Abstract: A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.

Abstract: A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

Abstract: A magnetic data cable includes a cable body and data connectors. The data connectors are respectively connected to two ends of the cable body. The cable body includes a cable core and a wrapping material layer wrapped around the cable core. At least one layer of the wrapping material layer is a magnetic material layer. When the magnetic data cable is wound into coils, each two adjacent coils arranged from top to bottom or each two adjacent coils arranged from left to right are magnetically attracted to each other by the magnetic material layer. Since the magnetic material layer is integrally distributed in the wrapping material layer, so the cable body 100 is magnetic and it is easy and simple to adjust a diameter of the coils by winding.

Abstract: A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.

Abstract: An electronics box for insertion into a wall box includes a housing having a top surface, a bottom surface, a rear surface, at least one side surface, and an intermediate surface disposed part way between the top surface and the bottom surface and extending inward from the at least one side surface. A chamfer surface is disposed between an edge of the bottom surface and an edge of the rear surface, and is disposed at a particular angle with the respect to the bottom surface and has a particular length. The particular angle and the particular length are selected such that the housing is able to be tilted and then inserted into the wall box with the chamfer surface clearing the wall box.

Abstract: A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.

Abstract: An automation field device comprises a housing that surrounds an inner space; a sensor- and/or actuator element arranged at the housing; an electronic circuit arranged in the housing and having a round, outer contour and a plurality of spring contacts in an edge region. The inner contour of the housing and the edge contour of the first circuit board are adapted to one another so that the first circuit board is introducible into the housing with a main plane orthogonal to a longitudinal axis of the housing. The spring contacts are so arranged on the first circuit board and embodied to hold the first circuit board in the inner space and to produce an electrical connection between the first circuit board and the housing to drain away disturbance currents from the first circuit board.

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

Abstract: Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

Abstract: A wiring body includes a wire-like transmission member and a base member to which the wire-like transmission member is fixed. A temporary joint part joins portions where a first part and a second part mutually extending in an opposite side from a bending position in the wiring body overlap with each other in a state where the wiring body is bended in an intermediate portion of the wire-like transmission member in an extension direction to maintain a bending state of the wiring body. The temporary joint part is formed to be able to resolve a state of joining the first part and the second part by a relative separation movement of the first part and the second part.

Abstract: A water stop structure for a shield cable includes a lead-in port formed in a sheet metal of a housing, a grommet to be liquid-tightly fitted into the lead-in port, a shield shell disposed outside the housing so as to surround the grommet and with an end portion of a braid of the shield cable being crimped, and a spacer configured to adjust an attachment height of the shield shell with respect to the sheet metal so as to fasten the shield shell to the sheet metal in a state where conduction is ensured.

Abstract: A display device includes a display panel including a front surface and a rear surface, a first circuit board electrically connected to a first side of the display panel, a second circuit board electrically connected to a second side opposite to the first side of the display panel, a third circuit board disposed on the rear surface and electrically connected to the first circuit board and the second circuit board, the third circuit board extending in a first direction, and a support plate disposed on the rear surface. The display panel is foldable along a folding line extending in a second direction. The support plate has a first opening extending along the folding line, and an opening pattern near a portion of the first opening. The third circuit board overlaps the portion of the first opening. The opening pattern includes slits and the third circuit board overlaps the slits.

Abstract: A coaxial cable 10 includes a hollow-core-body 1 having an integral structure of thermoplastic resin including an inner annular portion 2 that insulation-coats an inner conductor 12, a plurality of rib portions 3 that radially extend from the inner annular portion 2, and an outer annular portion 4 that is connected to outer ends of the rib portions 3; three or more gap portions 5 surrounded by the inner annular portion 2, the rib portions 3, and the outer annular portion 4; and outer side reinforcing portions 7 being formed on both sides of an outer end in the rib portion 3, in which a size ratio of a minimum value W1 of a rib width in the rib portion 3 and a maximum value W2 of the rib width in the rib portion 3 is within a range of 1:1.6 to 1:3.0.

Abstract: Micro-scale devices, such as transformers and capacitors, having a floating conductive layer are disclosed. A floating conductive layer may be disposed in an insulator layer and can reduce a maximum electric field between a first planar conductor and a second planar conductor of a micro-scale passive device. Reduction of a maximum electric field between a first planar conductor and a second planar conductor can reduce undesirable effects on electrical components.

Abstract: The present disclosure relates to a cable assembly including a sleeve and a plurality of cables that extend through the sleeve. The cable assembly also includes a grommet positioned within the sleeve at a location offset from one end of the sleeve. The grommet forms a dam location. The cable assembly further includes a bonding material at least partially filling a region of the sleeve located between the dam location and the end of the sleeve. The bonding material bonds the fiber optic cables and the grommet relative to the sleeve. The cables extend through the grommet and the bonding material and include break-out portions that extend outwardly beyond the end of the sleeve.

Abstract: An adapter probe configured for injecting fluid (e.g., liquid, gas) into at least one electrical cable. Particularly for injecting an electrical cable with a fluid when the electrical cable is affixed to a separable connector (e.g., elbow separable connector). Separable connector may be configured to connect sources of energy (e.g., transformer, circuit breaker) with distribution systems via electrical cable (or cable section).

Abstract: A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.