Patents Examined by Hoa C. Nguyen
  • Patent number: 10547124
    Abstract: The present disclosure provides embodiments of compression-type electrical connectors used to connect one or more branch wires or conductors to one or more run wires or conductors.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: January 28, 2020
    Assignee: HUBBELL INCORPORATED
    Inventors: Richard E Robicheau, Glen Harrison Ruggiero, Benjamin Joseph Michaud
  • Patent number: 10539982
    Abstract: The present disclosure provides a housing assembly, and the housing assembly is applied to an electronic device. The housing assembly includes a first part and a second part. The first part includes at least one opening. The second part includes at least one mesh area. The mesh area deformably connects to the first part, and covers the opening.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: January 21, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chih-Kuang Lin, Szu-Tang Chiu, Wai-Tong Chan, Sin-Fei Lai
  • Patent number: 10542647
    Abstract: A belt-shaped cover adapted to an electronic device is provided. The electronic device includes a first part and a second part. The second part is movably connected to the first part, and an opening is adjustably formed between the first part and the second part. The belt-shaped cover includes an adjustable belt and a sensing element. The adjustable belt connects the first part and the second part to adjust the size of the opening. The sensing element is disposed on the adjustable belt to sense a connecting mode of the adjustable belt.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: January 21, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventor: Wai-Tong Chan
  • Patent number: 10539983
    Abstract: The present disclosure provides an electronic device. The electronic device includes a casing and a detachable unit. The casing includes an opening. The detachable unit is selectively disposed in the opening. The detachable unit includes a recognizing element. The detachable unit is provided for the electronic device provided in the present disclosure. In addition to having an electromagnetic shielding effect, the detachable unit can further provide various different functions, such as cooling, storage, display, communication, and accommodation. A user selects different detachable units according to needs. Therefore, the electronic device provided in the present disclosure helps improve user experience.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: January 21, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Szu-Tang Chiu, Sin-Fei Lai, Chih-Kuang Lin, Wai-Tong Chan
  • Patent number: 10539974
    Abstract: In a casing for an electronic apparatus, a plurality of ribs are integrally formed on an inner surface of the casing, and the plurality of ribs form an isogrid structure in which a plurality of equilateral-triangular segments are arranged regularly adjacent to each other.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: January 21, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Tetsuya Urimoto
  • Patent number: 10537021
    Abstract: A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film (1) having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film (3) on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film (21) on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 14, 2020
    Assignee: MEIKO ELECTRONICS CO., LTD.
    Inventor: Shigeru Michiwaki
  • Patent number: 10537025
    Abstract: A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Su Youn You, Jae Yeol Choi, Hyun Hee Gu, Byoung-Jin Chun
  • Patent number: 10531581
    Abstract: Disclosed is a structure for finely adjusting the distance between image output portions constituted by a plurality of panels or modules of a display apparatus. The display apparatus includes a display panel including a first panel module and a second panel module arranged in a vertical plane for outputting images forward, a support frame disposed at the rear of the display panel for supporting the display panel, and a control unit disposed at the rear of the display panel for controlling the outputting the images from the display panel. The display apparatus further includes a connection unit, a receiving unit, and an adjustment unit for finely adjusting the distance between the display modules. In addition, the display apparatus further includes a recess part and a protrusion part, which are movably coupled to each other for circuit connection, in order to enable fine adjustment of the distance between the display panel modules of the display panel.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 7, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Dongsung Seo, Woosik Jung, Yoontai Cho
  • Patent number: 10531574
    Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: January 7, 2020
    Assignee: Invensas Corporation
    Inventors: Liang Wang, Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh
  • Patent number: 10528860
    Abstract: A card holder is used for an electronic device having a housing, and is able to accommodate a data card and be inserted into the housing. The card holder includes a card tray and a card cover. The card tray is configured to accommodate the data card. The card cover is connected to the card tray, is rotatable relative to the card tray, and includes a first end and a second end opposite to each other and a first protrusion extending towards the card tray. When the card holder is in a state of being inserted into the housing and a pushing force is applied to the first end, the card cover is rotatable about the first protrusion such that the first end extends further into the housing and the second end extends out of the housing. An electronic device is also provided.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: January 7, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Yuanqing Zeng
  • Patent number: 10531568
    Abstract: A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 7, 2020
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
  • Patent number: 10529463
    Abstract: An insulated wire, having: a single conductor or multiple conductors; an insulating layer on the outer periphery of the single conductor or each of the multiple conductors; and an adhesion layer on the outer periphery of the insulating layer, wherein the thickness of the adhesion layer is 2 to 200 ?m, wherein a resin constituting the adhesion layer does not have a melting point, wherein the resin constituting the adhesion layer has a tensile modulus of 0.6×107 to 10×107 Pa at 250° C., and wherein a substance having 2 or more amino groups exists on the surface of the adhesion layer; a coil containing the insulated wire; and an electrical or electronic equipment using the coil.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: January 7, 2020
