Abstract: Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

Abstract: Provided is a method of manufacturing an electrode plate for a plasma processing apparatus for forming a plurality of gas holes having a straight portion exceeding 12 mm in length in a thickness direction of an electrode plate main body in a penetrating state and in parallel to each other, the method including: a prepared hole forming step of forming a prepared hole with a diameter of 50% or more and 80% or less of a diameter of a hole forming the straight portion with a first drill from one surface of the electrode plate main body; and a straight portion forming step of forming the straight portion to overlap the prepared hole with a second drill.

Abstract: A submersible component can include a conductor; and a polymeric material disposed about at least a portion of the conductor where the polymeric material includes at least approximately 50 percent by weight polyether ether ketone (PEEK) and at least 5 percent by weight perfluoroalkoxy alkanes (PFA). A submersible electrical unit can include an electrically conductive winding; and a polymeric composite material disposed about at least a portion of the electrically conductive winding where the polymeric composite material includes polymeric material at at least approximately 40 percent by volume and one or more fillers at at least approximately 10 percent by volume.

Abstract: An electronic device includes a first component carrier having a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, a second component carrier having a second stack with at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and an intermediate structure including at least three staggered electrically conductive and coupled vertical interconnect elements in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier.

Abstract: A smart pole assembly for a telecommunication network, a cabinet for enclosing computing equipment, and a method for installing computing equipment in a cabinet are disclosed. The smart pole assembly includes a cabinet and a case movably coupled to the cabinet and configured for receiving computing equipment. The case is movable between a first position and a second position. The first position is a service position in which the case is at least in part external to the cabinet, and the second position is a working position in which the case is within the cabinet in a rotated orientation relative to the first position. A method for installing computing equipment in a cabinet includes inserting computing equipment into the case that is in the first position and moving the case to the second position such that the case and computing equipment are in the rotated orientation within the cabinet.

Abstract: A containing device equipped with: a casing formed in a substantially polyhedral shape, the casing having six substantially quadrilateral faces facing mutually different directions; and a containing part formed in the casing, the containing part containing a contained object so as to be insertable/removable. An opening continuous with the containing part, or a peripheral edge part of an opening continuous with the containing part, is disposed at a position corresponding to a first side, which is one of a plurality of sides constituting a polyhedron that corresponds to the casing.

Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.

Abstract: A grommet assembly includes a grommet attached to a through hole formed on a panel, an inner member supported by the grommet, and a protector that is attached to the panel while covering the grommet and the inner member. The grommet includes a supporting part that supports the inner member. The supporting part includes a first extending part that extends from an outer side toward an inner side in a radial direction to be held between the inner member and the protector, and a second extending part that extends in an axial direction while being bent from the first extending part to be held between the inner member and the protector.

Abstract: A conductor shielding termination assembly can include a housing tube defining an inner diameter housing channel therethrough. The housing tube can be made of conductive material. The assembly can include a shoulder bushing configured to insert within the inner diameter housing channel of the housing tube. The shoulder bushing can define an inner diameter bushing channel sized to receive an unshielded portion of a conductor. The assembly can include a clamping assembly configured to clamp around the housing tube and/or the conductor to axially lock the housing tube and the conductor and to trap a shielding termination between the housing tube and the clamping assembly. The clamping assembly can form a clamping inner diameter channel sized to receive a shielded portion of the conductor.

Abstract: A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.

Abstract: A right angle adapter assembly for mounting a surveillance camera to an eave includes a junction box that has an open end and an exit. The open end is positionable against an eave of a roof to insertably receive electrical wiring. A coupling pipe removably engages the exit in the junction box. A mounting disk is provided that has a mounting face and the mounting disk is attachable to the coupling pipe having the mounting face lying on a horizontal plane. In this way a surveillance camera can be mounted to the mounting face thereby facilitating the surveillance camera to be mounted to the eave of the roof according to manufacturer's recommendations.

Abstract: A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.

Abstract: A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

Abstract: A housing assembly is described that includes a first member, a second member having an opening formed therein, and a gasket interposed between the first and second members. The first and second members are attached, a gap between the attached first and second members is exposed by the opening formed in the second member, and a dimension of the gap is indicative of a condition of a seal by the gasket of the second member to the first member.

Abstract: An electronic device is disclosed. The electronic device includes a carrier, a computing element disposed over the carrier, and a first data storage element disposed over the carrier and electrically connected with the computing element through the carrier. The computing element is configured to receive a first power provided from the first data storage element.

Abstract: A resilient substrate structure, which can be rolled up around an axis, includes a substrate, a working patterned layer and a resilient structure. The substrate has a first surface and a second surface. The substrate is defined with a first edge and a second edge in a direction parallel to the axis. The working patterned layer is arranged on the substrate. The resilient structure is arranged on the second surface. The resilient structure includes a composite layer and a supporting layer, which keep attaching to each other. The composite layer has curve-able segments, each of which is parallel to the axis and connects to the first and second edges. The resilient structure is transformed to contain multiple wavy segments when the resilient substrate structure is at the retraction state. An electronic device including the resilient substrate structure and electronic elements is also disclosed.

Abstract: An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

Abstract: A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.

Abstract: The present invention provides a power cable system prefabricated in a building structure, the building structure contains at least one floor, and each floor has at least one starting column, a plurality of main beams and a plurality of auxiliary beams, the main beams are connected with the starting column, and the auxiliary beams are respectively connected with the main beams and the starting column; wherein main wires, first secondary wires, second secondary wires, and third secondary wires are correspondingly prefabricated on the starting column, the main beams, and the auxiliary beams respectively. Through those structure, the workers can quickly construct a power cable system while construct the beam-column system, which can significantly improve the construction efficiency.