Patents Examined by Hoa C. Nguyen
  • Patent number: 11032906
    Abstract: Provided are a control device for unmanned aerial vehicle and an unmanned aerial vehicle. The control device for unmanned aerial vehicle includes a shell, an inertial measurement device fixed in the shell, a main flight control circuit board electrically connected to the inertial measurement device, and a flexible interface board electrically connected to the main flight control circuit board and appressed against the inwall of the shell. At least one external device is connected to two opposite sides of the flexible interface board through the shell.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: June 8, 2021
    Assignee: Shanghai Topxgun Robotics Co., Ltd.
    Inventors: Liangliang Yin, Lianjie Gao, Shaobin Li, Yu Zhang
  • Patent number: 11032929
    Abstract: An example electronic device may comprise a first housing including a first surface and a second surface facing in a direction opposite the first surface, a second housing including a third surface and a fourth surface facing in a direction opposite the third surface, a hinge disposed between the first housing and the second housing configured to provide rotational motion between the first housing and the second housing, and a flexible display disposed from the first surface of the first housing across the hinge to the third surface of the second housing, at least part of the flexible display configured to form a curved surface as the hinge structure is folded, wherein the hinge may include dual-axis hinges configured to provide a first rotational axis allowing the first housing to rotate about the second housing and a second rotational axis allowing the second housing to rotate about the first housing and slides coupled with the first housing and the second housing and configured to provide sliding motion pe
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung-Keun Yoo, Jung-Jin Kim, Jong-Yoon Kim, Gi-Dae Kim, Young-Sun Park, Moo-Hyun Baek, Hyun-Woo Sim
  • Patent number: 11019718
    Abstract: A highly efficient, multi-layered, single component sided circuit board layout design providing reduced parasitic inductance for power switched circuits. Mounted on the top board are one or more transistor switches, one or more loads, and one or more capacitors. The switches and capacitors form a loop with very low parasitic inductance. The loads may be a part of the loop, i.e. in series with the switches and capacitors, or may be connected to two or more nodes of the loop to form additional loops with common vertices. Parallel wide conductors carry the switch load current resulting in a low inductance path for the power loop. The power loop and gate loop current travel in opposite directions and are well separated, minimizing common source inductance (CSI) and maximizing switching speed.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 25, 2021
    Assignee: Efficient Power Conversion Corporation
    Inventors: John S. Glaser, Michael A. de Rooij
  • Patent number: 11019723
    Abstract: The present application discloses a stretchable electrode, an electronic device and a manufacturing method thereof. The stretchable electrode includes a substrate, an electric conductive area and an electronic device integration area; the substrate has a first elastic layer and a second elastic layer with different elastic moduli. The electronic device produced by using the afore-mentioned stretchable electrode can be stretched entirely, and when it is stretched, the electronic device would not be damaged and the variation of its impedance is small. Tests have shown that the electric conductive layer can be stretched by more than 20%, with the variation ratio of its impedance being less than 1.5%, and no damage is caused to the electronic device.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: May 25, 2021
    Assignees: KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD., KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
    Inventors: Tao Wang, Xuna Li, Feng Zhai, Songlin Jia, Weigao Cheng, Yalei Ren
  • Patent number: 11017915
    Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 25, 2021
    Assignee: Carnegie Mellon University
    Inventors: Carmel Majidi, Chengfeng Pan, Kitty Kumar
  • Patent number: 11013114
    Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 18, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon-Ha Kang, Sa-Yong Lee, Mi-Sun Hwang, Ju-Ho Kim
  • Patent number: 11013155
    Abstract: Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: May 18, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilju Mun, Hosuk Kang
  • Patent number: 11011315
    Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: May 18, 2021
    Assignee: TDK CORPORATION
    Inventors: Michihiro Kumagae, Kazuhiro Yoshikawa, Shigeaki Tanaka, Hitoshi Saita
  • Patent number: 11006522
    Abstract: Textile material having conductive elements for an interior of a vehicle includes a flat textile substrate having a first surface and an opposite second surface. At least one conductor track formed of a conductive paint is printed onto the first surface. At least one sensitive element, which is electrically conductively connected to the conductor track on the first surface, is arranged on the second surface.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 11, 2021
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Moritz Anton, Sophie Richter, Martin Schmid
  • Patent number: 10998250
    Abstract: A bonded body is formed to configured to join a ceramic member formed of a Si-based ceramic and a copper member formed of copper or a copper alloy, in which, in a joint layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on the ceramic member side.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: May 4, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Patent number: 10993324
