Patents Examined by Hoa C. Nguyen
  • Patent number: 10674648
    Abstract: Provided is a high-frequency module capable of improving a shielding performance for a specific component. In a high-frequency module 1a, a component 3c that is mounted on a top surface 20a of a multilayer wiring board 2 is surrounded by a shield film 6 coating a surface of a sealing-resin layer 4, a plurality of metallic pins 5a arranged in the sealing-resin layer 4 so as to surround the component 3c, an outer electrode 8c formed on a bottom surface 20b of the multilayer wiring board 2 so as to be located at a position that overlaps with the component 3c when viewed in a direction perpendicular to the top surface 20a of the multilayer wiring board 2, and a plurality of connection conductors (via conductors 10b and pad electrodes 11) connecting the metallic pins 5a and the outer electrode 8c to one another.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: June 2, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshihito Otsubo
  • Patent number: 10674610
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: June 2, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin
  • Patent number: 10664015
    Abstract: Disclosed is a foldable display apparatus in which a crack prevention layer is disposed on a surface of a display panel. The crack prevention layer includes thin film pattern portions disposed along a folding axis of the foldable display apparatus.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 26, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jaihyuk Choi, Sukwon Jung, Myungsoo Huh
  • Patent number: 10667409
    Abstract: A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: May 26, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Heiner Jacobs, Martin Rittner, Ulrich Kessler
  • Patent number: 10667411
    Abstract: A multi-panel display device includes: a first display device and a second display device each including a display panel, a back cover configured to cover a rear surface of the display panel, and a back cover housing configured to cover a rear surface of the back cover, a first cabinet on which the first and second display devices are supported and attached, and a fine adjustment device positioned on a rear surface of each of the first and second display devices exposed to a rear surface of the first cabinet, wherein the fine adjustment device is connected to the back cover of each of the first and second display devices and exposed to the outside through an adjustment device hole provided in the back cover housing, and positions of the back cover and the display panel are finely adjusted by the fine adjustment device.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: May 26, 2020
    Assignee: LG DISPLAY CO., LTD
    Inventors: Hee-Jong Shin, Han-Seok Kim, Sung-Hwan Yoon
  • Patent number: 10667436
    Abstract: New heat removal systems and methods allow a combination of active and passive thermal processes for removing heat from and cooling air in environments. Systems and methods include a heat removal system including an adjustable thermal feed cold air intake system, a distribution system for cold and warm air including one or more hot aisles and one or more cold aisles, and a convection system to draw cool air through the building using a naturally-occurring convection processes to expel hot air. Misters, cooling elements, and/or freezer boxes may further cool the intake of air. A controller is programmed to efficiently manage and control the climate (e.g., temperature, humidity, air flow, pressure, air quality, etc.) within a building to minimize the use for energy for air distribution and cooling.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: May 26, 2020
    Inventors: Dale LeFebvre, Kenneth Choi
  • Patent number: 10667381
    Abstract: A high frequency module includes a plurality of components on an upper surface of a multilayer wiring substrate, a sealing resin layer on the upper surface of the multilayer wiring substrate, a shield wall surrounding one of the components within the sealing resin layer, and a shield film on an upper surface of the sealing resin layer. The shield film covers a portion of the upper surface of the sealing resin layer that overlaps the one of the components but not the other components viewed from a direction perpendicular to the upper surface of the multilayer wiring substrate. An upper end of the shield wall is exposed from the upper surface of the sealing resin layer to be connected to the shield film, and a lower end thereof is exposed from a lower surface of the sealing resin layer to be connected to the multilayer wiring substrate.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 26, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshihito Otsubo
  • Patent number: 10660246
    Abstract: An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: May 19, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Mei-Hsueh Huang, Jr-Hung Huang, Wen-Cheng Tsai
  • Patent number: 10660207
    Abstract: A circuit module includes a substrate on which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer. The first electrode includes a first electrode base body and a first plating film. The second electrode and the first electronic component are covered with the first resin layer. The second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side relative to an outer surface of the first resin layer, a second plating film with a cylindrical shape covering a side surface of a connection body of the second electrode base body and the metal column, and a covering portion connected to the other end of the metal column.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 19, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takafumi Kusuyama
  • Patent number: 10653019
    Abstract: A substrate unit includes a circuit board; a connector portion mounted on the circuit board; and a case that contains the circuit board. The case includes a lower case having an accommodation section opened upward and accommodating the circuit board. An upper cover covers the accommodation section of the lower case. An aperture is opened in a side wall of the case, allowing the connector portion to be fitted to a counterpart connector portion. The upper cover includes a ceiling portion having a board opposing region that opposes the circuit board accommodated in the accommodation section and an outer region is located outside of the board opposing region without opposing the circuit board; and guide grooves inclined from the board opposing region to the outer region. The guide grooves discharging the water droplets away from the circuit board.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 12, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Koki Uchida
  • Patent number: 10645819
    Abstract: A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: May 5, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Toshihide Makino, Yasushi Usami
  • Patent number: 10638614
    Abstract: A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.
