Abstract: To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).

Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH2; and 3) at least one aminoalcohol.

Abstract: Disclosed are antimicrobial sacrificial floor coatings systems including an antimicrobial sacrificial floor coating composition capable of reducing and/or preventing gram positive and gram negative bacterial growth on floors. Also disclosed is an antimicrobial sacrificial floor coating remover being readily capable of removing the antimicrobial sacrificial floor coating as desired from previously treated flooring surfaces. In certain aspects, the antimicrobial sacrificial floor coatings can include a nonionic acrylic polymer; a nonionic wax; and a cationic alkyl biguanide or salt thereof. The antimicrobial sacrificial floor coating may further include a cationic wax that further stabilizes the system during storage, application, and/or post-application to a floor surface.

Abstract: The present invention provides a detergent composition for removing heavy metals and formaldehyde, comprising at least one selected from the group consisting of trientine or trientine derivative of Formula (1), cyclen or cyclen derivative of Formula (2), cyclam or cyclam derivative of Formula (3), and a salt thereof.

Abstract: Cleaning compositions that include a non-functionalized alkyl polyglycoside, a nonionic surfactant system, and water. In certain embodiments, the cleaning compositions are substantially free of alkyl phenol ethoxylates. Additionally, some embodiments of the invention are substantially free of butyl cellosolve. The cleaning composition is capable of removing both proteinaceous food soils and hydrocarbon-based oily soils. The cleaning compositions include a biorenewable, environmentally friendly alternative to nonyl phenol ethoxylates and exhibit superior cleaning of food soils.

Abstract: A one-step method of cleaning a girth gear set of a mill in preparation for inspection is provided, the method comprising: substantially emptying the mill; inching the gear; spraying a low, very low or non-Volatile Organic Compound (VOC) cleaning formulation at high pressure onto the gear, the cleaning formulation comprising a non-VOC aliphatic hydrocarbon solvent, an extreme pressure lubricant, a fretting wear lubricant, a non-ionic surfactant, and a mixture of non-VOC unsaturated fatty alcohols; and continuing to spray the low or very low VOC cleaning formulation on the gear for sufficient time for the formulation to clean the gear, thereby providing a so cleaned gear.

Abstract: Disclosed herein is a cleaning composition for facilitating cleaning surfaces of an object, in accordance with some embodiments. Accordingly, the cleaning composition may include carbanions and a diluting agent. Further, a carbanion of the carbanions may include a carbon atom. Further, the carbon atom may include a formal charge of ?1. Further, the diluting agent may be capable of combining with the carbanions for forming at least one appliable form of the cleaning composition. Further, a ratio of the diluting agent to the carbanions by volume may be 64:1. Further, the combining facilitates applying of the at least one appliable form of the cleaning composition to at least one surface of the object. Further, the applying of the at least one appliable form of the cleaning composition cleans at least one contaminant present on the at least one surface of the object.

Abstract: A bleach activator/complexing agent compound and multi-phase washing and cleaning agents including at least one liquid, low-water to water-free phase and at least one solid, pulverous or granular phase and containing at least one bleach activator, which is compounded with at least one complexing agent. Also disclosed are methods of using such agents in washing and cleaning.

Abstract: A thinner composition is capable of reducing the amount of photoresist used in a reducing resist consumption (RRC) coating process, an edge bead removed (EBR) process or the like, and removing unnecessary photoresist on an edge portion or a backside portion of the wafer. The thinner composition includes C1-C10 alkyl C1-C10 alkoxy propionate, propylene glycol C1-C10 alkyl ether, and propylene glycol C1-C10 alkyl ether acetate.

Abstract: Compositions and methods for cleaning surfaces, such as for removing residues or other coatings from molds and other industrial parts, such compositions comprising, for example, a first solvent comprising a pyrrolidone such as 2-pyrrolidone, 1-(2-hydroxyethyl)-2-pyrrolidone, or mixture thereof; and a second solvent selected from the group consisting of an imidazole (such as 1,2-dimethylimidizole), an alkylene glycol ether (such as ethylene glycol monobutyl ether or diethylene glycol monobutyl ether, a terpene (such as d-limonene), and mixtures thereof. In various embodiments, such methods are for removing residues from molds used in forming polyurethane parts, wherein residues comprise polyurethane, urethane reactants, and mold release agents. The compositions may be substantially free of 1-methyl-2-pyrrolidone and of 1-ethyl-2-pyrrolidone.

Abstract: The present invention relates to a cleaning and/or rinsing agent molded article (1, 1?, 1?) which is formed as a roller with a roll surface (2) and comprises two end faces (3, 4) connected by the roll surface (2). The cleaning and/or rinsing agent molded article (1, 1?, 1?) comprises an end face portion (5, 6) on at least one of the two end faces (3, 4), which is designed so that the cleaning and/or rinsing agent molded article (1, 1?, 1?) falls sideways onto the roll surface (2) when the cleaning and/or rinsing agent molded article (1, 1?, 1?) meets the relevant end faces (3, 4) or is placed against a solid surface. A cleaning product comprises a pouch, in which a cleaning and/or rinsing agent molded article of this type is located. A cleaning product (10) is also described, comprising a sealed pouch (11) in which a cleaning and/or rinsing agent molded article (1, 1?, 1?) of this type is located.

