Abstract: A printed wiring board includes an electrode pad to be soldered to an electrode of an electronic component, an electrode pad to be soldered to an electrode of the electronic component, a barrier conductor continuous with the electrode pad, and a barrier conductor continuous with the electrode pad, the barrier conductor and the barrier conductors are located at positions facing each other with a gap area therebetween, the barrier conductor and the electrode pads are positioned such that the electrode pad faces the gap area with the barrier conductor therebetween and that the electrode pad faces the gap area with the barrier conductor therebetween, and the gap area is an area in which an adhesive is placed when adhering the electronic component.

Abstract: A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole electrically connected to the first and second external circuit layers, a first annular retaining wall surrounding the conductive through hole, and a second annular retaining wall surrounding the conductive through hole. The first annular retaining wall is electrically connected to the first external circuit layer and a first inner circuit layer. The second annular retaining wall is electrically connected to the second external circuit layer and a second inner circuit layer. A first ground circuit, the first annular retaining wall, and the first inner circuit layer define a first ground path surrounding a first signal circuit. A second ground circuit, the second annular retaining wall, and the second inner circuit layer define a second ground path surrounding a second signal circuit.

Abstract: A modular floor box assembly that includes a floor box having a plurality of fittings having passageways for power and data transmission cables. A power deck configured for placement within the interior region of the floor box can include a female deck receptor that is electrically coupled to one or more terminals that are configured for a hardwired connection with at least one of the power transmission cables. The floor box can include an aperture within the interior region adjacent to the power deck that is sized to accommodate passage of data transmission cables, and which is in fluid communication with the passageways. The assembly further includes a removable power puck having a male receptacle configured for plugging into the female deck receptor. The power puck can further include one or more electrical receptacles for electrical coupling to power plugs of external devices, and at least one data opening.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

Abstract: A wire harness fixing structure includes a plate-like member including a first layer and a second layer softer than the first layer, an electrical wire disposed along the plate-like member, and a fixing member attached to the electrical wire to fix the electrical wire to the plate-like member. The fixing member includes: a through locking piece formed to be able to pass through the first layer and locked to the first layer while passing through the first layer, a regulation piece provided with a space between the regulation piece and the through locking piece to stop the through locking piece from passing through a surface of the plate-like member, and a column connecting the through locking piece and the regulation piece.

Abstract: A circuit board includes an interconnect and an insulating layer that covers the interconnect. The interconnect includes a first interconnect that is formed to serve as a recognition mark of which planar shape is a predetermined shape. The insulating layer has a through-hole of which planar shape is variant and that penetrates the insulating layer in a thickness direction of the insulating layer such that an entire upper surface of the first interconnect is exposed. The through-hole includes a first through-hole of which planar shape is a predetermined shape and that penetrates the insulating layer in the thickness direction such that the entire upper surface of the first interconnect is exposed and a second through-hole that serves as part of an inner wall surface of the first through-hole and that penetrates the insulating layer in the thickness direction.

Abstract: A transmission line includes first, second, and third signal lines defining a parallel portion. No conductor connecting the first ground conductor and the second ground conductor is between the first signal line and the second signal line, and the first signal line is closer to the ground connection conductor than the second signal line. A closest frequency difference between a fundamental wave of one of the first signal and the second signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the second signal is equal to or larger than a closest frequency difference between a fundamental wave of one of the first signal and the third signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the third signal.

Abstract: Provided is a grommet that can improve the water-blocking property. A grommet includes an opposing portion 32 that opposes a portion surrounding a mounting hole 12 in a vehicle body panel 11, a first water-blocking portion 33 that extends from the opposing portion 32 and comes in contact with the vehicle body panel 11, and a second water-blocking portion 34 that extends from the opposing portion 32 and comes in contact with the vehicle body panel 11. Each of the first water-blocking portion 33 and the second water-blocking portion 34 is formed in an annular shape that surrounds the mounting hole 12. The second water-blocking portion 34 is provided on the outer circumferential side with respect to the first water-blocking portion 33.

Abstract: A snap-in zip connector with a clamp for gripping a wire between a first bracket and a second bracket. The first bracket includes a clamp seat and a first fastener opening formed by an elongated slot and hole joined together and extending through the clamp seat. The second bracket includes a fastener opening that aligns with the hole. An insert positioned in the elongated slot includes a spring arm extending into the circular hole extend into the circular hole that engages a threaded shaft of the fastener to restrict removal except through rotation of the at least one fastener.

Abstract: A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.

Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

Abstract: A waterproof seal for electrical assemblies wherein an outer sheath of an electrical cable is removed to expose the wires and the insulation is removed from the wires to form a window of exposed electrical conductor, the electrical conductors being maintain apart from each other and contained in a cover that may comprise a connector, an epoxy applied to the electrical conductors to fill in all the space in and around the electrical conductors and the cover to form a waterproof seal that prevents water from wicking past the waterproof seal via an interior of the electrical cable.

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

Abstract: An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch