Patents Examined by Hiram E Gonzalez
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Patent number: 9006588Abstract: An electric partition feedthrough for mounting on a partition. The feedthrough includes a housing having a control cam integrally molded on the outside of the housing, a contact, and a sealing element. A movably fastened closure element is provided on the housing. The closure element is designed to move the housing and the control cam such that the sealing element is transferred from a pre-mounting position to a final mounting position.Type: GrantFiled: November 24, 2009Date of Patent: April 14, 2015Assignee: Amphenol-Tuchel Electronics GmbHInventor: Eckhard Schewe
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Patent number: 9000308Abstract: A gasket comprises a main portion having first and second ends, a parallel leg extending perpendicularly from each of the first and second ends, and a step portion extending perpendicularly from each of the other end of the legs. The main portion and leg form an opening that is sized and dimensioned to receive a shell of a connector. A layer of nickel plated metalized nylon fabric wrapped over polyurethane foam. One side of the layer bonds to the interior surfaces of the main portion and leg that form the opening and the other side of the layer is adapted to urge against the shell of the HDMI connector. A section of the layer extends beyond the widths of the main and legs. The section is adapted to urge against a faceplate to maintain an electrical-conductive path between the shell of the HDMI connector and the surface of the faceplate.Type: GrantFiled: June 27, 2012Date of Patent: April 7, 2015Assignee: Crestron Electronics Inc.Inventors: Wendy Feldstein, William Rehak
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Patent number: 8987610Abstract: A vent structure for electromagnetic shielding includes: a conductive shielding case having a vent formed therein: a conductive shielding duct installed on the shielding case so as to cover the vent, including a space formed perpendicular to the direction of motion of air discharged from the vent to vent the air and a discharge port connected from the space to the outside to discharge the air introduced into the space to the outside, and shielding electromagnetic waves; and an EMI (Electro Magnetic Interference) gasket installed at a bonding surface between the shielding case and the shielding duct, and electrically connecting the shielding case and the shielding duct.Type: GrantFiled: May 8, 2012Date of Patent: March 24, 2015Assignee: Electronics and Telecommunications Research InstituteInventors: Ui-Jung Kim, Kwang-Uk Chu, Jong-Kyu Kim, Dae-Heon Lee
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Patent number: 8987605Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.Type: GrantFiled: September 28, 2011Date of Patent: March 24, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Ding Wang, Hung-Jen Lin, Chien-Hsiun Lee
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Patent number: 8981234Abstract: Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.Type: GrantFiled: May 29, 2009Date of Patent: March 17, 2015Assignees: National University Corporation Tohoku University, Daisho Denshi Co., Ltd.Inventors: Tadahiro Ohmi, Tetsuya Goto
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Patent number: 8981226Abstract: The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.Type: GrantFiled: October 24, 2008Date of Patent: March 17, 2015Assignee: Sekisui Chemical Co., Ltd.Inventors: Taku Sasaki, Hiroshi Natsui, Shinya Uenoyama, Ren-de Sun
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Patent number: 8971055Abstract: A circuit breaker includes a housing, a rigid circuit board, and a flexible circuit board. The rigid circuit board is enclosed within the housing and has a main surface for supporting an electronic component. The flexible circuit board has a first end that is directly attached to an edge of the rigid circuit board.Type: GrantFiled: December 16, 2008Date of Patent: March 3, 2015Assignee: Schneider Electric USA, Inc.Inventors: Randall James Gass, Rodney Powell, Nick Campbell, Timothy John Luksetich, Roger Wolf, Jerry Scheel
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Patent number: 8960818Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.Type: GrantFiled: June 10, 2013Date of Patent: February 24, 2015Assignee: Apple Inc.Inventors: Scott A. Myers, Erik L. Wang, Jason S. Sloey
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Patent number: 8921705Abstract: A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.Type: GrantFiled: August 7, 2009Date of Patent: December 30, 2014Assignee: Ibiden Co., Ltd.Inventor: Michimasa Takahashi
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Patent number: 8895859Abstract: A cover may include a plurality of first fastening mechanisms disposed adjacent to one another along a first edge and a plurality of second fastening mechanisms disposed adjacent to one another along a second edge. Each second fastening mechanism may correspond to one of the first fastening mechanisms to connect to the corresponding first fastening mechanism when the cover is bent about the axis.Type: GrantFiled: June 17, 2011Date of Patent: November 25, 2014Assignee: Verizon Patent and Licensing Inc.Inventor: Andrew M. Koniers
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Patent number: 8884165Abstract: An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate having a plurality of through electrodes arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes are led out to an external circuit with a contact medium arranged to bypass a sealant being interposed between the group of electrodes and the through electrodes.Type: GrantFiled: June 22, 2009Date of Patent: November 11, 2014Assignee: NEC SCHOTT Components CorporationInventor: Hiroshi Kamada
