Abstract: A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.

Abstract: A multiple layer printed circuit board including a plurality of layers, vertical interconnect accesses (VIAs), and a vertical interconnect access (VIA) bridge. The layers may include signal layers, prepreg substrate layers disposed between the signal layers, ground plane layers, wherein each of the ground plane layers abuts one of the prepreg substrate layers, inner signal layers, wherein each of the inner signal layers abuts one of the prepreg substrate layers, and a core substrate layer disposed between the signal layers, wherein two of the inner signal layers abut opposed sides of the core substrate layer. The VIAs extend through at least some of the layers, wherein each of the VIAs is formed by aligned apertures through adjoining ones of the prepreg substrate layers, ground plane layers, and inner signal layers. The VIA bridge is coupled to the VIAs to convey heat to a heat sink.

Abstract: An apparatus includes a strength member including a core formed of a composite material, and an encapsulation layer disposed around the core. A conductor layer is disposed around the strength member. A coating is disposed on the conductor layer. The coating is formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius. The coating may have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.

Abstract: A high frequency module includes a mounting substrate, an inductor, and a plurality of electronic components. The inductor is arranged on the mounting substrate. The inductor is arranged in an inside of the mounting substrate and has a winding portion formed by winding a conductor portion a plurality of times in a thickness direction of the mounting substrate. A first ground layer is formed in a region that is on an inner side of an outer edge of the winding portion in plan view of the mounting substrate, and the first ground layer is arranged closest to the winding portion in the thickness direction of the mounting substrate among ground layers formed in the region in a plurality of ground layers. The first ground layer is overlapped with an inner region but is not overlapped with at least part of the winding portion in plan view of the mounting substrate.

Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

Abstract: A wiring member includes: a sheet; a plurality of first wire-like transmission members disposed on the sheet; and at least one second wire-like transmission member intersecting with at least two of the plurality of first wire-like transmission members. A length dimension of the first intersection section where the second wire-like transmission member intersects with each of at least two of the plurality of first wire-like transmission members is larger than a maximum fixation interval except for the first intersection section in a fixation interval of the second wire-like transmission member. The second wire-like transmission member is located closer to a side of the sheet in relation to at least two of the plurality of first wire-like transmission members in the first intersection section.

Abstract: An information handling system includes a printed circuit board, which in turn includes a differential pair, a ground trace, and a ground via. The differential pair includes first and second traces. The ground trace is routed between the first and second traces of the differential pair. The ground via is located along the ground trace. The ground trace and the ground via combine to create a common mode signal filter, which in turn resets a skew of the differential pair.

Abstract: A waterproof seal for electrical assemblies wherein an outer sheath of an electrical cable is removed to expose the wires and the insulation is removed from the wires to form a window of exposed electrical conductor, the electrical conductors being maintain apart from each other and contained in a cover that may comprise a connector, an epoxy applied to the electrical conductors to fill in all the space in and around the electrical conductors and the cover to form a waterproof seal that prevents water from wicking past the waterproof seal via an interior of the electrical cable.

Abstract: The present disclosure relates to a display apparatus and an electronic device, relating to the technical field of display. The display apparatus may comprise a display panel, a main circuit board, a bridging circuit board, and a first shielding adhesive tape. The main circuit board may be provided on the back surface of the display panel; the bridging circuit board may be provided at the side of the main circuit board distant from the display panel, and may be connected to the main circuit board in a binding mode; and the first shielding adhesive tape may be provided at the side of the main circuit board distant from the display panel, and expose the bridging circuit board.

Abstract: Object There is provided a molded article or an electrical product in which layout of a member up to an external connection terminal for electrical connection of a circuit film integrally molded with the molded body is easy. Solution means A molded body 30 includes one main surface 31 with which a circuit film 20 is integrally molded, and another main surface 32 facing the one main surface 31. A flexible printed wiring board 40 includes an internal connection terminal 41 electrically connected to an electrical circuit of the circuit film 20, an external connection terminal 42 exposed outside from the other main surface 32 of the molded body 30, and a flexible wiring line 43 connected to the inner connection terminal 41 and the external connection terminal 42, passing through an inside of the molded body 30, and extending so as to reach the other main surface 32.

Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.

Abstract: A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. A component is embedded in the at least one rigid portion. A transition region between the at least one semi-flexible portion and the at least one rigid portion of the component carrier has a slanted sidewall.

Abstract: According to one embodiment, a flexible substrate includes an insulating base including a first surface and a second surface on an opposite side to the first surface, a wiring layer provided on the second surface side of the insulating base and a resin layer including a support located on the first surface side of the insulating base and a coating layer located on the second surface side of the insulating base, the resin layer including a first area and a second area in planar view, the resin layer having a first elastic modulus in the first area and a second elastic modulus in the second area, and the first elastic modulus being greater than the second elastic modulus.

Abstract: An in-line power device, a semiconductor assembly, an in-wheel motor driver or a vehicle driver, and a new-energy vehicle are provided. The in-line power device includes: a body including a power chip and a wrapping layer wrapping an outer surface of the power chip; and a plurality of pins provided at a first side of the body at intervals. The plurality of pins includes a power pin, an auxiliary control pin and a control signal pin, and each pin includes a first segment provided inside the wrapping layer and a second segment provided outside the wrapping layer. The second segment of the auxiliary control pin and the second segment of the control signal pin are located in a first plane, the second segment of the power pin and the first side are located in a second plane, and the first plane is not parallel to the second plane.

Abstract: An electrical pass-through assembly for traversing a structure includes a sleeve defining a fixed end, a locked end, a passage extending between the fixed end and the locked end, a mating feature disposed on the fixed end, and a locking feature disposed on the locked end. The electrical pass-through assembly also includes a fitting configured to attach the structure. The fitting includes an inner surface defining an opening shaped to receive the fixed end of the sleeve. A corresponding mating feature is disposed along the inner surface of the fitting and engages with the mating feature disposed at the fixed end of the sleeve to prevent relative rotation between the fitting and the sleeve. The electrical pass-through assembly also includes a locking retainer including a corresponding locking feature that securely engages with the locking feature disposed at the locked end of the sleeve.

Abstract: The present invention concerns a power cable, comprising a tension member (1), placed in the centre of said power cable; a first insulation layer (3), the tension member (1) being embedded in the first insulation layer (3); and an outer protective sheath (9); wherein said power cable further comprises one or more first aluminum conductors (4), embedded within the first insulation layer (3). The present invention also concerns a process for producing the inventive power cable, the process comprising the step of extruding a first polymeric insulation layer (3) onto the tension member (1) and the one or more conductors (4) in one single step. Finally, the present invention concerns the use of the inventive power cable, in medium-voltage to high-voltage subsea applications, such as an offshore windmill cable infrastructure or driving of subsea pumps.

Abstract: An example tap off box is provided that includes a housing, a circuit breaker, a door, and a breaker actuator. The housing includes walls forming an internal enclosure. The circuit breaker is disposed within the housing. The door is secured to the housing to define a housing assembly, the housing assembly enclosing the circuit breaker. The breaker actuator includes a distal end and a proximal end, the distal end coupled to the circuit breaker within the housing assembly, and the proximal end extending outside of the housing assembly. The breaker actuator is capable of being moved at the proximal end to selectively toggle the circuit breaker from at least an ON position to an OFF position.

Abstract: An exemplary embodiment of the present disclosure provides an electric utility pole, comprising a beam, a base, and an arm. The beam can be formed from a retired turbine blade and can comprise a first end and a second end. The base connected to the first end of the beam. The arm can be connected to the beam. The arm can be configured to support at least one electrical conductor.

Abstract: An electronic component embedded substrate includes: an insulating material including a cavity formed in one surface thereof; a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity; solders disposed on side surfaces of the cavity; and an electronic component disposed in the cavity and at least partially in contact with the solders, wherein the protective layer has a material different from that of the insulating material.

Abstract: A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.