Patents Examined by Guillermo J Egoavil
  • High performance removable storage devices
    Patent number: 11520311
    Abstract: The present disclosure relates to a device for reading from and/or writing to a removable storage card. The device can comprise a housing including a wall defining a housing opening sized to receive a removable storage card. The device can also comprise a thermal management system attached to at least a part of the wall of the housing. Additionally, the device can comprise a biasing mechanism interoperable with the housing and configured to bias a card surface of the removable storage card into thermal communication with the thermal management system in response to insertion of the removable storage card into the housing opening. In some aspects, the biasing mechanism includes one or more elastic members configured to apply a biasing force to the removable storage card in response to the insertion of the removable storage card into the housing opening.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: December 6, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Michael Lau, Julia Purtell
  • Semiconductor device
    Patent number: 11522533
    Abstract: Provided is a semiconductor device capable of suppressing increase in size of a package and adjusting an amount of negative feedback. A power module as a semiconductor device includes an IGBT which is a switching element and a free wheel diode (FWD) parallelly connected to the switching element. The IGBT has, on a surface thereof, an emitter electrode and a gate electrode of the IGBT and a conductive pattern insulated from the emitter electrode and the gate electrode. The FWD has, on a surface thereof, an anode electrode of the FWD and a conductive pattern insulated from the anode electrode.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: December 6, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hiroyuki Nakamura
  • Multilayer electronic component
    Patent number: 11515092
    Abstract: A multilayer electronic component that includes a plurality of stacked dielectric layers, each of the plurality of stacked dielectric layers having a plurality of crystal grains, at least some of the plurality of crystal grains having a trap portion therein, and at least one element selected from the group consisting of Ni, Cu, Pt, Sn, Pd and Ag is present locally in the trap portion; and a plurality of internal electrode layers arranged between adjacent dielectric layers of the plurality of stacked dielectric layers.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: November 29, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideyuki Hashimoto, Kenji Ueno
  • Multilayer electronic component
    Patent number: 11508522
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Electronic device
    Patent number: 11495405
    Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: November 8, 2022
    Assignee: TDK CORPORATION
    Inventors: Akihiro Masuda, Norihisa Ando, Shinya Ito, Kosuke Yazawa, Yoshiki Satou, Katsumi Kobayashi
  • Multilayer ceramic electronic component
    Patent number: 11495404
    Abstract: A multilayer ceramic electronic component includes an internal electrode layer including, on a same ceramic layer, a peripheral internal electrode having a frame shape and an inside internal electrode located inside the peripheral internal electrode. A metallic species included in the peripheral internal electrode is different from a metallic species included in the inside internal electrode. The metallic species included in the peripheral internal electrode includes more than or equal to about 50% of a metallic species different from the metallic species included in the inside internal electrode. In a width direction, a dimension a of a width of the peripheral internal electrode is about 5 ?m<a<about 30 ?m, and a dimension b of a width of the inside internal electrode is b/a?about 20.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: November 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Sho Kubota
  • Three-terminal multilayer ceramic capacitor and method for manufacturing three-terminal multilayer ceramic capacitor
    Patent number: 11482378
    Abstract: A three-terminal multilayer ceramic capacitor includes a capacitor including a ceramic layer, first and second internal electrodes, first and second end surface electrodes, and first and second side surface electrodes, and has a lengthwise dimension of about 1300 ?m or more and about 1500 ?m or less, a widthwise dimension of about 1000 ?m or more and about 1200 ?m or less, a heightwise dimension of about 570 ?m or more and about 680 ?m or less, and a capacitance of about 12 ?F or more and about 32 ?F or less. The first and second end surface electrodes, and the first and second side surface electrodes include a Ni underlying electrode layer and at least one plating electrode layer. The first and second end surface electrodes have a thickness of about 0.73% or more and about 3.00% or less relative to the lengthwise dimension.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: October 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kosuke Onishi, Satoshi Muramatsu, Taisuke Kanzaki
  • Electronic component
    Patent number: 11477891
    Abstract: An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gu Won Ji, Man Su Byun, Soo Hwan Son, Young Ghyu Ahn
  • Capacitor
    Patent number: 11456117
    Abstract: A capacitor includes a capacitor element having an end surface and a peripheral surface, an electrode disposed on the end surface, and a bus bar connected to the electrode. The bus bar includes a bus bar main body and at least one electrode connection terminal part provided at an edge part of the bus bar main body. The at least one electrode connection terminal part includes a connecting part and an elastic shape part. The connecting part is connected to the electrode at a tip of the at least one electrode connection terminal part. The elastic shape part is disposed between the edge part and the connecting part. The elastic shape part has a shape that is elastically deformable so that the elastic shape part shrinks in accordance with thermal expansion of the bus bar main body, and the elastic shape part extends in accordance with thermal shrinkage of the bus bar main body.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 27, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kakyoku Ri, Hiroyuki Kikkawa
  • Copper-aluminium connector
    Patent number: 11450975
    Abstract: A copper-aluminum connector includes at least one copper terminal for connection to a power consumption device, and at least one aluminum wire for connection to an electrical circuit, wherein, the copper-aluminum connector further includes a connecting part, and the connecting part includes at least one first connecting end for connection to an end portion of the copper terminal and at least one second connecting end for connection to the aluminum wire.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: September 20, 2022
    Assignee: JILIN ZHONG YING HIGH TECHNOLOGY CO., LTD.
    Inventor: Chao Wang
  • Film capacitor, and exterior case for film capacitor
    Patent number: 11437190
    Abstract: A film capacitor that includes a capacitor element having a metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein a surface free energy of an inner surface of the outer case in contact with the filling resin is 44 mN/m or less.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: September 6, 2022
    Assignees: MURATA MANUFACTURING CO., LTD., SHIZUKI ELECTRIC CO., INC.