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Patent number: 8853534Abstract: A multi-directional mounting faceplate for managing a plurality of cables is provided. The mounting faceplate includes a faceplate body and a nose cover, wherein the faceplate body has an opening disposed about the center of the faceplate body. The cross-sectional shape of the nose cover is similar to the shape of the opening. The nose cover has two side plates and a linking plate which is connected between the two side plates, such that the nose cover can be rotatably connected to the faceplate body to change the open direction of the mounting faceplate.Type: GrantFiled: January 2, 2011Date of Patent: October 7, 2014Assignee: Emcom Technology Inc.Inventor: Chu-Li Wang
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Patent number: 8822821Abstract: The invention relates to a pre-installation assembly for a contact arrangement of a sensor assembly, having a support component, a clamping component, and at least one spring contact pin. The conductive end areas of the at least one spring contact pin are connected with one another and are designed to be axially incompressible and held under an axial spring load between support surfaces that are at a distance from one another. According to the invention, the support component and the clamping component are connected with one another by way of a connection in which the at least one spring contact pin is positioned and held by way of aligned guides in the support component and in the clamping component, with the spring contact pin passing through the guides.Type: GrantFiled: July 2, 2009Date of Patent: September 2, 2014Assignee: Robert Bosch GmbHInventor: Harry Kaiser
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Patent number: 8796553Abstract: Composite structural components are disclosed that include electrically conducting fibers providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.Type: GrantFiled: July 7, 2009Date of Patent: August 5, 2014Assignee: BAE Systems PLCInventors: Martyn John Hucker, Sajad Haq, Michael Dunleavy, David William Gough, Jason Karl Rew, Philip Lawrence Webberley
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Patent number: 8796559Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.Type: GrantFiled: January 10, 2011Date of Patent: August 5, 2014Assignee: Samsung Electro-Mechanics Co., LtdInventors: Yong Ho Baek, Seok Hyun Park, Ki Taek Lee
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Patent number: 8772650Abstract: This is directed to systems and methods for coupling sections of an electronic device together. Sections of an electronic device can be coupled together via “knuckles.” The particular shape and structure of the knuckles can be based on various design considerations. For example, in some embodiments each section can function as an individual antenna. In this case, the knuckles can be designed in order to provide electrical isolation between the sections, thus allowing proper operation of the antennas. For example, the knuckles can be formed from a dielectric material, etc. As another design example, the knuckles can be designed in order to provide increased strength in areas of high strain, and/or to counteract torsional twisting in areas of high impact. As yet another design example, the knuckle can be designed in a manner that is aesthetically pleasing or which otherwise meets cosmetic requirements.Type: GrantFiled: January 10, 2011Date of Patent: July 8, 2014Assignee: Apple Inc.Inventors: Nicholas Merz, Dan Jarvis
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Patent number: 8760867Abstract: A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing.Type: GrantFiled: December 3, 2010Date of Patent: June 24, 2014Assignee: SANYO Electric Co., Ltd.Inventors: Masaya Nakamichi, Shohei Takahashi
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Patent number: 8724321Abstract: A display apparatus includes a liquid crystal display having a display panel, a housing, and a plurality of heat pipes. The housing has a sealing part and has aeration paths. The sealing part seals the display panel to box the display panel therein, while making a display screen of the display panel viewable from outside. The aeration paths are arranged outside the sealing part and communicate with the outside of the housing. The heat pipes extend from a rear surface of the display panel to the aeration paths.Type: GrantFiled: December 3, 2010Date of Patent: May 13, 2014Assignee: SANYO Electric Co., Ltd.Inventors: Masaya Nakamichi, Shohei Takahashi
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Patent number: 8716599Abstract: Provided herein is a connecting strap or spanning strap that is adapted for use in interconnecting adjacent insulated and/or electrically isolated pipeline sections to provide electrical continuity. Various aspects of the spanning strap are based on the realization that different attachment mechanisms may benefit from differing geometries of the spanning strap. Specifically, it's been determined that the geometry of an attachment aperture extending through the connection strap for use in welding or soldering strapped an underlying surface may be advantageously designed.Type: GrantFiled: July 18, 2011Date of Patent: May 6, 2014Inventor: Don Hoff
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Patent number: 8692130Abstract: A transparent thin plate including a transparent substrate in a sheet form, a mesh layer formed on a surface of the transparent substrate and made of an opaque material having a structure wherein an outline of meshes is made of bands that are very thin and have a substantially equal width, and having a light transmittance of 50% or more. The transparent thin plate also includes a colored layer that is arranged in a state in which the colored layer is laminated in a partial area of the mesh layer and on the surface of the mesh layer, and has a color different from that of the opaque material constituting the mesh layer.Type: GrantFiled: April 9, 2008Date of Patent: April 8, 2014Assignee: Nissha Printing Co., Ltd.Inventors: Shuzo Okumura, Ryomei Omote, Takao Hashimoto, Yuki Matsui