Patents Examined by Hoa C. Nguyen
  • Patent number: 10735042
    Abstract: An information interface apparatus (27, 27a) in particular for an operator's platform (24) of an earth working machine (10), for example a road milling machine, recycler, stabilizer, or surface miner, having an interface subassembly (52) encompassing a housing (54) and a functional surface (56) that is received in the housing (54) and embodied to input and/or output information, is characterized in that the information interface apparatus (27, 27a) comprises a protective plate (58), embodied separately from the interface subassembly (52), to cover the functional surface (56); the protective plate (58) comprising an anchoring portion (64) with which the protective plate (58) is anchorable on a counterpart anchoring portion (68) of the interface subassembly (52) and the anchoring portion (64) is thus securable against removal from the functional surface (56); and the protective plate (58) comprising a latching portion (66), different from the anchoring portion (64), with which the protective plate (58) is relea
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 4, 2020
    Assignee: Wirtgen GmbH
    Inventors: Cyrus Barimani, Stephan Drumm
  • Patent number: 10736210
    Abstract: A circuit board includes a plurality of insulators provided horizontally side by side and at least one first electric conductor. A first accommodating space is formed between two adjacent ones of the insulators, and each of the two adjacent ones of the insulators is provided with at least one fixing portion in the first accommodating space. The first electric conductor is accommodated in the first accommodating space, and is retained in the fixing portions of the two adjacent ones of the insulators only at two sides thereof. The first electric conductor in the circuit board is used to transmit signals and surrounded with air, and compared with the conventional circuit board in which signals are transmitted through a dielectric layer, a signal transmission effect with ultra-low signal attenuation can be achieved.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: August 4, 2020
    Assignee: LOTES CO., LTD
    Inventor: Chin Chi Lin
  • Patent number: 10736207
    Abstract: A wiring assembly includes a differential input port, a differential output port, and first and second pairs of electrical conductors. The differential input port is configured to receive a differential signal from a sensor at a first end of the wiring assembly. The differential output port is configured to output the differential signal at a second end of the wiring assembly. The first and second pairs of electrical conductors are laid out in a three-dimensional (3D) crossover configuration relative to one another and configured to conduct the differential signal from the first end to the second end, and to cancel pickup of a magnetic field by the wiring assembly. The electrical conductors of each pair are connected to one another at the first end and at the second end.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: August 4, 2020
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Yevgeny Bonyak, Michael Levin, Eyal Rotman, Alek Vilensky
  • Patent number: 10736247
    Abstract: A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 4, 2020
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Gokul Murugesan, Santosh Kustagi, Raghuveer Hanumanthrao Desai, V Valiveti
  • Patent number: 10725117
    Abstract: Aspects of the present disclosure are directed toward detection of leakage from an enclosed component using an apparatus. The apparatus includes a printed circuit board (PCB) including a first conductive trace, a second conductive trace, and sets of terminals electrically connected to the first and second conductive traces configured and arranged to indicate changes in impedance caused by leaked liquid. The respective portions of the first and second conductive traces are interleaved, and configured and arranged to suspend flow of the leaked liquid from an enclosed component, thereby causing a change in impedance between at least one of the sets of terminals.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 28, 2020
    Assignee: Landis+Gyr Technologies, LLC
    Inventors: Verne Olson, Kevin Reinhart, Damian Bonicatto, Chris Palmer
  • Patent number: 10729004
    Abstract: A circuit board structure for preventing high-frequency signal leakage and a manufacturing method thereof are provided, in which the circuit board structure body includes a signal layer, a first ground layer, and a second ground layer. A first shielding film structure and a second shielding film structure are respectively covered on the upper surface and the lower surface of the circuit board structure body and are aligned and adhered, so that the upper surface, the lower surface and the entire board edge of the circuit board structure body are wrapped by the first shielding film structure and the second shielding film structure. The first shielding film structure includes a first conductive metal layer and a first insulating layer, and the second shielding film structure includes a second conductive metal layer and a second insulating layer.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: July 28, 2020
    Assignee: FOREWIN FPC (SUZHOU) CO., LTD.
    Inventor: Wally Weng
  • Patent number: 10720338
    Abstract: A low temperature cofired ceramic substrate comprises a plurality of dielectric layers, at least one inner conductor layer, a plurality of bond pads, and a solder mask. The dielectric layers are formed from ceramic material and placed one on top of another to form a stack. The inner conductor is formed from electrically conductive paste and positioned on an upper surface of at least one inner dielectric layer. The bond pads are positioned on an outer surface of the stack. Each bond pad is formed from a plurality of conductive sublayers of thin film metal stacked one on top of another, with each conductive sublayer being formed from a different metal. The solder mask is positioned on the same outer surface of the stack as the bond pads and includes a plurality of openings, with each opening exposing at least a portion of one of the bond pads.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: July 21, 2020
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Barbara Young, Randy Hamm
  • Patent number: 10712773
    Abstract: An electronic device may include flexible printed circuits. A flexible printed circuit may have metal traces supported by a polymer substrate. The flexible printed circuit may extend between an upper laptop computer housing and a lower laptop computer housing or other structures that move relative to each other in an electronic device. The flexible printed circuit may have a low-friction coating and a matte finish. The flexible printed circuit may have a fluoropolymer coating on the polymer substrate, a fluoropolymer coating on a matte coating on the polymer substrate, a fluoropolymer coating that includes a matting agent on the polymer substrate, a fluoropolymer layer or other polymer layer that is attached to the substrate with a layer of adhesive, a textured surface layer, and/or other structures that help provide the flexible printed circuit with desired physical properties and a desired appearance.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: July 14, 2020
    Assignee: Apple Inc.
