Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Abstract: The invention discloses a buckle ring device for a memory slot. A memory module is able to be inserted into the memory slot. The memory slot is provided at two sides thereof with a seat, respectively. A clamp structure is pivotally connected to an inside of the seat. Two sides of the memory module inserted in the memory slot are clamped by the clamp structures. When the buckle ring device is assembled on the seat of the memory slot, the seat and the clamp structures can be used for constraining the displacement of the buckle ring device in XYZ axis directions, resulting in strengthening the clamping of the clamp structures to the memory module by the buckle ring device.

Abstract: A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Abstract: Disclosed herein is a coil component that includes a core, first to fourth terminal electrodes provided on a first flange part, fifth to eighth terminal electrodes provided on a second flange part, first and second wires bifilar wound around a winding core part, and third and fourth wires bifilar wound around the winding core part. One and other ends of the first to eighth wires are connected corresponding one of the first to eighth terminal electrodes. The first and second wires cross each other in a first crossing area. The third and fourth wires cross each other in a second crossing area different from the first crossing area.

Abstract: The present invention relates to a first metal cable (1) having a flat upper (A) and a flat lower (B) surface, comprising at least one hollow riser (2) extending approximately 90 degrees from one of the flat surfaces of the first metal cable, the hollow riser being 5 configured to house an end of a second metal cable (3). A connected structure comprising a first metal cable wherein a second metal cable is inserted into the hollow riser (2) of the first metal cable and joined with the first metal cable. it also relates to a method of making a connected structure, joining a first metal cable to a second metal cable by friction welding the second metal cable (3) to the first metal cable by 10 contacting a rotating tool (4) with the lower surface of the first metal cable in the area underneath the hollow riser.

Abstract: According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

Abstract: The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

Abstract: A modular hardware platform utilizes a combination of different types of units that are pluggable into cassette endpoints. The present disclosure enables the construction of an extremely large system, e.g., 500 Tb/s+, as well as small, standalone systems using the same hardware units. This provides flexibility to build different systems with different slot pitches. The hardware platform includes various numbers of stackable units that mate with a cost-effective, hybrid Printed Circuit Board (PCB)/Twinax backplane, that is orthogonally oriented relative to the stackable units. In an embodiment, the hardware platform supports a range of 14.4 Tb/s-800 Tb/s+ in one or more 19? racks, providing full features Layer 3 to Layer 0 support, i.e., protocol support for both a transit core router and full feature edge router including Layer 2/Layer 3 Virtual Private Networks (VPNs), Dense Wave Division Multiplexed (DWDM) optics, and the like.

Abstract: A laminated busbar includes: a base body comprising conducting layers and insulating material to electrically insulate the conducting layers from each other. The conducting layers and the insulating material are clamped together by mechanical means and/or a profile is connected to the base body. In an embodiment, no glue or adhesive is arranged between at least one conducting layer and at least one insulating material.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

Abstract: A recessed floor fitting includes a poke-through housing, a divider assembly, and a feeder plate. The poke-through housing has a base and an outer wall with an open top that defines an interior chamber. The base includes a central aperture, a first perimeter aperture, and a second perimeter aperture. The divider assembly separates the interior chamber into a center portion, a first portion, and a second portion. The center portion is in communication with the center aperture. The first and second portions are in communication with the respective first and second perimeter apertures. The feeder plate is connected to the base, and has a mounting flange and a conduit extending from the mounting flange.

Abstract: A modular electrical bus system for a valve manifold has a communication module, a valve driver module, and a plurality of I/O modules each having a plurality of I/O fittings being both electrically and mechanically connectable together via a bridge member connecting adjacent modules. The bridge member has a housing with an interior for housing electronic components for memory storage or Wi-fi reception and transmission that is operably connected to a complementary electrical fitting constructed to be connected to an electrical fitting of a module of said electrical fieldbus system without adding extra length to said bank of modules of said electrical fieldbus system.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a stacking direction, and including a first surface and a second surface opposing each other in the stacking direction, a first through electrode penetrating the body and connected to the first internal electrode; a second through electrode penetrating the body and connected to the second internal electrode, first and second external electrodes disposed on the first surface and the second surface, respectively, and connected to the first through electrode, third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through electrode, and an identifier disposed on the first surface or the second surface of the body, and the first and second through electrodes protrude from the first surface of the body.

Abstract: Methods, apparatuses and systems to provide for technology to that includes a plurality of transistors including first transistors and second transistors. The first transistors are disposed opposite the second transistors in a lateral direction with a first space between the first transistors and the second transistors in the lateral direction. A gate driver is electrically connected to the plurality of transistors to operate the plurality of transistors. The gate driver has a first portion disposed between the first transistors and the second transistors in the first space.

Abstract: A bus bar includes a first joint that is joined to an output terminal of a first battery, a second joint that is joined to an output terminal of a second battery, a heat absorber that is disposed between the first joint and the second joint and has a heat capacity larger than heat capacities of the first joint and the second joint, and a displacement absorber that is disposed between the first joint and the second joint and deforms in response to a relative displacement of the first battery and the second battery.

Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.