Abstract: An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

Abstract: A circuit assembly that includes a circuit board, a switching element that is mounted on one side of the circuit board, a folded portion that extends from a peripheral edge portion of the circuit board and is folded towards the one side, and a temperature measuring device that is mounted on the folded portion and is in contact with the switching element.

Abstract: A mechanical fastener couples the J box the support structure above through bores disposed at the roof of the J box. At least one such bore can be slotted. The J box can have a plumbing tool coupled. The plumbing tool can be detachable. The J box or the J box and the J box cover can have at least one knock out opening for power or power and data conductor/s conveyance.

Abstract: Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

Abstract: A submersible component can include a conductor; and a polymeric material disposed about at least a portion of the conductor where the polymeric material includes at least approximately 50 percent by weight polyether ether ketone (PEEK) and at least 5 percent by weight perfluoroalkoxy alkanes (PFA). A submersible electrical unit can include an electrically conductive winding; and a polymeric composite material disposed about at least a portion of the electrically conductive winding where the polymeric composite material includes polymeric material at at least approximately 40 percent by volume and one or more fillers at at least approximately 10 percent by volume.

Abstract: A Z-bracket is adapted for mounting an electrical box to the open face of a metal stud. The invention has two mounting platforms with self-tapping screw holes. The flat brackets of an electrical box are secured to these mounting platforms. The invention has a retaining tab with at least one retaining indentation for screwing the retaining tab to the open face of a metal stud. A connector connects the retaining tab to the mounting platforms. The front edge of each mounting platform has a groove, which accommodates the tongue on a tab of the metal stud. Multiple triangular braces connect the mounting platforms to the connector for structural support. The invention is sized to fit a standard metal stud, providing an improved method for attaching electrical boxes to the open face of a metal stud.

Abstract: A directional coupler includes a substrate, a main line 121, a main line 122, and a sub-line. The main line 121 and the main line 122 each include a conductor pattern formed in the substrate, and are connected in parallel to each other. The sub-line includes a conductor pattern formed in the substrate. The sub-line is disposed at a position at least partially overlapping with the main line 121 in a plan view of the substrate.

Abstract: A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 ?m or less in terms of ten-point average roughness.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole, a first annular retaining wall, and a second annular retaining wall. The conductive through hole penetrates through the third dielectric layer, a second dielectric layer, and the fourth dielectric layer. The conductive through hole is electrically connected to the first external circuit layer and the second external circuit layer. The first annular retaining wall is disposed in the third dielectric layer, surrounds the conductive through hole, and is electrically connected to the first external circuit layer and the first inner circuit layer. The second annular retaining wall is disposed in the fourth dielectric layer, surrounds the conductive through hole, and connects to the second external circuit layer and the second inner circuit layer electrically.

Abstract: A winch column holds electric power conductors and static lines separate and distanced from an existing power line pole/structure during repair or replacement of the pole/structure. The winch column is temporarily anchored and stabilized to be vertical and adjacent to the existing pole/structure, and winch cables extend from the winch column height-adjustable frame to support the load of the disconnected conductors. Hoist lines also extend from the frame to support the disconnected static lines. After the repair or replacement of the pole/structure, the conductors and static lines are moved, and reconnected, to the new pole, and the winch column may be moved to another existing pole or power line or folded for storage. Whenever the winch cables handle the conductors, tension sensors provided on the frame are used to monitor and report conductor tension, for safe and effective handling and reinstallation on the new pole.

Abstract: A communication device and a radio frequency circuit are provided. The communication device includes an antenna element, a transceiver, and the radio frequency circuit. The radio frequency circuit includes a substrate, a first conducting wire, a second conducting wire, and four transmission lines. The four transmission lines are respectively connected to two ends of the first conducting wire and two ends of the second conducting wire to form an input part, an output part, a coupling part, and an isolation part, respectively. The first conducting wire and the second conducting wire are separate from each other and coupled to each other, and each of a width of the first conducting wire and a width of the second conducting wire is not equal to a width of any one of the four transmission lines.

Abstract: A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.

Abstract: A flexible electronic sensor array apparatus comprising: a continuous flexible sheet having a length defining a first axis, a width defining a second axis and a thickness comprising a third axis; wherein the flexible sheet comprises multiple flexible sheet layers formed of one or more flexible materials stacked along the third axis; a plurality of electronic sensors disposed within the flexible sheet, each respective sensor comprising at least two conductive pattern layers, the two conductive pattern layers of the respective sensor spaced apart from one another along the third axis by one of the flexible sheet layers interposed between the conductive pattern layers; and wherein each respective sensor of the plurality of sensors is disposed at a different respective position along the first axis or the second axis of the flexible sheet from the remaining sensors, thereby forming an array of sensors spaced along the first and second axes.

Abstract: In a circuit board (700A), a first capacitor (410) extends from a wiring pattern (110) to a region located on one side of the wiring pattern (110) in the width direction. A second capacitor (420) extends from the wiring pattern (110) to a region located on the other side of the wiring pattern (110) in the width direction. With a semiconductor device (300) mounted on the circuit board (700A), a power supply terminal (320) is electrically connected to the wiring pattern (110). The semiconductor device (300), the wiring pattern (110), the first capacitor (410), a first interlayer joint (510), a ground plane (210), and a third interlayer joint (530) constitute a first closed circuit. The semiconductor device (300), the wiring pattern (110), the second capacitor (420), a second interlayer joint (520), the ground plane (210), and the third interlayer joint (530) constitute a second closed circuit.

Abstract: A self-leveling floor mounted electrical outlet assembly may include a cylindrical housing with a threaded inner surface. A mounting frame may be rotatably coupled to the threaded inner surface of the cylindrical housing to adjustably position the mounting frame within the housing and provide for a rough elevation adjustment of an electrical receptacle or wiring device. The mounting frame may further comprise a first portion or outer disk comprising an edge mateably coupled with the threaded inner surface of the cylindrical housing, and a second portion or yoke support comprising at least one threaded fastener extending from the second portion to the threaded opening, the at least one threaded fastener coupled to the threaded opening to adjustably position the second portion with respect to the first portion and configured to provide for a fine elevation adjustment. A wiring device may be coupled to the second portion of the mounting frame.

Abstract: A locking mechanism is disclosed for being locked together with a structure to be engaged, the locking mechanism including: a driving member, which is capable of moving in a driving direction; a first driven member and a second driven member, both of which are disposed axially symmetrically with respect to the driving direction and are coupled with the driving member so as to be driven by the driving member to move toward or away from each other along a driven direction of each of the first driven member and the second driven member respectively, the driven direction of each of the first driven member and the second driven member being transverse or oblique to the driving direction; an actuating handle, which is coupled with the driving member to move the driving member in the driving direction.

Abstract: A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.

Abstract: A display device including: a display module including a display panel for displaying an image and a circuit board connected to the display panel; a support plate disposed on a surface of the display module; and a conductive adhesive film disposed between the circuit board and the support plate, the conductive adhesive film including: a double-sided adhesive film fixed to a surface of the support plate and a surface of the circuit board; and a single-sided adhesive film fixed to one of the surface of the support plate and the surface of the circuit board.

Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.