Patents Examined by Hoa C. Nguyen
  • Patent number: 11369024
    Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: June 21, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takahiro Takano, Kazushi Ichikawa
  • Patent number: 11363712
    Abstract: A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 14, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Manho Kim, Keonyoung Seo, Jongwan Shim, Kwangsic Choi, Jaemin Ryoo, Hwajoong Jung, Kihuk Lee
  • Patent number: 11363735
    Abstract: A sealing assembly for electronic components including a sealing seat and a sealing shell for mounting the electronic component. The sealing shell is received through an opening in the top of the sealing seat and into complementary mounting chamber. A left end of the sealing shell includes a first connection channel; a left end of the mounting chamber includes a second connection channel and a sealing gasket surrounding the second connection channel. A right end of the mounting chamber includes an elastic latch. After installing the sealing shell in the mounting chamber, the elastic latch laterally abuts the sealing shell's right end and is in a lateral compression position, and the first connection channel and the second connection channel are aligned and in sealing communication through the sealing gasket. The elastic latch includes a right backstop to prevent the sealing shell from being vertically detached from the mounting chamber.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: June 14, 2022
    Inventors: Jiancang Wei, Shiliang Wu, Shujun Wang, Qing Tong
  • Patent number: 11361882
    Abstract: A wiring member includes a sheet material in which a weight reduction space is formed and a wire-like transmission member fixed on the sheet material. For example, the weight reduction space includes a bottomed hole. For example, the sheet material includes a first base material in which a base material side through hole passing through the first base material in a thickness direction is formed and a second base material overlapped with the first base material to cover the base material side through hole, and the base material side through hole which is partially covered by the second base material forms the bottomed hole.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: June 14, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Daichi Fukushima, Hiroki Hirai, Makoto Higashikozono, Housei Mizuno, Miyu Aramaki
  • Patent number: 11363717
    Abstract: For circuit boards that may be used in computing devices, a horizontal inductor, or an array of such inductors, may be coupled to a circuit board having a plurality of signal routing lines in a second layer from a surface of the circuit board and the horizontal inductor is positioned over these signal routing lines and may generate magnetic field lines that directionally follow the signal routing lines. The horizontal inductor may have a coiled wire with a central axis that is oriented horizontally with the surface of the circuit board. The horizontal inductor, or an array of such inductors, may be coupled to a support board attached to the circuit board.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: June 14, 2022
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Ranjul Balakrishnan
  • Patent number: 11363719
    Abstract: A wiring substrate includes a core substrate, and a build-up part laminated on the substrate and including resin insulating layers. The insulating layers include a first insulating layer, the build-up part includes a conductor layer on the first insulating layer, a second insulating layer on the first insulating layer and covering the conductor layer, and a recess penetrating through the second insulating layer and exposing portion of the conductor layer such that the conductor layer includes component mounting region that places an electronic component in the recess and a conductor pad forming bottom surface of the recess, the insulating layers include inorganic filler such that all insulating layers or all insulating layers other than the first insulating layer include the inorganic filler and that inorganic filler content rate of the first insulating layer is lower than inorganic filler content rate of the insulating layers other than the first insulating layer.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: June 14, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroyasu Noto, Kentaro Wada
  • Patent number: 11357110
    Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: June 7, 2022
    Assignee: TDK CORPORATION
    Inventors: Takeshi Oohashi, Shinichiro Toda, Daiki Kusunoki, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Patent number: 11355265
    Abstract: A cable is composed of a cable core including one or more electric wires, a braided shield covering a periphery of the cable core and including braided metal wires, a sheath covering a periphery of the braided shield, and a cushion layer provided between the cable core and the braided shield. The cushion layer is composed of a braid including braided linear shape fiber yarns.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: June 7, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Masashi Moriyama, Detian Huang, Yoshinori Tsukamoto
  • Patent number: 11348736
    Abstract: A DC link capacitor for a vehicle driven by an electric motor, assembly with a DC link capacitor and a vehicle driven by an electric motor with such an assembly.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: May 31, 2022
    Assignee: AUDI AG
    Inventor: Maximilian Schiedermeier
  • Patent number: 11342734
    Abstract: A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: May 24, 2022
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shun Takamizawa, Koki Uchida
  • Patent number: 11343903
    Abstract: A printed circuit board (100) includes a front layer (30) including frame ground regions (102a, 102b) on which connectors (202, 203) to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region (101) which is separated from the frame ground regions at the front layer, on which electronic devices (200, 201) configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region (103) separated from the frame ground regions (102a, 102b) and the signal ground region (101) at the front layer, situated outside the frame ground regions (102a, 102b), and connected with a ground.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: May 24, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yo Kobayashi, Koji Hirai
