Patents Examined by Guillermo J Egoavil
  • Patent number: 11856700
    Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: December 26, 2023
    Inventors: Chunghyun Ryu, Byungok Kang, Su-Yong An, Jongwoo Jang, Insub Kwak, Teck Su Oh, Geurim Jung, Sang-Ho Park, Sung-Ki Lee
  • Patent number: 11848117
    Abstract: Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ?L*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: December 19, 2023
    Assignee: C3 Nano, Inc.
    Inventors: Yongxing Hu, Ying-Syi Li, Xiqiang Yang, Jing Shun Ang, Ajay Virkar
  • Patent number: 11848143
    Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: December 19, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yunghsun Chen, Huang-Hsien Chang, Shao Hsuan Chuang
  • Patent number: 11837859
    Abstract: The present disclosure provides improved electrical box and conduit support plates that allow for central mounting of an electrical box to a support plate and mounting of electrical conduits for suspended installations in various orientations. The support plate includes a body having a plurality of built-in offsets, a plurality of built-in hanger tabs, and a plurality of clip mounting apertures that may be arranged as pairs. Each built-in offset preferably has two side walls extending from the body and a mounting arm between the side walls. Each mounting arm includes a plurality of clamp mounting apertures used to attach a conduit clamp to the mounting arm. Each of the plurality of built-in hanger tabs are preferably bendable relative to the body. Box and conduit support kits that includes a body and a plurality of hanger clips are also provided.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: December 5, 2023
    Assignee: Hubbell Incorporated
    Inventors: Victor Beristany, Steven James Johnson
  • Patent number: 11837380
    Abstract: Provided are: a superconducting wire rod in which the non-uniform deformation of the shape of an MgB2 core material has been controlled; a superconducting coil; a magnetic generator; and a method for producing a superconducting wire rod. A superconducting wire rod (100A) according to the present invention comprises: a center material (106) of which at least the outer circumferential surface is formed of a metal that does not react with Mg; a plurality of single-core wires (103) disposed around the center material (106), each of the single-core wires having an MgB2 superconductor core material (101) coated with a first coating material (102) made of a metal that does not react with Mg; and an outer shell material (105) disposed outside the plurality of single-core wires (103), wherein at least the inner circumferential surface of the outer shell material (105) is formed of a metal that does not react with Mg.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 5, 2023
    Assignee: HITACHI, LTD.
    Inventors: Takaaki Suzuki, Hideki Tanaka, Motomune Kodama
  • Patent number: 11824292
    Abstract: A connector consisting of a body, a first slot, a second slot, a first terminal, and a second terminal is disclosed. The first slot is provided on the body to receive a first printed circuit board (PCB). The second slot is provided on the body to receive a second PCB. The first slot and the second slot are separate and distinct slots. When the first PCB and the second PCB are received in the first slot and the second slot, respectively, the first terminal electrically connects the first PCB and the second PCB, and the second terminal connects to only the second PCB. Providing the first slot on the connector allows adding expansion cards, control cards, and the like to enhance functionality of computing systems.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: November 21, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Hou-Hsien Chang
  • Patent number: 11820239
    Abstract: A system for at least partially preventing passage an intrusive electromagnetic field into an internal volume of a structure is provided. The system includes a plurality of shielding modules positionable adjacent one another on an exterior surface of the structure for covering at least a portion of the exterior surface. Each of the shielding modules including a sensor and a shielding coil positioned around the sensor. The sensor is configured to measure the intrusive electromagnetic field and generate a signal based on the measured field. The system further includes a control unit in communication with each of the shielding modules, the control unit controls supply of response currents to the coil based on the signal such that the coil radiates a counteracting electromagnetic field that at least partially prevents passage of the intrusive field into the internal volume of the structure.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: November 21, 2023
    Inventor: Jan Morava
  • Patent number: 11810695
    Abstract: A cable, in particular a power and/or telecommunication cable, has at least one elongated electrically conductive element, and at least one fire-resistant layer surrounding said elongated electrically conductive element. The fire-resistant layer is a ceramic layer in direct physical contact with the elongated electrically conductive element.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: November 7, 2023
    Assignee: NEXANS
    Inventors: Maxime Auvergne, Franck Gyppaz
  • Patent number: 11812550
    Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system includes a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of each power device stack, and a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: November 7, 2023
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Ercan Mehmet Dede
  • Patent number: 11810690
    Abstract: A guarded coaxial cable assembly provides at least one bundled electrical cable with first and second concentrically aligned conductors, the bundle encapsulated in a flexible jacket that is abrasion resistant and wherein with respect to a jacket cross-section a height of the jacket is smaller than a width of the jacket.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: November 7, 2023
    Assignee: Holland Electronics, LLC
    Inventors: Scott Hatton, Michael Holland
  • Patent number: 11800635
    Abstract: A capacitor is disposed on a substrate that is insulative. An inductor is disposed on the substrate. The inductor includes a conductor pattern having at least one end connected to the capacitor. The capacitor includes a dielectric film that mainly contains the same constituent element as a constituent element mainly contained in the substrate and at least two electrodes that face each other with the dielectric film interposed therebetween.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 24, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jyou Kikura, Toshihiro Tada, Tadashi Washimori
  • Patent number: 11798746
    Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 24, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideaki Tanaka, Daiki Fukunaga, Koji Moriyama
  • Patent number: 11798747
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Patent number: 11800650
    Abstract: A pin-aligned magnetic device is provided, which includes a first magnetic core body, a second magnetic core body, and a plurality of conductors. The first magnetic core body is internally disposed with a magnetic element, and the magnetic element is joined to the plurality of conductors. The second magnetic core body covers the plurality of conductors on the first magnetic core body, so that the plurality of conductors is mounted inside the magnetic device and pins thereof are exposed from two lateral sides of the magnetic device, to form a plurality of pins. The foregoing design makes room at the bottom of the magnetic device, thus facilitating space saving and utilization on a PCB board. Moreover, each pin can be in good electrical contact with the board, effectively enhancing product yield on a production line.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: October 24, 2023
    Assignee: ITG ELECTRONICS, INC.
    Inventors: Martin Kuo, Nanhai Zhu
  • Patent number: 11785705
    Abstract: A device may include a temperature controlled chamber. The temperature controlled chamber may be coupled to a plurality of strengthening coated capillary tubes. The strengthening coated capillary tubes may support the temperature controlled chamber and provide thermal insulation to the temperature controlled chamber.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: October 10, 2023
    Assignee: Xerox Corporation
    Inventor: Yunda Wang
  • Patent number: 11784423
    Abstract: The Knee Saver Multiplex Electrical Termination Device Board is comprised of; a one-piece board, consisting of a combination of several alike/or unlike termination devices, where multiple termination devices are within a single enclosure, which can handle more than one power source, with different amperages, at the same time, and used in conjunction with the Knee Saver U.S. Pat. Nos. 9,960,580, 9,368,948, 10,320,169, and patent application Ser. No. 16/214,239 which is installed, into a single HUB or Dielectric body, without the need to get down on your knees to install receptacles.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: October 10, 2023
    Inventor: Alexander Ruggiero
  • Patent number: 11769633
    Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gu Won Ji, Heung Kil Park, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 11764562
    Abstract: The present application discloses a terminal structure for conduction cooling high temperature superconducting cable, comprising: a cable terminal body; a terminal thermal insulation shell, in which a vacuum thermal insulation cavity is formed, and the cable terminal body being arranged in the vacuum thermal insulation cavity; a refrigeration mechanism comprising a refrigeration output part extending into the vacuum thermal insulation cavity, and the refrigeration output part being connected to the cable terminal body through a cooling-conducting structure.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: September 19, 2023
    Assignees: CHINA THREE GORGES CORPORATION, XIDIAN UNIVERSITY
    Inventors: Yunyi Wu, Likun Yin, Qian Gong, Yong Yang, Yujia Zhu
  • Patent number: 11765816
    Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: September 19, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Arthur J. Higby, William L. Brodsky, Levi Campbell, David Clifford Long, James Busby, Philipp K. Buchling Rego
  • Patent number: 11755077
    Abstract: The invention discloses a buckle ring device for a memory slot. A memory module is able to be inserted into the memory slot. The memory slot is provided at two sides thereof with a seat, respectively. A clamp structure is pivotally connected to an inside of the seat. Two sides of the memory module inserted in the memory slot are clamped by the clamp structures. When the buckle ring device is assembled on the seat of the memory slot, the seat and the clamp structures can be used for constraining the displacement of the buckle ring device in XYZ axis directions, resulting in strengthening the clamping of the clamp structures to the memory module by the buckle ring device.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: September 12, 2023
    Assignee: Innodisk Corporation
    Inventor: Shuang-Te Chang