Abstract: A frame for receiving one or more modules for cable entries or pipe penetrations. A compression unit is an integrated part of the frame in at least one embodiment, which compression unit is to compress the modules inside the frame. The compression unit includes three compression wedges. An upper and a lower compression wedge have the same orientation, while a middle compression wedge has an opposite orientation. The middle compression wedge is oriented with a broad side facing an opening of the frame receiving the modules. At least one compression screw goes through openings of the upper and lower compression wedges and through a slot in the middle compression wedge.

Abstract: The configurations of a two way wiring device are provided in the present invention. The proposed device includes a case having a first side, a second side opposite to the first side, a third side formed between the first side and the second side and an open bottom passing therethrough a first conducting wire, wherein the third side includes a first side segment, a second side segment and a middle segment located between the first and the second side segments, and a conducting wire guiding pathway formed on the case and the first conducting wire passing the pathway and wired out of the case through one of the first side segment and the second side segment.

Abstract: Motor vehicle conductor connection element includes a first flat part and an inlay arranged in the flat part so as to be substantially flush with a surface of the flat part. In order to ensure contacting with different conductors, the flat part is substantially coated with a metal and the inlay is partially coated with the metal.

Abstract: Disclosed herein is a temperature movable structure of a superconducting cable terminal. The superconducting cable terminal has sections of a high temperature portion, a temperature movable portion and an extremely low temperature portion. The temperature movable structure is disposed in the section of the temperature movable portion between the sections of the high temperature portion and the extremely low temperature portion. The temperature movable structure has upper and lower spacer members, a pipe body, first and third conductors, a second conductor and a contact connecting member disposed between the first and second conductors.

Abstract: A composite insulator comprises a rod with an insulating jacket and ribs and at least one end fitting and at least one corona shield. The latter is integrally manufactured from plastic material. It is configured to be coaxially disposed on the composite insulator at the transition from the rod to the end fitting. The corona shield forms a cavity, which is open towards the inside and which can be filled with sealant compound through at least one filling channel and which comprises a closing cuff in axial direction on both sides for sealing the cavity. The diameter of the rod side closing cuff is adapted to the diameter of the insulating jacket, and the diameter of the fitting side closing cuff is adapted to the diameter of the end fitting. The filling channel leads to the cavity from the outside.

Abstract: A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.

Abstract: Low leakage electrical joints and wire harnesses for simplifying the electrical infrastructure associated with solar energy utilities are disclosed. The low leakage electrical joints include fused wires that have been sealed, encased and configured to plug into other joints to form wire harnesses. The wire harnesses are particularly well suited for coupling a plurality of solar collector junction boxes to a combiner box.

Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.

Abstract: The present invention has an object of providing a terminal supporting device which can perform a fixing operation of a cable terminal quickly and easily with a simple configuration. The terminal supporting device of the invention comprises a main body 10, a socket 20, a biasing member 30, a stopper 40, and a lock member 50. The lock member 50 includes a lock body 51 which is arranged movably between a lock position located between the socket 20 and the stopper 40 and a lock release position separated outwardly from a position located between the socket 20 and the stopper 40. The lock body 51 has a fitting projection 54, and the stopper 40 has a fitting depression 42a which fits with the fitting projection 54 of the lock body 51 at the lock position.

Abstract: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.

Abstract: A system including a plate; at least one guide coupled to the plate; and a slide coupled to the at least one guide. The slide includes a first arm constrained by the at least one guide; and a second arm coupled to the first arm. The slide can be moved along the at least one guide.

Abstract: A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic material layers and the constraining layers that are alternately stacked. In the material layer, a via-hole conductor is connected to an intermediate conductor pattern. An extended portion is defined by extending an end of the via-hole conductor beyond the intermediate conductor pattern inside the basic material layer.

Abstract: A Faraday cage includes a casing structured by a first housing having a first outer cover made of a conductive material, and a first inner cover made of a conductive material, which is accommodated in the first outer cover and is electrically insulated from the first outer cover, and a second housing having a second outer cover made of a conductive material, which fits the first outer cover, and a second inner cover made of a conductive material, which is accommodated in the second outer cover and is electrically insulated from the second outer cover, the first and second housings being separable from each other; and a filter cartridge disposed inside the casing configured to be separable into two pieces, which accommodates therein a first filter for collecting fine particles sucked in from the outside the casing.

Abstract: A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste are provided. As a sintering aid glass which is combined with a ceramic aggregate and a primary glass, a glass having a contact angle to the ceramic aggregate smaller than that of the primary glass to the ceramic aggregate is used, and the content of the sintering aid glass is set to 5 to 10 percent by volume of the inorganic component. As the sintering aid glass, a glass containing SiO2, B2O3, CaO, Li2O, and ZnO at a predetermined ratio is preferably used. As the primary glass, a glass containing 70 to 90 percent by weight of SiO2, 15 to 20 percent by weight of B2O3, and 1 to 5 percent by weight of K2O can be used.

Abstract: A cooled current lead for conducting electrical current into a cooled vessel. The current lead comprises an electrical conductor (22) comprising a region (29) which, in use, is heated by electrical current flowing through it; a cooled component (31) situated above a the region (29) and which is provided with a path for removal of heat; and a thermo-siphon comprising a cavity (35) in thermal contact with both the region of the electrical conductor and the cooled component, said cavity containing a fluid (35).

Abstract: The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone (1, 17, 18) of a printed circuit board being connected via a layer of non-conducting material or a dielectric layer (13, 15) to at least one flexible zone (7) of the printed circuit board, the at least one rigid zone being connected to the flexible zone (7) of the printed circuit board, the rigid zone (1) of the printed circuit board then being cut through and a connection between the separate, rigid partial zones (17, 18) of the printed circuit board being established via the flexible zone (7) that is connected thereto. According to the invention, the connection between the at least one rigid zone (1, 17, 18) of the printed circuit board and the at least one flexible zone (7) of the printed circuit board is established by bonding prior to cutting the rigid zone.

Abstract: A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.

Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.

Abstract: An assembly for retaining a coil wire assembly in the pocket of an electronic assembly such as, for example, a sensor. The retaining assembly comprises a cover which is snap-fitted over the pocket to retain and prevent the movement of the coil assembly in the pocket. In one embodiment, the ends of the coil wire assembly are retained in respective grooves formed in the cover and also in respective grooves formed in respective terminals which extend into the pocket.

Abstract: An electrical power transmission system includes electrical insulators arranged to electrically isolate live power lines. Surface reconditioning units are incorporated or integrated in the insulator structures. A sensor arrangement determines surface conditions of the electrical insulators in use to isolate live power lines. In response, the surface reconditioning units automatically recondition the surfaces of the in-service electrical insulators if appropriate for maintaining the electrical insulators in healthy state.