  • Patent number: 11343933
    Abstract: A circuit board includes a substrate, a plurality of electronic components disposed on the substrate, and at least one cable management structure. The substrate is provided with a first surface and a second surface. The first surface and the second surface are correspondingly disposed. The cable management structure is used for limiting a configuration direction of at least one cable. The cable management structure includes at least one cable management column and at least one cable collection member. The cable management column is disposed on the first surface of the substrate. The cable collection member is disposed at an edge of the substrate, and the cable management column is located beside the cable collection member. The cable is capable of bypassing the cable management column and passing through the cable collection member from the edge of the substrate to the second surface, to achieve cable management and positioning effects.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: May 24, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Wei-Chih Hsu, Pen-Uei Lu, Mao-Hsiang Huang
  • Patent number: 11343904
    Abstract: The present invention relates to a multi-functional platform, including: a printed circuit board (PCB) having a single chip integrated thereon; wherein the single chip includes a substrate having an environmental system disposed thereon, the environmental system including a plurality of three-dimensional (3D) printed, patterned and multi-layered nanostructures disposed on the substrate. The nanostructures include an on-chip heater, a power source, a wireless communication module, and a plurality of sensors, the sensors including at least one of a gas sensor, a pressure sensor, or a temperature sensor, each of which is directly deposited on the substrate and printed with a plurality of nanomaterials. The 3D patterned nanostructures use functionalized nanomaterials, which are patterned by a template using one of directed assembly or nano-offset printing, to deposit the nanostructures directly on the substrate of the single chip.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: May 24, 2022
    Assignee: United States of America as represented by the Administrator of NASA
    Inventor: Mahmooda Sultana
  • Patent number: 11343912
    Abstract: An electronic circuit apparatus according an aspect of the present disclosure includes a substrate, an electronic circuit disposed on the substrate, and metal patterns and formed on the same surface as a surface on which the electronic circuit is disposed, the metal patterns and being provided so as to be in an electrically floating state, in which the metal patterns and are disposed at places where they have a specified distance from the electronic circuit.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: May 24, 2022
    Assignee: NEC CORPORATION
    Inventor: Naoyuki Orihashi
  • Patent number: 11336080
    Abstract: Embodiments of a slotted grommet configured to manage a cable in an electrical cavity are provided. The slotted grommet includes a body structure having a first surface, a second surface opposite to the first surface, and a peripheral surface extending between the first and second surfaces. A first slot is formed in the first surface and extends through the body structure towards the second surface. The first slot defines a chamber having sidewalls in the body structure configured to hold a loop of the cable. The first slot has a first width that is less than a cross-sectional dimension of the cable such that the cable is pinched within the chamber between the first sidewalls to prevent vibration-related chafing of the cable.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: May 17, 2022
    Assignee: Woodward, Inc.
    Inventor: James D. Rosplock
  • Patent number: 11336079
    Abstract: The present invention concerns a transit for cables, a cable bundle (9) or a bus bar (12). The transit comprises a sleeve (1) having a through opening (2) for receiving the cables or the bus bar (12). The sleeve (1) is to be received in a through opening (5) of a partition (4). A glass fiber tissue hose (7) is placed going through the opening of the sleeve (1). The ends of the tissue hose (7) is wrapped back and placed on the outside of the sleeve (1). One or more intumescent strips (6) are placed between the inside of the sleeve (1) and the tissue hose (7). A fire retarding agent (10) is placed around and between the cables or around the bus bar (12).
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 17, 2022
    Assignee: Roxtec AB
    Inventor: Olaf Horn
  • Patent number: 11337302
    Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 17, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Takahiro Takano, Hiromoto Haruta, Shuichi Wakaki
  • Patent number: 11330702
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: May 10, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Patent number: 11328844
    Abstract: A wiring protection device includes a main body that defines a cavity for receipt of an associated lug of an associated wiring harness. The wiring protection device also includes a first locking member that is slidably received in the main body to define a lock, position that engages the associated lug to prevent removal of the associated lug from the main body and an unlock position that does not engage the associated lug and allows removal and installation of the associated lug out of and into the main body.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: May 10, 2022
    Assignee: SAFRAN ELECTRICAL & POWER
    Inventors: Hean Yew Choon, Abner Jaen Quezada Delgado
  • Patent number: 11328840
    Abstract: A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an outer surface of that crack suppressing layer. The crack suppressing layer is composed of a resin film to suppress the occurrence of a cracking in the plating layer by bending while moving in a longitudinal direction of the cable relative to a bending of the insulator.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: May 10, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Detian Huang, Takanobu Watanabe, Kimika Kudo