Abstract: A memory pipeline for performing a write operation in a memory device is disclosed. The memory pipeline comprises an input register operable to receive a first data word and an associated address to be written into a memory bank. The memory pipeline also comprises a pre-read register of the first pipe-stage coupled to the input register and operable to receive the first data word and the associated address from the input register and further operable to pre-read a second data word stored in the memory bank at the associated address. Finally, the memory pipeline comprises a write register of the second pipe-stage operable to receive the first data word, the associated address and mask bits from the pre-read register, wherein the write register is further operable to use information from the mask bits to write the first data word into the memory bank by changing those bits in the first data word that differ from the second data word.

Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as read-only memory by not implementing erase or write commands. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to compare an address of a received command to the one or more addresses, and at least in part based on the comparison, determine not to implement the received command. The circuitry can be further configured to return an error message after determining not to implement the received command.

Abstract: A magnetic device comprising having a first magnetic layer having a first magnetization direction, a second magnetic layer having a second magnetization direction, a first coupling layer interposed between the first and second magnetic layers, a third magnetic layer having a third magnetization direction, a first magnetoresistive layer interposed between the third magnetic layer and the second magnetic layer, and a circuit connected to one or more of the layers of the magnetic device by at least a pair of leads. The circuit is configured to determine a change in resistance between the pair of leads. The change in resistance is based at least in part on a change in an angular relationship between the third magnetization direction and the second magnetization direction caused by an external magnetic field or a current passing through at least a portion of the device.

Abstract: Various memory devices and associated methods of operation are disclosed herein. An exemplary method includes flowing a current through an electrode of a memory device. The current exerts a spin-torque for orienting a magnetic field of a magnetic layer of the memory device and produces a magnetic field in the electrode that assists in orienting the magnetic field of the magnetic layer. The current can produce the magnetic field in the electrode when flowing through a region of the electrode having a winding orientation that is substantially perpendicular to a longitudinal axis of the memory device. In some implementations, flowing the current through the electrode includes storing data in the memory device.

Abstract: A method of writing data into a memory device is disclosed. The method comprises utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank. Further, the method comprises writing a second plurality of data words and associated memory addresses into a cache memory, wherein the cache memory is associated with the memory bank and wherein further each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. The method also comprises detecting a power down signal and responsive to the power down signal, transferring the second plurality of data words and associated memory addresses from the cache memory into a secure memory storage area reserved in the memory bank. Finally, the method comprises powering down the memory device.

Abstract: A power management integrated circuit (PMIC) that has multiple sets of circuits to provide certain same power management functionalities in different power modes, such as voltage, current and temperature sensing and/or measuring, generating of reference states or biases to effectuate circuit protection in various conditions, such as under voltages, over voltages, etc. One set of circuits is configured to operate during a normal mode and is optimized for performance, speed and/or accuracy. Another set of circuits is configured to operate during a sleep mode and is optimized for reduced power consumption where the performance, speed and/or accuracy may be inferior to the circuits for the normal mode but the functionality is maintained within the low power consumption constraint.

Abstract: A method of writing data into a memory device is disclosed. The method comprises utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank. Further, the method comprises writing a second plurality of data words and associated memory addresses into a cache memory, wherein the cache memory is associated with the memory bank and wherein further each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. The method also comprises detecting a power down signal and responsive to the power down signal, and before the memory device is powered down, processing data words of the second plurality of data words and associated memory addresses through the pipeline to write data into the memory bank. Finally, the method comprises powering down the memory device.

Abstract: Provided are an erasing method, erasing apparatus for memory cells and a storage medium to perform erase loops with a more appropriate erasing voltages. The method includes performing erase loops on a target erasing block by sequentially using first erasing voltages Vn; and when a predetermined condition is reached, proceeding to perform erase loops on the target erasing block by sequentially using second erasing voltages Um until the target erasing block is successfully erased. Vn=V1+(n?1)×d1, where n denotes erase loop counts of the first erasing voltages, n is an integer greater than or equal to 1, and V1 and d1 are positive numbers. Um=Vn+(m?1)×d2, where m denotes erase loop counts of the second erasing voltages, m is an integer greater than or equal to 2, and d2 is a positive number not equal to d1.

Abstract: Provided herein may be a semiconductor device and a method of manufacturing the same. The semiconductor device may include a memory string including memory cells coupled to each other in series via a channel layer, the memory string coupled between a bit line and a second source line. The semiconductor device may include a first source line electrically coupled to the second source line through the channel layer.

Abstract: A memory device includes memory banks that each has multiple rows with row addresses. The memory device also includes a counter that stores and increments a first row address of a first row of a first set of memory banks to a second row address of a second row of the first set of memory banks in response to a first refresh operation when the memory device is operating in a first mode. The memory device further includes circuitry that blocks incrementing the second row address to a third row address of a third row of the first set of memory banks when the memory device transitions from the first mode to a second mode and the first refresh operation is not paired with a second refresh operation that is performed when the memory device is operating in the first mode.

Abstract: A semiconductor memory device includes a memory cell unit, word lines, a driver circuit, and first transistors. The word lines are connected to the control gates of 0-th to N-th memory cells. The (N+1) number of first transistors transfer the voltage to the word lines respectively. Above one of the first transistors which transfers the voltage to an i-th (i is a natural number in the range of 0 to N) word line, M (M<N) of the word lines close to the i-th word line pass through a region above the gate electrode by a first level interconnection without passing over the impurity diffused layers.

Abstract: A ferroelectric opening switch is enabled by controlled polarization switching via nucleation in a ferroelectric material, such as BaTiO3, Pb(Zr,Ti)O3, LiNbO3, LiTaO3, or variants thereof. For example, nucleation sites can be provided by mechanical seeding, grain boundaries, or optical illumination. The invention can be used as an opening switch in large scale pulsed-power systems. However, the switch can also be used in compact pulsed-power systems (e.g., as drivers for high power microwave systems), as passive fault limiters for high voltage dc (HVDC) systems, and/or in other high power applications.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which multiple counters are provided to permit memory refresh commands greater freedom in targeting subsets of the memory device for data refresh operations. In one embodiment, a memory device is provided, comprising a plurality of memory banks, and circuitry configured to (i) store a plurality of values, each of the plurality of values corresponding to one of the plurality of memory banks; (ii) refresh first data stored in a first one of the plurality of memory banks; and (iii) update a first one of the plurality of values corresponding to the first one of the plurality of memory banks based at least in part on refreshing the first data.

Abstract: A memory device and a data refreshing method thereof are provided. When an automatic refresh word line address and a row hammer refresh word line address belong to the same memory cell array, memory cells corresponding to the automatic refresh word line address are refreshed, and a time to refresh memory cells corresponding to the row hammer refresh word line address is postponed.

Abstract: A method of operating a semiconductor memory device including a memory cell array and an error correction circuit is provided as follows. A write command, main data and an address are received from a memory controller. An error correction data unit is provided to the error correction circuit. The error correction data unit includes the main data. At least one parity bit is generated based on the error correction data unit. A write operation is performed, in response to the write command, on a target page selected by the address so that the at least one parity bit and the main data are written to the target page and the at least one parity data is written later than the main data to the target page.

Abstract: Dynamic redundancy buffers for use with a device are disclosed. The dynamic redundancy buffers allow a memory array of the device to be operated with high write error rate (WER). A first level redundancy buffer (e1 buffer) is couple to the memory array. The e1 buffer may store data words that have failed verification or have not been verified. The e1 buffer may transfer data words to another dynamic redundancy buffer (e2 buffer). The e1 buffer may transfer data words that have failed to write to a memory array after a predetermined number of re-write attempts. The e1 buffer may also transfer data words upon power down.

Abstract: A memory system comprising: a memory device including a plurality of memory dies each having a plurality of the memory blocks; and a controller suitable for performing a command operation to the memory dies, wherein the memory device comprises means for performing an error check operation to a first data provided from the controller to store the first data the memory device.

Abstract: A bit line power supply apparatus including a bit line high voltage generator is provided. The bit line high voltage generator includes a first voltage generation circuit and a second voltage generation circuit. The first voltage generation circuit includes a first sensor and a first linear voltage regulator. The first sensor compares a first reference voltage with a bit line high voltage to generate a first sensing voltage according to a first control signal. The first linear regulator generates the bit line high voltage according the first sensing voltage. The second voltage generation circuit includes a second sensor and a switching voltage regulator. The second sensor compares the first reference voltage with the bit line high voltage to generate a second sensing voltage according to a second control signal. The switching regulator generates the bit line high voltage according the second sensing voltage.

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.