Patents Examined by Hoa C. Nguyen
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Patent number: 11721966Abstract: There is provided a supporting member having excellent durability and an apparatus including the supporting member. The supporting member includes an elastic member and a plurality of block members formed thereon. The supporting member is deformable from a shape in which end surfaces of the block members are in contact with each other to a shape in which the end surfaces are separated from each other. The elastic member includes a fixed region whose deformation is restricted by being fixed to a bottom surface of the block member, and the supporting member includes a flexure reduction unit for reducing flexure at a position near the fixed region of the elastic member.Type: GrantFiled: March 21, 2022Date of Patent: August 8, 2023Assignee: JUNKOSHA INC.Inventors: Daiki Hiraoka, Hiroshi Takeuchi, Yasuhiro Misu, Tetsuya Hirose
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Patent number: 11711888Abstract: A power line structure includes a dielectric layer, a first conductive component, a second conductive component, and a third conductive component. The first conductive component is disposed at a first side of the dielectric layer. The second conductive component is disposed at the first side of the dielectric layer. The third conductive component is disposed at the first side of the dielectric layer and between the first conductive component and the second conductive component. Each of the voltage of the first conductive component and the second conductive component is equal to a ground voltage. The third conductive component is configured to receive a first power voltage.Type: GrantFiled: March 25, 2021Date of Patent: July 25, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Chun-Ming Huang, Ruey-Beei Wu, Shih-Hung Wang, Ting-Ying Wu, Ming-Chung Huang
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Patent number: 11706867Abstract: A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.Type: GrantFiled: January 27, 2021Date of Patent: July 18, 2023Assignee: LEAR CORPORATIONInventors: Joan Balana Avila, Josep Maria Combalia, Gloria Simo Quinonero, Jordi Angel Serrano
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Patent number: 11703913Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member may include: a first supporter and a second supporter overlapping with the non-folding portions; and an adhesive member attaching the display module to the second supporting member.Type: GrantFiled: September 27, 2021Date of Patent: July 18, 2023Assignee: Samsung Display Co., Ltd.Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
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Patent number: 11703912Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member includes: a first supporter and a second supporter overlapping with the non-folding portions; and a plurality of supporting units overlapping with the folding portion.Type: GrantFiled: September 27, 2021Date of Patent: July 18, 2023Assignee: Samsung Display Co., Ltd.Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
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Patent number: 11700694Abstract: An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.Type: GrantFiled: July 23, 2021Date of Patent: July 11, 2023Assignee: INNOLUX CORPORATIONInventors: Chun-Lung Tseng, Hsin-Hung Chen
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Patent number: 11700711Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.Type: GrantFiled: August 5, 2022Date of Patent: July 11, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chung-Hyo Jung, Kang-Sik Kim, Young-San Kim, Won-Min Kim, Chi-Hyun Cho
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Patent number: 11696408Abstract: A circuit board includes a substrate having an end surface, and a principal surface on which an electronic component is mounted, a first region, provided on the principal surface, and coated with a moistureproof agent, a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent, and a groove having two ends, formed in the principal surface, between the first region and the second region. The two ends of the groove reach the end surface of the substrate. The groove includes a guiding part, configured to guide the moistureproof agent overflowing from the first region into the groove, provided at a portion of the groove farthest away from the end surface.Type: GrantFiled: October 7, 2021Date of Patent: July 4, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Kenichi Mori
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Patent number: 11690189Abstract: A fluid measuring or fluid control device has a housing the housing parts of which are fastened to each other by at least one screwed connection, in which a screw engages through an opening in a peripheral wall of the first housing part and is screwed into a threaded opening in the second housing part. An elastic seal is arranged between the housing parts. The first housing part has a first resting face, and the second housing part has a second resting face which are both in peripherally circumferential contact with the seal. The screw shank and an edge of the opening have cooperating frustoconical surfaces which are oriented such that the second housing part is displaced in the direction towards the first housing part when the screw is screwed into the threaded opening, the resting faces coming into contact with the seal.Type: GrantFiled: October 19, 2021Date of Patent: June 27, 2023Assignees: Buerkert Werke GmbH & Co. KG, Burkert S.A.S.Inventors: Jan Magnussen, Lukas Ungerer, Markus Herrmann, Jürgen Wiedemann