    Abstract: A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: April 27, 2021
    Assignee: International Business Machines Corporation
    Inventors: Charles Leon Arvin, Mark K. Hoffmeyer, Kevin Drummond, Chris Muzzy
  • Patent number: 10986746
    Abstract: A power supply device with PCB-positioning features includes a casing, a PCB (Printed Circuit Board) and at least one pair of slots. The casing defines an accommodating space and has at least one opening. The PCB is disposed in the accommodating space and has electronic elements thereon. The at least one pair of slots is disposed at inner walls of the casing for positioning the PCB. A gel-fillable channel is defined between the electronic elements and the inner walls of the casing.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 20, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Po-Heng Chao, Jui-Ching Lee, Ching-Ho Chou
  • Patent number: 10986731
    Abstract: A display device includes a display module foldable with respect to a bending axis, an adhesive member which is disposed under the display module, a plurality of support members adhered to the adhesive member, and a crack preventing pattern layer adhered to a portion of the adhesive member, which overlaps the bending axis. The crack preventing pattern layer includes a plurality of crack preventing members spaced from each other. Each of the crack preventing members includes a metal or an inorganic material and is in contact with the adhesive member.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: April 20, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jaiku Shin, Hansun Ryou, Sung Chul Choi
  • Patent number: 10980111
    Abstract: A circuit board and a display device are disclosed. The circuit board includes an insulating layer and a metal foil layer. The metal foil layer is disposed on a surface of the insulating layer. The insulating layer comprises the graphene. The insulating layer comprises a glass felt semicured layer and a glass cloth semicured layer. The glass felt semicured layer and the glass cloth semicured layer are stacked. The glass felt semicured layer includes a glass felt layer and a high thermal conductive adhesive layer covering a surface of the glass felt layer. The glass cloth semicured layer comprises a glass cloth layer and the high thermal conductive adhesive layer covering a surface of the glass cloth layer. The high thermal conductive adhesive layer comprises the graphene, and the glass felt semicured layer and the glass cloth semicured layer also comprise the graphene.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: April 13, 2021
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Qiong Wu
  • Patent number: 10980138
    Abstract: A memory card comprising a first main surface and a second main surface opposing each other, and including a printed circuit board (PCB) constituting the first main surface, the PCB including a plurality of first external connection terminals, the plurality of first external connection terminals exposed on the first main surface, a plurality of memory devices stacked on the PCB, a memory controller configured to control the plurality of memory devices, a molding layer encapsulating the plurality of memory devices and the memory controller, the molding layer constituting the second main surface, and one or more second external connection terminals electrically connected to the memory controller, the one or more second external connection terminals embedded in the molding layer and exposed by the molding layer on the second main surface may be provided.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Seok-jae Han
  • Patent number: 10973120
    Abstract: An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which ‘a’ is an atom content of the coordinate bond element and ‘b’ is an atom content of the radical generation element.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Junghyun Lee, Changhyun Yoon, Seong-Chan Park, Choonkeun Lee, Youngju Lee
  • Patent number: 10973130
    Abstract: A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: April 6, 2021
    Assignee: FANUC CORPORATION
    Inventor: Shinichirou Hayashi
  • Patent number: 10973121
    Abstract: The embodiments of the present disclosure relate to the technical field of manufacturing display device, and disclose a backlight golden finger structure and a display device. The backlight golden finger structure includes: a plurality of golden finger bodies, one end of each golden finger body being configured to be connected with a backlight flexible circuit board, the other end of each golden finger body being overhung and configured to be connected with a display panel flexible circuit board at a first surface of the backlight golden finger structure; and a first covering film disposed on the first surface of each golden finger body, an edge of the first covering film adjacent to the overhung end of the golden finger body being in a curved shape.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 6, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Junqi Huai, Ermao Zhang, Songsong Shi, Pengxin Liu, Jun Sheng
  • Patent number: 10959319
    Abstract: A cooling package in a power module comprises a first side for placing one or more semiconductor components; one or more holes for placing one or more magnetic components; and a second side with one or more connection parts. Therefore, all components of a power module which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 23, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Tai Ma, Peihua Li
  • Patent number: 10952326
    Abstract: A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: March 16, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Yoshimasa Yoshioka, Yoshinori Taguchi, Ryuichiro Tominaga