Abstract: An inductor component comprising a laminated body having a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the laminated body; and an external terminal exposed from the laminated body. The external terminal includes a metal part and a resin part, and in a cross section of the external terminal, the resin part is enclosed in the metal part.

Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

Abstract: A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.

Abstract: A power cable or a hybrid power-data cable includes power conductors and a plurality of continuity wires positioned radially outside of the power conductors. The continuity wires are positioned relative to the power conductors such that a cut in the cable will sever one of the plurality of continuity wires before a cut into the power conductors can occur.

Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

Abstract: The present disclosure relates to a power cable joint system capable of minimizing expansion, deformation or damage of a metal sheath restoration layer, which is formed of a material such as lead sheath, due to internal expansion due to heat generated in an intermediate connection part of the power cable joint system.

Abstract: A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.

Abstract: A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.

Abstract: A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

Abstract: Electrical box assemblies are provided that have a support that is adjustable to different sizes. The electrical box assemblies provided also include a cable support that moves from a shipping position to an installed position.

Abstract: A space efficient planar transformer can include a coupled inductor circuit that can include a metallic core, a first planar winding comprising a conductive coil having an electrical path encircling a first post of the metallic core, and a second planar winding configured to magnetically couple with the first winding via the metallic core. The second planar winding can have multiple portions. A portion of the second winding can include a first sub-portion comprising a single U-shaped planar conductive trace wrapped about the first post and a second sub-portion comprising a single U-shaped planar conductive trace wrapped about the first post. A layout of the first sub-portion can be oriented opposite a layout of the second sub-portion.

Abstract: An example electronic device may comprise a first housing including a first surface and a second surface facing in a direction opposite the first surface, a second housing including a third surface and a fourth surface facing in a direction opposite the third surface, a hinge disposed between the first housing and the second housing configured to provide rotational motion between the first housing and the second housing, and a flexible display disposed from the first surface of the first housing across the hinge to the third surface of the second housing, at least part of the flexible display configured to form a curved surface as the hinge structure is folded, wherein the hinge may include dual-axis hinges configured to provide a first rotational axis allowing the first housing to rotate about the second housing and a second rotational axis allowing the second housing to rotate about the first housing and slides coupled with the first housing and the second housing and configured to provide sliding motion pe

Abstract: A chip on film package structure including a flexible film, a patterned metal layer, a chip, a patterned solder resist layer, and a code-included pattern is provided. The flexible film comprises a chip mounting region and a peripheral region surrounding the chip mounting region. The patterned metal layer disposed on the flexible film. The chip mounted on the chip mounting region and electrically connected to the patterned metal layer. The patterned solder resist layer exposing the chip mounting region and covering a part of the patterned metal layer. The code-included pattern disposed on the peripheral region of the flexible film. The code-included pattern comprises a plurality of machine-readable data. A method for reading a code-included pattern on a package structure is also provided.

Abstract: In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: The invention relates to a multi-layer 3D foil package and to a method for manufacturing such a multi-layer 3D foil package. The 3D foil package has a foil substrate stack having at least two foil planes, wherein a first electrically insulating foil substrate is arranged in a first foil plane, and wherein a second electrically insulating foil substrate is arranged in a second foil plane, wherein the first foil substrate has a first main surface region on which at least one functional electronic component is arranged, wherein the second foil substrate has a cavity having at least one opening in the second main surface region, wherein the foil substrates within the foil substrate stack are arranged one above the other such that the functional electronic component arranged on the first foil substrate is arranged within the cavity provided in the second foil substrate.

Abstract: An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.

Abstract: The present invention concerns a power cable, comprising a tension member (1), placed in the centre of said power cable; a first insulation layer (3), the tension member (1) being embedded in the first insulation layer (3); and an outer protective sheath (9); wherein said power cable further comprises one or more first aluminum conductors (4), embedded within the first insulation layer (3). The present invention also concerns a process for producing the inventive power cable, the process comprising the step of extruding a first polymeric insulation layer (3) onto the tension member (1) and the one or more conductors (4) in one single step. Finally, the present invention concerns the use of the inventive power cable, in medium-voltage to high-voltage subsea applications, such as an offshore windmill cable infrastructure or driving of subsea pumps.

Abstract: An electrical box comprising an adjustable voltage divider may include a housing comprising an inner surface and ribs or threads integrally formed on the inner surface of the rectangular housing. A voltage divider plate may be disposed within the housing with vertical edges of the voltage divider plate extending along and held in place between the ribs or threads integrally formed on the inner surface of the housing, the voltage divider plate dividing the housing into a high voltage area and a low voltage area. The voltage divider plate area may comprise a plurality of horizontal guide lines vertically offset from each other, and a plurality of vertical guide lines horizontally offset from each other and intersecting the plurality of horizontal score lines. Upper outer corners of the voltage divider plate may be inwardly disposed from the vertical edges of the voltage divider plate.

Abstract: A hinged dead front for an enclosure of an electrical panelboard, said enclosure defined by a rear panel, an operative left side panel, an operative right side panel and a door, wherein the rear panel of said enclosure is provided with hinged mounting bracket assemblies on which said dead front is hingeably mounted; and latch stopping bracket assemblies configured to engage with locking elements fitted on said dead front.