleaning composition includes about 0.1 to 5% Butylene oxide, about 0.1 to 5.0% t-butanol, about 0.1 to 5% acetonitrile, about 0.1 to 5% nitromethane; and the remainder n-propyl bromide. These mixtures are useful as cleaning solvents for the electronic, aerospace, and general manufacturing industries, especially in the area of vapor degreasing.