Abstract: A cable gland including a component and at least one contact element. The at least one contact element includes a plurality of substantially geometrically identically shaped windings. Each winding includes a retaining section for electrically contacting the component surrounding the contact element, at least one supporting section for electrically contacting a shield of a long-molded part, and a first and a second extending section. The retaining section, the first extending section and the at least one supporting section are arranged one after the other.

Abstract: Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

Abstract: The present disclosure relates to a printed circuit board including a first insulating layer, a pad embedded in an upper portion of the first insulating and having an upper surface portion, a side surface portion, and a lower surface portion, where a portion of the upper surface portion and a portion of the side surface portion protrude from the upper surface of the first insulating layer, and a metal layer covering the portion of the upper surface portion, the portion of the side surface portion, and a portion of the lower surface portion of the pad.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to embedding capacitors in through glass vias within a glass core of a substrate. In embodiments, the through glass vias may extend entirely from a first side of the glass core to a second side of the glass core opposite the first side. Layers of electrically conductive material and dielectric material may then be deposited within the through glass via to form a capacitor. the capacitor may then be electrically coupled with electrical routings on buildup layers on either side of the glass core. Other embodiments may be described and/or claimed.

Abstract: A flexible printed circuit flex-PCB sensor includes a sheet of electronically printable flexible material, sensor cells printed on said sheet and each including a sensitive element and a circuit. Each sensitive element is arranged to measure a predetermined physical parameter and to obtain an associated measurement signal. Each circuit is arranged to receive and process the measurements signal in order to obtain a corresponding output signal. Communication means are arranged to transmit the digital signals coming from said sensor cells to a remote processing circuit. The sheet is coiled according to a three-dimensional shape having a layered structure. Layers of said sheet are placed side by side and form a sensing border that is substantially perpendicular to the surface of said sheet. The relative position of each sensitive element and of each circuit inside the sensor relative to said sensing border depends on their relative position thereof.

Abstract: A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member. At least a part of the engraved mark portion is provided in a portion in which the resin member and the metallic shield plate overlap each other when the main surface is viewed in a plan view.

Abstract: The present disclosure relates to a printed circuit board assembly including a first circuit board including a first footprint, the first circuit board further includes a plurality of first vertical vias extending between a first side and an opposing second side; a second circuit board including a second footprint smaller than the first footprint, the second circuit board further includes a plurality of second vertical vias extending between a subsequent first side and an opposing subsequent second side; an adhesive layer coupling the first side to the subsequent first side; and a plurality of third vertical vias extending through the first side and the subsequent first side.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

Abstract: A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

Abstract: The present description concerns a device comprising at least one chip in a package, the package comprising a support, having the at least one chip resting thereon, and a protection layer covering the at least one chip, the support comprising a stack of layers made of an insulating material, a transformer being formed in the support by first and second conductive tracks.

Abstract: A housing for an electronic circuit comprises tub-shaped lower and upper parts and a rectangular printed circuit board, PCB. The lower part comprises PCB supports and molded position fixing formations on opposite inner walls and first parts of latching apparatuses, for connecting to the upper part, on opposite outer walls. The formations positionally fix the PCB by engaging into matching fixing slots therein. The PCB has, in each corner, a slot parallel to the inner walls with the supporting elements forming elongate, resilient tabs, the length of the slots greater than the spacing of the respective slot from the adjacent PCB edge. The upper part comprises pins protruding out of the plane of the edge and pressing the resilient tabs out of the PCB plane into the lower part, with the housing assembled, and, on opposite outer walls, second parts of the latching apparatus for connecting to the lower part.

Abstract: When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.

Abstract: A busbar structure with less stray inductance for a power module includes a radiator, a copper-clad ceramic substrate, a wafer, a plastic case, a positive busbar, a negative busbar and a potting compound. The copper-clad ceramic substrate is welded on the radiator. The wafer is welded on the copper-clad ceramic substrate. The plastic case is fixed on the radiator. The positive and negative busbars are packaged in the plastic case, and fixed on the copper-clad ceramic substrate by ultrasonic bonding. An electrical clearance between wafers as well as an electrical clearance between the positive and negative busbars are ensured by potting. A part of the positive busbar covers a part of the negative busbar. The part of the positive busbar and the part of the negative busbar extend from the inside of the plastic case to the outside of the plastic case.

Abstract: A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

Abstract: An electrically insulating gas composition comprises C3F7CN, in an amount between 22% and 70% by volume and one or more inert gas selected from the list consisting of nitrogen, carbon dioxide (CO2), air and argon.

Abstract: An electrical ground assembly for a vehicle component includes a bushing including an upper serrated surface and a lower serrated surface opposite the upper serrated surface, a ground strap including a terminal, and a fastener including a head portion, a shaft extending from the head portion, and a flange extending radially between the head portion and the shaft portion. The terminal is electrically connected to the bushing between the upper serrated surface and the lower serrated surface. The flange includes a lower serrated surface configured to mate with the upper serrated surface of the bushing.

Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.

Abstract: Provided is a harness body that is a wiring component that electrically connects a first electrical connection target installed on a slide door and a second electrical connection target installed on a vehicle body, and is wired along a link mechanism that couples the slide door and the vehicle body and reciprocates the slide door in a sliding direction with respect to the vehicle body; and a harness temporary holding structure at least at one position capable of temporarily holding the harness body assembled to the link mechanism before the link mechanism is assembled to the slide door and the vehicle body.