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Patent number: 11690179Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.Type: GrantFiled: October 18, 2019Date of Patent: June 27, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Sungchul Park, Sangwon Ha, Chulwoo Park
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Patent number: 11683889Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.Type: GrantFiled: September 15, 2021Date of Patent: June 20, 2023Assignee: Infineon Technologies Austria AGInventors: Danny Clavette, Darryl Galipeau
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Patent number: 11683885Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.Type: GrantFiled: December 2, 2020Date of Patent: June 20, 2023Assignee: NISSHA CO., LTD.Inventors: Nobuo Kubosaki, Chuzo Taniguchi, Jun Sasaki
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Patent number: 11683887Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.Type: GrantFiled: October 20, 2021Date of Patent: June 20, 2023Assignee: Dell Products L.P.Inventors: Malikarjun Vasa, Sanjay Kumar, Bhyrav Mutnury
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Patent number: 11669130Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member may include: a first supporter and a second supporter overlapping with the non-folding portions; and an adhesive member attaching the display module to the second supporting member.Type: GrantFiled: September 27, 2021Date of Patent: June 6, 2023Assignee: Samsung Display Co., Ltd.Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
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Patent number: 11670929Abstract: A junction assembly is disclosed herein. The junction assembly includes a junction housing configured to support a phase bar assembly. A heatsink contacts at least a portion of the junction housing and a busbar is arranged adjacent to the junction housing. At least one fastener attaches the junction housing, the heatsink, and the busbar to each other. At least one heatsink seal is provided at an interface defined between the heatsink and the junction housing.Type: GrantFiled: June 2, 2021Date of Patent: June 6, 2023Assignee: Schaeffler Technologies AG & Co. KGInventor: Jacob Pfeifer
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Patent number: 11669129Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member includes: a first supporter and a second supporter overlapping with the non-folding portions; and a plurality of supporting units overlapping with the folding portion.Type: GrantFiled: September 27, 2021Date of Patent: June 6, 2023Assignee: Samsung Display Co., Ltd.Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
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Patent number: 11665814Abstract: A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.Type: GrantFiled: January 15, 2021Date of Patent: May 30, 2023Assignee: Amphenol CorporationInventors: Michael Rowlands, Ali Hammoodi
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Patent number: 11658469Abstract: A duct-bank stub-up assembly includes a first pre-formed stub-up module that comprises a first plurality of conduits and a first encasing body. For each of the first conduits, a first end of the conduit provides a mating end on a mating side of the first encasing body and a second end of the conduit provides a mating end on a top surface of the first encasing body. The assembly further includes a second pre-formed stub-up module that comprises a second plurality of conduits and a second encasing body formed to have a stub-up section and a footer section. For each of the second conduits, a first conduit end provides a mating end on a mating side of the footer section and a second conduit end provides a mating end on a top surface of the stub-up section. The first module is positioned on the footer of the second module.Type: GrantFiled: March 26, 2020Date of Patent: May 23, 2023Assignee: FORTERRA PIPE & PRECAST, LLCInventors: Matthew Pearson, Branden Maurstad
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Patent number: 11659656Abstract: A stretchable wiring board that includes a stretchable substrate having a first main surface with a first region, a second region adjacent the first region, and a third region adjacent the second region; a first stretchable wiring line on the first main surface and extending over the first region; an insulating layer extending over the first region and the second region; and a second stretchable wiring line extending over the first region, the second region, and the third region. When a thickness of the insulating layer is defined as Z2, and when a minimum value of a length of the second region in an extending direction of the second stretchable wiring line in a plan view of the stretchable wiring board is defined as Y, Y>Z2.Type: GrantFiled: June 23, 2022Date of Patent: May 23, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Takahito Tomoda
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Patent number: 11658444Abstract: The present disclosure relates to a charging cable having a protective sleeve which extends to an extended position to protect the charging end of the cable. The protective sleeve may be retracted to a retracted position to reveal the charging end and allow the cable to be plugged into an electronic device. Various embodiments are disclosed in which the protective sleeve may be spring loaded by a single spring, by a plurality of springs, or it may be manually operated.Type: GrantFiled: May 23, 2019Date of Patent: May 23, 2023Inventor: Riyad K. Elagha