Patents Examined by Gregory E. Webb
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Patent number: 11955353Abstract: A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 ?m or more and 0.25 ?m or less.Type: GrantFiled: October 30, 2019Date of Patent: April 9, 2024Assignee: KELK Ltd.Inventors: Atsushi Kobayashi, Hideaki Ohkubo
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Patent number: 11912960Abstract: Surfactant systems and compositions incorporating the same are disclosed for use as rinse aids on plastics and other wares. The surfactant systems and compositions include both liquid and solid formulations, along with methods of use for treating plastics and other wares. The surfactant systems and compositions provide synergistic combinations allowing lower actives in composition formulations of the plastic-compatible surfactant systems providing good sheeting, wetting and drying properties.Type: GrantFiled: November 5, 2021Date of Patent: February 27, 2024Assignee: Ecolab USA Inc.Inventors: Janel Marie Kieffer, Terrence P. Everson, James S. Dailey, Thomas Gessner, Juergen Tropsch
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Patent number: 11908720Abstract: Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.Type: GrantFiled: September 26, 2019Date of Patent: February 20, 2024Assignee: HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.Inventors: Linghan Shen, EdwardLiCang Lee
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Patent number: 11905499Abstract: Provided is a high-purity isopropyl alcohol in which the concentration of a C7-12 acetal compound is 100 ppb or less on a mass basis, the concentration of the acetal compound in an accelerated test involving heating for 4 hours at 80° C. in a nitrogen atmosphere is increased by a factor of 30 or less with respect to the value thereof prior to heating, and the concentration of the acetal compound is maintained at a value of 100 ppb or less on a mass basis. Also provided is a method for manufacturing said high-purity isopropyl alcohol.Type: GrantFiled: September 30, 2019Date of Patent: February 20, 2024Assignee: TOKUYAMA CORPORATIONInventors: Shunsuke Hosaka, Masanari Ishizuki
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Patent number: 11905491Abstract: In general, the invention provides high pH cleaning compositions for dielectric surfaces such as PETEOS, SiO2, thermal oxide, silicon nitride, silicon, etc. The compositions of the invention afford superior surface wetting, dispersion of particles and organic residues, and prevents redeposition and re-agglomeration of the dispersed residue during cleaning to afford superior cleaning and low defectivity.Type: GrantFiled: October 1, 2021Date of Patent: February 20, 2024Assignee: ENTEGRIS, INC.Inventors: Daniela White, YoungMin Kim, Michael L. White
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Patent number: 11905490Abstract: An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.Type: GrantFiled: September 19, 2019Date of Patent: February 20, 2024Assignee: Kanto Kagaku Kabushiki KaishaInventor: Areji Takanaka
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Patent number: 11898123Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one chelating agent, the chelating agent being a polyaminopolycarboxylic acid; 3) at least one corrosion inhibitor, the corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one sulfonic acid; and 5) water.Type: GrantFiled: August 27, 2021Date of Patent: February 13, 2024Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Emil A. Kneer, Thomas Dory, Atsushi Mizutani
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Patent number: 11884900Abstract: The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.Type: GrantFiled: August 25, 2021Date of Patent: January 30, 2024Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Zachary L. Schaefer, Eric Turner, Carl Ballesteros
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Patent number: 11866676Abstract: A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1). (in formula (1), R101 represents a C1 to C6 alkyl group, and R102 represents a C1 to C6 alkylene group.Type: GrantFiled: February 14, 2020Date of Patent: January 9, 2024Assignee: NISSAN CHEMICAL CORPORATIONInventors: Hiroshi Ogino, Tetsuya Shinjo, Ryo Karasawa, Takahisa Okuno
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Patent number: 11859152Abstract: To provide a substrate pattern filling composition capable of suppressing pattern collapse and a method for using the same. A substrate pattern filling composition comprising a first solute (A), a second a solute (B) and a solvent (C), and a method for using the same.Type: GrantFiled: April 15, 2020Date of Patent: January 2, 2024Assignee: Merck Patent GmbHInventors: Yuko Horiba, Hiroko Kuboki, Tatsuro Nagahara
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Patent number: 11851638Abstract: Provided is a means capable of sufficiently removing organic residues on the surface of an object to be polished after polishing. A surface treatment composition includes a polymer having a building block represented by Formula (1) in [Chemical Formula 1], a chelating agent, and water and is used to treat the surface of an object to be polished after polishing, and the chelating agent has at least one of a phosphonic acid group and a carboxylic acid group. In Formula (1), R1 is a hydrocarbon group having 1 to 5 carbon atoms; and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.Type: GrantFiled: August 3, 2021Date of Patent: December 26, 2023Assignee: FUJIMI INCORPORATEDInventors: Tsutomu Yoshino, Sonosuke Ishiguro
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Patent number: 11845912Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.Type: GrantFiled: August 7, 2019Date of Patent: December 19, 2023Assignee: KCTECH CO., LTD.Inventors: Ga Young Jung, Yong Ho Jeong, Kun Hee Park, Young Gon Kim, Young Ho Yoon, Young Lok Yoon