    Type: Grant
    Filed: August 26, 2018
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuk-jin Lee, Kyu-deuk Kim, Jae-young Hong
  • Patent number: 10627863
    Abstract: Systems and methods for auto-aligning protruding connectors in docking interfaces are described. In some embodiments, a docking interface may include a male portion comprising: a first magnetic device, a second magnetic device disposed across from the first magnetic device, and a guidepost disposed between the first magnetic device and the second magnetic device, where the guidepost comprises a third magnetic device. The docking interface may also include a female portion comprising a fourth magnetic device and a fifth magnetic device disposed across from the fourth magnetic device leaving a gap between the fourth magnetic device and the fifth magnetic device, where the gap is configured to receive the guidepost.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: April 21, 2020
    Assignee: Dell Products, L.P.
    Inventors: Timothy C. Shaw, Bradford Edward Vier, Timothy M. Radloff
  • Patent number: 10627662
    Abstract: A panel module includes a bonding resin layer between a first main face of a first substrate and a second main face of second substrate, and a bond made of cured adhesive. At least a part of an outer end face of the bonding resin layer is located inner than an outer end face of the first substrate and an outer end face of the second substrate. The bond has a stronger bonding force and a higher elasticity than the bonding resin layer. The bond is attached to a first region of the first main face and a second region of the second main face in an area outer than the bonding resin layer. The bond is attached to a third region of the outer end face of the second substrate and a fourth region of the first main face.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: April 21, 2020
    Assignee: TIANMA JAPAN, LTD.
    Inventors: Akira Fujita, Akira Suzuki, Yoshiro Kitagawa
  • Patent number: 10631402
    Abstract: A flexible display device and a mobile terminal including the same are provided, whose portability is improved, and which enable diverse choices of the screen sizes. The flexible display device includes a receptacle mechanism and a flexible display screen, wherein the receptacle mechanism includes a first end cap and a second end cap opposed to each other, a spool pivotally mounted on the first end cap and the second end cap, a ratchet fixedly connected to the spool, a pawl hinged to the first end cap, a pretension spring abutting the first end cap and the pawl respectively, and a reset spring fixedly connected to the spool and the second end cap respectively. The flexible display screen includes a first lateral edge and a second lateral edge opposed to each other, and the first lateral edge is fixedly connected to the spool.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: April 21, 2020
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Desheng Xiang, Yanming Wang, Jiaqiang Wang, Rui Liu, Cheng Chang, Jian Ren
  • Patent number: 10622386
    Abstract: The embodiments of the present invention provide a substrate, a chip on film and an electronic equipment. The substrate includes a plurality of first bonding pads arranged side by side along a first direction. Each first bonding pad has a first side edge and a second side edge arranged oppositely, which are arranged along the first direction. A third side edge and a fourth side edge of the first bonding pad are arranged oppositely and arranged along a second direction perpendicular to the first direction. The first side edge and second side edge of each first bonding pad are not parallel to each other.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: April 14, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hong Li, Liqiang Chen, Weifeng Zhou
  • Patent number: 10624203
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 14, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.
    Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang
  • Patent number: 10624207
    Abstract: A touch sensor of this disclosure includes: a printed circuit board having a connection terminal; a substrate portion having a mounting portion on which the printed circuit board is mounted; a conductive layer disposed on the mounting portion of the substrate portion; and an adhesive agent connecting the connection terminal and the conductive layer to each other. A plurality of linear projections arranged in a first direction and extending in a second direction intersecting with the first direction are disposed on a surface of the substrate portion at the mounting portion, and the conductive layer is disposed on a groove portion positioned between the linear projections disposed adjacently to each other out of the plurality of linear projections.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: April 14, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tsutomu Aisaka, Hirotoshi Watanabe, Shigeki Sato
  • Patent number: 10613584
    Abstract: A display device includes: a device body; a first display screen; and a second display screen, wherein the device body includes a first region for receiving the first display screen and a second region for receiving the second display screen, and the first display screen and the second display screen collectively cover a surface of the device body, and wherein the second region is provided with at least one functional module, and the second display screen is movable relative to the device body to expose or cover the at least one functional module.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 7, 2020
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Gaowei Chen, Jiaqiang Wang, Yanchao Zhang, Jianwu Wu, Jianye Tang, Desheng Xiang, Shuainan Liu, Junjie Xu, Fuan Zhu
  • Patent number: 10617028
    Abstract: A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 7, 2020
    Assignee: AEROVIRONMENT, INC.
    Inventor: William John Nicoloff