    Inventors: Ryo Majima, Takuya Sakamoto, Satoru Jogan
  • Converter including printed circuit board and power conversion module including converter
    Patent number: 11432438
    Abstract: The disclosure relates to a communication technique and system after 4G systems for combining a 5G communication system with IoT technology to support higher data rates. Based on 5G communication and IoT-related technologies, the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart or connected car, healthcare, digital education, retail, security, and safety).
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: August 30, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gyoungsoo Yeo, Jeonggyu Park, Jaejin Lee, Seongu Kang
  • Multilayer electronic component and method for manufacturing multilayer electronic component
    Patent number: 11424075
    Abstract: A multilayer electronic component having a plurality of stacked dielectric layers and a plurality of internal electrode layers. Each of the dielectric layers has a plurality of crystal grains including a perovskite-type compound containing Ba, a first rare earth element and a second rare earth element. A difference between a positive trivalent ion radius of the first rare earth element and a positive divalent ion radius of Ba is smaller than a difference between a positive trivalent ion radius of the second rare earth element and the positive divalent ion radius of Ba. A sum of an amount of the first rare earth element and the second rare earth element in a first region along a grain boundary is larger than a sum of an amount of the first rare earth element and the second rare earth element in a second region in a center portion of the crystal grain.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 23, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideyuki Hashimoto
  • Inductor
    Patent number: 11424068
    Abstract: An inductor includes a main body having a bottom surface, a top surface positioned opposite to the bottom surface, four side surfaces connected to the bottom surface and the top surface, a metal body that includes a first metal portion buried in the main body and second metal portions extending outward from respective opposite longitudinal ends of the first metal portion. The second metal portions are exposed from respective opposite side surfaces of the main body. In the inductor, each second metal portion is formed into a tabular shape having a first surface with a plating layer and a second surface positioned opposite to the first surface. Each second metal portion is formed into an external terminal and includes a first bend and a second bend that are formed by bending the second metal portion.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: August 23, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Motoki Toyama, Takumi Arai, Ryuta Uematsu, Yuichi Tsuchiya
  • Hard start kit for multiple replacement applications
    Patent number: 11424077
    Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: August 23, 2022
    Assignee: AmRad Manufacturing, LLC
    Inventors: Richard W. Stockman, Robert M. Stockman
  • Module configured to reduce or eliminate NVH problems of electrical equipment and electrical equipment
    Patent number: 11412628
    Abstract: The invention relates to a module configured to reduce or eliminate NVH problems and electrical equipment provided with the module. Electrical equipment includes a housing; the housing includes a cover panel, a peripheral wall, and a chamber defined by the peripheral wall and the cover panel; a part of the cover panel is fastened to upper edges of the peripheral wall; and the electrical equipment further includes at least one support element which is installed inside the chamber at a distance from the peripheral wall, and is configured to support the cover panel.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: August 9, 2022
    Assignee: SIEMENS AUTOMOTIVE EPOWERTRAIN SYSTEMS (SHANGHAI) CO. LTD.
    Inventors: Yu Ma, Zhenbing Liu, Qi Zhang, Bruno Condamin
  • Multilayer ceramic capacitor, mount structure of multilayer ceramic capacitor, and series of electronic components
    Patent number: 11398351
    Abstract: A multilayer ceramic capacitor includes a multilayer body and first and second external electrodes. The first and second external electrodes include first and second underlying electrode layers, first and second main-surface-side resin layers, and first and second plated layers, respectively. The first and second main-surface-side resin layers cover respective ends of the first and second underlying electrode layers on a first main surface and cover respective portions of a first side surface and a second side surface continuously from the first main surface.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: July 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hidetaka Sugiyama
  • Wire connection boot assembly
    Patent number: 11394133
    Abstract: The invention relates to a method of connecting electrical wires, conductors, or connections together by rotating the connector ends in an enclosure to tightly twist the wire ends together and also includes a clamping mechanism to prevent the wires from untwisting, becoming loose, or falling out of the enclosure. The present invention increases the holding ability of current rotating tools for electrical wires and connections.
    Type: Grant
    Filed: February 6, 2022
    Date of Patent: July 19, 2022
    Inventors: Joel Douglas, Shem Lachhman
  • Flexible display panel
    Patent number: 11395425
    Abstract: A flexible display panel is provided, including a display component layer, a protection cover, and a backplane. The protection cover and the backplane are respectively disposed on opposite sides of the display component layer. The protection cover includes a first section corresponding to a bending area and a second section corresponding to a non-bending area. The first section includes a plurality of first sub-sections and a plurality of second sub-sections which are alternately arranged. The plurality of first sub-sections of the first section are made of a flexible material, and the plurality of second sub-sections of the first section and second sections are made of a rigid material. By setting the protection cover with multi-section design, the protection cover can correspondingly exhibit better bending performance and better hardness performance.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: July 19, 2022
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Fang Wang
  • Electrical box cable connector
    Patent number: 11387639
    Abstract: An electrical box assembly having an electrical box and a cable connector is provided. The cable connector includes a mounting bracket cable retaining member and a cable stop. The mounting bracket is secured to or integral with a side wall of the electrical box. The cable retaining member is secured to the mounting bracket and has a cable gripping portion extending into a cable receiving zone of the box. The cable stop extends from a bottom wall of the electrical box into the cable receiving zone. The cable stop permits one or more electrical wires from an electrical cable to pass through the cable stop while blocking sheathing of the electrical cable from passing through the cable stop.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: July 12, 2022
    Assignee: Hubbell Incorporated
    Inventor: Steven James Johnson