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Patent number: 11820965Abstract: An aqueous cleaner composition providing good lubricity for obtaining superior cleaning and anti-streaking results on hard surfaces such as glass and stainless steel as well as plastic windows and the like. The cleaner composition includes water, isopropyl alcohol, droplets of polydimethylsiloxane dispersed within the cleaner composition for creating a lubricated surface. According to one implementation, sodium dodecyl sulfate is the surfactant which assists in soil removal. Essential oils can be added for fragrance, and colorants added for visual appearance.Type: GrantFiled: May 8, 2023Date of Patent: November 21, 2023Inventors: Alan Lembit Randmae, Rein S Randmae
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Patent number: 11814603Abstract: The present invention is a liquid detergent composition for tableware and/or kitchen hard articles containing: (a) a nonionic surfactant with an HLB of 10.5 or less; (b) a surfactant selected from amine oxide-type surfactants, amphoteric surfactants, and nonionic surfactants with an HLB of 11 or more; and (c) an organic solvent with a log Pow of 0 or more and 1.5 or less, wherein a proportion of component (a) in all surfactants is 30 mass % or more and 85 mass % or less, a mass ratio of the content of (c) to the content of (a), (c)/(a), is 1 or more and 10 or less, and a viscosity at 20° C. is 20 mPa·s or less.Type: GrantFiled: June 3, 2019Date of Patent: November 14, 2023Assignee: KAO CORPORATIONInventor: Kenji Hozumi
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Patent number: 11817309Abstract: Provided are: a method of producing heated ozone water, the method capable of producing heated ozone water having an extremely high ozone concentration by suppressing a reduction in the ozone concentration in high-concentration heated ozone water; heated ozone water; and a semiconductor wafer-cleaning liquid using the heated ozone water. A method of producing heated ozone water obtained by dissolving ozone in pure water, the method being characterized by including: adjusting a pH of the pure water to 3 or less by adding acid to the pure water; to obtain an acid water, dissolving an ozone gas in the acid water; and heating the pure water, the acid water or the ozone water, to 60° C. or more.Type: GrantFiled: October 23, 2020Date of Patent: November 14, 2023Assignees: TOHOKU UNIVERSITY, NOMURA MICRO SCIENCE CO., LTD.Inventors: Yasuyuki Shirai, Takeshi Sakai, Takayuki Jizaimaru
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Patent number: 11807836Abstract: Provided is a high-purity isopropyl alcohol in which the concentration of a C7-12 acetal compound is 100 ppb or less on a mass basis, the concentration of the acetal compound in an accelerated test involving heating for 4 hours at 80° C. in a nitrogen atmosphere is increased by a factor of 30 or less with respect to the value thereof prior to heating, and the concentration of the acetal compound is maintained at a value of 100 ppb or less on a mass basis. Also provided is a method for manufacturing said high-purity isopropyl alcohol.Type: GrantFiled: September 30, 2019Date of Patent: November 7, 2023Assignee: TOKUYAMA CORPORATIONInventors: Shunsuke Hosaka, Masanari Ishizuki
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Patent number: 11807837Abstract: Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.Type: GrantFiled: September 26, 2019Date of Patent: November 7, 2023Assignee: Resonac CorporationInventors: Susumu Nakazaki, Kuniaki Miyahara, Tomoyuki Fukuyo
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Patent number: 11807832Abstract: The present invention is a liquid detergent composition for tableware and/or kitchen hard articles containing: (a) a nonionic surfactant with an HLB of 10.5 or less (provided that (b) is excluded); (b) a glycoside having a hydrocarbon group with 8 or more and 18 or less carbons and a glycoside group with an average degree of condensation of 0.5 or more and 3 or less; and (c) an organic solvent with a logPow of 0 or more and 1.5 or less [hereinafter, referred to as component (c)], wherein the content of (a) in all surfactants is 30 mass % or more and 95 mass % or less, a mass ratio of component (c) to the content of (a), (c)/(a), is 2 or more and 8 or less, and a viscosity at 20° C. is 20 mPa·s or less.Type: GrantFiled: June 3, 2019Date of Patent: November 7, 2023Assignee: KAO CORPORATIONInventor: Kenji Hozumi
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Patent number: 11788036Abstract: A composition for use in cleaning metal components having Hansen Solubility Parameters for the composition of ?D?15, ?P<6, and ?H from about 5.5 to about 6.9. The composition includes a blend of organic solvents, none of which are classified as a volatile organic compound, a hazardous air pollutant, or a potential carcinogen, or exhibit a vapor pressure of less than 0.1 mmHg at 20° C. Further, the blend of organic solvents includes a halogenated aromatic solvent having one or more halide groups and from 6 to 8 carbon atoms, an organic solvent having one or more ester functional group and from 3 to 9 carbon atoms, and one or more of a linear or branched hydrocarbon solvent with 6-12 carbon atoms with a single polar moiety head group or a solvent containing one or more ketone functional groups and from 2 to 5 carbon atoms.Type: GrantFiled: August 17, 2021Date of Patent: October 17, 2023Assignee: VGP IPCO LLCInventor: Jacob Bonta
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Patent number: 11773352Abstract: A composition including a compound having structural formula (I): Rf is a linear or branched perfluoroalkyl group having 1-3 atoms; n is 0-2; x is 1-3; and Rf? and Rf? are (i) independently, a linear or branched perfluoroalkyl group having 1-8 carbon atoms; or (ii) are bonded together to form a ring structure having 4-8 carbon atoms. The composition further includes a hydrocarbon contaminant.Type: GrantFiled: December 20, 2019Date of Patent: October 3, 2023Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Sean M. Smith, Michael J. Bulinski, Michael G. Costello, Forrest A. Coughlin, Hui Ren, Zai-Ming Qiu