Abstract: This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water, in which the composition is free of a compound comprising at least three hydroxyl groups. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.

Abstract: The invention relates to an aqueous foaming cleaning composition for removing soil at low temperatures from a surface to be cleaned, characterized in, that the aqueous foaming cleaning composition comprises: a linear and/or branched C12-alkyl dimethylamine oxide or C12-alkyl diethylamine oxide or C12-alkyl methylethylamine oxide; a linear and/or branched C14-alkyl dimethylamine oxide or C14-alkyl diethylamine oxide or C14-alkyl methylethylamine oxide; at least one anion tenside of: a dodecyl (oxyethylen)w sulfat, wherein w represents an average addition mole number ranging from about 1 to about 10, and/or at least one polyoxyalkylene alkyl ether carboxylic acid or salt thereof represented by formula (I): RO—(AO)n?1—A?—COOmM (I) wherein, R represents a linear and/or branched alkyl group having about 8 to about 18 carbon atoms; AO represents an alkylene oxy group having about 2 to about 4 carbon atoms; n represents an average addition mole number ranging from about 1 to about 20; A? represents an alkylene group

Abstract: The purpose of the present invention is to provide means for sufficiently removing residues on a surface of an object which has been polished including silicon nitride, silicon oxide, or polysilicon. Provided is a composition for surface treatment including an anionic surfactant having a molecular weight of 1,000 or less and water, the composition having a pH of less than 7, wherein a ratio of a molecular weight of a hydrophilic moiety to a molecular weight of a hydrophobic moiety (the molecular weight of the hydrophilic moiety/the molecular weight of the hydrophobic moiety) of the anionic surfactant is 0.4 or more (in which the hydrophobic moiety is a hydrocarbon group having 4 or more carbon atoms and the hydrophilic moiety is a part excluding the hydrophobic moiety and a counterion), and the composition for surface treatment is used for surface treatment of an object which has been polished including at least one selected from the group consisting of silicon nitride, silicon oxide, and polysilicon.

Abstract: Surfactant systems and compositions incorporating the same are disclosed for use as rinse aids on plastics and other wares. The surfactant systems and compositions include both liquid and solid formulations, along with methods of use for treating plastics and other wares. The surfactant systems and compositions provide synergistic combinations allowing lower actives in composition formulations of the plastic-compatible surfactant systems providing good sheeting, wetting and drying properties.

Abstract: The present invention relates to: a liquid composition suitable for the washing of a semiconductor element provided with a low-dielectric-constant interlayer insulating film; and a method for washing a semiconductor element. The liquid composition according to the present invention is characterized by containing tetrafluoroboric acid (A) in an amount of 0.01 to 30% by mass, or boric acid (B1) and hydrogen fluoride (B2) at a (boric acid)/(hydrogen fluoride) ratio of (0.0001 to 5.0/by mass)/(0.005 to 5.0% by mass), and having a pH value of 0.0 to 4.0. The liquid composition according to the present invention can reduce the damage of a low-dielectric-constant interlayer insulating film, cobalt or a cobalt alloy, alumina, a zirconia-based hard mask and a silicon nitride during the process of producing a semiconductor integrated circuit, and accordingly can be used suitably for removing dry etching residues occurring on the surface of the semiconductor integrated circuit.

Abstract: Solid, concentrated, multi-use, stabilized peroxygen bleach compositions are disclosed. The solid compositions employ a C6-C18 fatty acid binding system for improving shelf stability of an activated bleach composition containing a peroxygen source and a bleach activating agent. Methods of formulating and methods of use are further provided.

Abstract: Cleaning agents, preferably dishwashing detergents, in particular the automatic dishwashing detergent, having at least one low-water, preferably substantially anhydrous gel-like phase which contains at least one water-soluble zinc salt, preferably zinc sulfate and/or zinc acetate, particularly preferably zinc acetate.

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Abstract: A cleaning formulation has from 10 to 99 wt % water, from 0.8 to 40 wt % surfactant, optionally other additives, and from 0.2 to 20 wt % of a solvent additive of formula (I): R1—O-(AO)n—C(?O)—R2??(I) where R1 is C3 to C12 alkyl, AO is an alkylene oxide group selected from an ethylene oxide group, a propylene oxide group and a butylene oxide group. At least one AO group in the solvent additive is an ethylene oxide group. The solvent additive has a water solubility of less than 1 wt % in deionised water at 20° C. and the surfactant enables the solvent additive to dissolve and/or disperse in the cleaning formulation. In a method of cleaning an oily or waxy soil from a hard surface, the solvent additive is applied to the hard surface and optionally rinsed with water. The solvent additive is used in a cleaning formulation to improve the percentage soil removal.