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Satoko Yamoto, Hideo Fukuda, Isao Tomomatsu
  • Patent number: 10528093
    Abstract: A method and associated expansion card and computing device are disclosed. The method comprises inserting an expansion card into a connector of a printed circuit board (PCB) of the computing device. The expansion card comprises a handle that is adjustable between at least a retracted position and an extended position. The method further comprises installing a cover of the computing device. The handle is dimensioned such that when the handle is in the extended position, the handle is configured to limit motion of the expansion card toward the cover.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: January 7, 2020
    Assignee: International Business Machines Corporation
    Inventor: Cody J. Erie
  • Patent number: 10524355
    Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: December 31, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Yamauchi, Hiroyuki Tanabe
  • Patent number: 10524367
    Abstract: An apparatus comprises a electronic assembly and a housing. The electronic assembly comprises a sensor module mounted on or encapsulated within a substrate. The housing generally has a sensor cavity configured to receive the electronic assembly, a connector cavity configured to connect with a wire harness connector, a wall separating the sensor cavity and the connector cavity, and a plurality of terminals having a first end extending from the wall into the sensor cavity and a second end extending from the wall into the connector cavity. The first end of each terminal is generally configured to form an electrical and mechanical connection with a respective conductive pad of the substrate. The wall separating the sensor cavity and the connector cavity generally comprises an overlap configured to set an amount of deflection experienced by the first end of each terminal when the electronic assembly is inserted in the sensor cavity.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: December 31, 2019
    Assignee: VEONEER US INC.
    Inventors: Jacob Pusheck, Ankur Doshi, Joshua Forwerck
  • Patent number: 10520994
    Abstract: A storage cartridge is provided comprising a system connector configured to be hot-pluggable with an external receiving system. The storage cartridge includes a plurality of storage receiving connectors, each of which can be configured to receive either a hot-pluggable storage drive or a storage drive that has not designed to be natively hot-pluggable. In some embodiments, each of the plurality of storage receiving connectors is configured to receive a storage drive that has not been designed to be natively hot-pluggable. In addition, electrical connections are provided between the system connector and the plurality of storage receiving connectors that enable a plurality of the not natively hot-pluggable storage drives engaged with the storage cartridge to communicate with the external receiving system via the system connector configured to be hot-pluggable.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: December 31, 2019
    Assignee: Facebook, Inc.
    Inventors: Arlene Gabriana Murillo, Wei Zhang, Christian Markus Petersen, Yanbing Shao, Jon Brian Ehlen
  • Patent number: 10509436
    Abstract: A display panel is provided. The display panel includes a display area including four sides and four corners, and all of the corners are not right angles; and a border area surrounding the display area, wherein four fold lines respectively parallel to the four sides are arranged in the border area, the four fold lines enclose a fold frame, the fold frame divides the border area into a first border area and a second border area, the second border area includes four borders and a turning portion connecting every two of the four borders, and the turning portions makes the four borders be independently folded along the fold frame. The display panel of the disclosure adopts a special display area design and a special border area wiring method to ensure the reliability of the thin film encapsulation and achieve the ultra-narrow border or even borderless border of the flexible display.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: December 17, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Guang Li, Jun Chen, Shou-Cheng Wang
  • Patent number: 10512186
    Abstract: A wire bunching device, a backlight module and a display device are provided. The wire bunching device includes a base and a top cap; the top cap and the base being connected with each other to form a hollow structure running through the wire bunching device in a first direction, the hollow structure being used for a wire material to pass through; an inner wall of the hollow structure at least including a first portion formed by the top cap and a second portion formed by the base, the first portion and the second portion respectively extending from one end of the hollow structure to the other end in the first direction.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: December 17, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jian Xu, Yong Qiao
  • Patent number: 10510639
    Abstract: A vehicle control device (100) includes: a housing (200) made of metal; a substrate (400) housed in the housing (200) and having a mounting surface (401) that faces an inner surface (201) of the housing (200); and an electronic component (501) mounted on the mounting surface (401). An adhesive (601) is disposed between the electronic component (501) and the inner surface (201) of the housing (200). The electronic component (501) has a contact portion (532) that contacts the heat radiation material (601) and a non-contact portion (531) that does not contact the heat radiation material (601). The contact portion (532) and the non-contact portion (531) are portions of the electronic component (501) on the side facing the inner surface (201) of the housing (200).
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: December 17, 2019
    Assignee: AISIN AW CO., LTD.
    Inventors: Yusuke Yamamoto, Riku Kambe
  • Patent number: 10512161
    Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 17, 2019
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Shiro Tatsumi, Ikumi Sawa