    Inventors: Bryan W. Posner, Adam T. Garelli
  • Patent number: 10714148
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 14, 2020
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Patent number: 10709010
    Abstract: The present invention provides a flexible printed circuit, wherein the flexible printed circuit includes a substrate, a plurality of first terminals on the substrate, a plurality of second terminals on the substrate and a plurality of traces on the substrate. The plurality of traces is arranged for electrically connecting the plurality of first terminals to the plurality of second terminals, wherein the plurality of traces include at least one specific trace, the specific trace electrically connects a specific first terminal of the first terminals to two specific second terminals of the second terminals, the specific trace divides into two sub-traces at an increasing point, and a distance between the increasing point and the two specific second terminals are less than 5 mm.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: July 7, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Peng-Chi Chen, Kuan-Hung Lin, Mong-Hua Tu
  • Patent number: 10705577
    Abstract: The disclosure provides a cover, adapted to an electronic device. The electronic device includes a housing, and the housing includes an opening. The cover includes a plurality of creases. The cover forms a folding structure by folding along the creases, and the cover is detachably fixed to the housing to cover the opening.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: July 7, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wai-Tong Chan, Sin-Fei Lai, Szu-Tang Chiu
  • Patent number: 10709024
    Abstract: An interconnection system includes a first support surface positionable against a respective first surface of a first printed circuit board (PCB) and a second support surface positionable against a respective first surface of a second PCB. The first PCB has a respective second surface spaced apart from the respective first surface by a first thickness. The second PCB has a respective second surface spaced apart from the respective first surface by a second thickness. A separator extends from the first support surface and from the second support surface. A contact pin extends through the separator. A portion of the contact pin extending in first direction from the separator is spaced apart from the first support surface by a distance corresponding to the first thickness. A portion of the contact pin extending in a second direction from the separator is spaced apart from the second support surface by the second thickness.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: July 7, 2020
    Assignee: Universal Lighting Technologies, Inc.
    Inventors: Christopher Radzinski, Donald Folker
  • Patent number: 10705564
    Abstract: A housing according to one embodiment includes: a first member being part of an outer wall of the housing; a second member that is another part of the outer wall and includes a first portion overlapping with the first member in a first direction and being joined to the first member via an adhesive agent, and a second portion located at a different position from the first member in a second direction; a first positioning part that is provided at an edge of the first member and projects in the first direction, the edge being located in the second direction; a second positioning part into which the first positioning part is inserted, the second positioning part being provided at the first portion; and a first rib extending from the first positioning part along the edge and being interposed between the first member and the first portion.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: July 7, 2020
    Assignee: FUJITSU CLIENT COMPUTING LIMITED
    Inventor: Takashi Abe
  • Patent number: 10694622
    Abstract: A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: June 23, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Yoshimasa Yoshioka, Yoshinori Taguchi, Ryuichiro Tominaga
  • Patent number: 10693248
    Abstract: An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: June 23, 2020
    Assignee: Infineon Technologies AG
    Inventors: Katharina Teichmann, Alexander Herbrandt
  • Patent number: 10687415
    Abstract: A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: June 16, 2020
    Assignee: DALIAN CANGLONG OPTOELECTRONICS TECHNOLOGIES CO., LTD
    Inventors: Hao Wang, Shun Zhang, Lin Cui, Wenchen Zhang, Chuanwu Liao
  • Patent number: 10681817
    Abstract: Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: June 9, 2020
    Assignee: Intel Corporation
    Inventor: Brian J. Long
  • Patent number: 10681825
    Abstract: Provided is a display device which may include a display panel having a long side in a first direction, a short side in a second direction, and a thickness in a third direction, a back cabinet disposed in the rear of the display panel, and a case that covers an edge of a front surface of the display panel. The case may include a horizontal case that covers an edge of the front surface of the display panel on a long side of the display panel and a vertical case covering an edge of the front surface of the display panel on a short side of the display panel. The horizontal case and the vertical case may be coupled to each other in a region corresponding to a corner of the display panel, and the horizontal case and the vertical case may be formed of different materials.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: June 9, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Jein Lee, Seunggyu Kang, Jaehun Lee, Hyuncheol Cho
  • Patent number: 10674598
    Abstract: In one embodiment, an apparatus includes a printed circuit board, a via-stub resonator formed in the printed circuit board, a plurality of vias surrounding the via-stub resonator, and a microstrip connected to the via-stub resonator for use in measuring an insertion loss to provide a resonance frequency. The via-stub resonator is designed to reproduce a dielectric constant value of a known material in a simulation. A via dielectric constant in an x and y plane is calculated based on the resonance frequency. A method for measuring the via dielectric constant using the via-stub resonator is also disclosed herein.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: June 2, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: David Nozadze, Amendra Koul, Joel Richard Goergen, Mike Sapozhnikov
  • Patent number: 10674610
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: June 2, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin