Abstract: A lithographic system for projecting an image onto a workpiece using radiation is provided. The lithographic system includes: a support structure for supporting a workpiece; a radiation source for providing radiation to project an image on the workpiece; a reticle positioned between the radiation source and the workpiece; and a mask positioned adjacent the reticle, the mask being configured to block radiation from the radiation source, the mask including a heat removal apparatus.

Abstract: Methods and systems are described for reducing particulate contaminants on a clamping face of a clamping structure in a lithographic system. A substrate such as a cleaning reticle is pressed against the clamping face. A temperature differential is established between the substrate and the clamping face either before or after clamping occurs to facilitate transfer of particles from the clamping face to the substrate.

Abstract: Provided is a substrate deforming device for proximity exposure, the device comprising: a mask holder for holding an exposure mask; a first plate which is spaced apart from the exposure mask in a certain direction, and holds a to-be-exposed substrate; a position adjustment part for adjusting the position of the exposure mask; a gap adjustment part for adjusting a gap between the exposure mask and the to-be-exposed substrate; a first sensor for measuring the position of at least one among the exposure mask and the to-be-exposed substrate; a second sensor for measuring the gap between the exposure mask and the to-be-exposed substrate; and a control unit which performs a first control according to the measurement result from the first sensor, and after the first control, performs a second control according to the measurement result from the second sensor. The first control reduces the relative distance between the exposure mask and the to-be-exposed substrate by means of the position adjustment part.

Abstract: In some embodiments, the present disclosure relates to a process tool that includes a lithography apparatus arranged over a wafer chuck and an immersion hood apparatus laterally around the lithography apparatus. The lithography apparatus includes a photomask arranged between a light source and a lens. The immersion hood apparatus comprises input piping, output piping, and extractor piping. The input piping is arranged on a lower surface of the immersion hood apparatus and configured to distribute a liquid between the lens and the wafer chuck. The output piping is arranged on the lower surface of the immersion hood apparatus and configured to contain the liquid arranged between the lens and the wafer chuck. The extractor piping is arranged on an outer sidewall of the immersion hood apparatus and configured to remove any liquid above the wafer chuck that is outside of the immersion hood apparatus.

Abstract: An apparatus for use in an automated optical inspection in a production line, the apparatus including a frame accommodating a plurality of illumination units surrounding an integrated optical imaging unit, wherein each illumination unit is rotatable in a synchronized manner relative to each unit, in use, to vary an illumination angle at an intended target, to enhance the visualization of the intended target captured by the optical imaging unit.

Abstract: An actuator comprises a coil, a first cooling plate and a second cooling plate. The cooling plates are configured to cool the coil. The first and second cooling plates are arranged at opposite sides of the coil to be in thermal contact with the coil. The coil comprises a first coil part and a second coil part, the first coil part facing the first cooling plate and the second coil part facing the second cooling plate, the first and second coil parts being separated by a spacing there between. The first cooling plate, the first coil part, the spacing, the second coil part and the second cooling plate form a stacked structure whereby the coil parts are arranged between the cooling plates and the spacing is arranged between the coil parts. The actuator further comprises a filling element arranged in the spacing. The filling element to push the first coil part towards the first cooling plate and to push the second coil part towards the second cooling plate.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: The control unit controls the relative position in an optical axis direction of the projection system and the relative position in a direction perpendicular to an optical axis direction at a third timing after a second timing based on a first distribution of illumination light detected by the detection system at a first timing and a second distribution of illumination light detected by the detection system at the second timing after the first timing, the illumination light detected at the first and second timings having passed through the first and second marks.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each of the supporting spring devices defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device which measures the position and/or orientation of the at least one optical element in relation to a reference in at least one degree of freedom up to all six degrees of freedom in space. A reduction device reduces a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: In a dark-field metrology method using a small target, a characteristic of an image of the target, obtained using a single diffraction order, is determined by fitting a combination fit function to the measured image. The combination fit function includes terms selected to represent aspects of the physical sensor and the target. Some coefficients of the combination fit function are determined based on parameters of the measurement process and/or target. In an embodiment the combination fit function includes jinc functions representing the point spread function of a pupil stop in the imaging system.

Abstract: A method of making a mirror for use with extreme ultraviolet (EUV) or X-ray radiation is disclosed. The method includes: a) providing an optical element having a curved mirror surface, wherein the curved mirror surface comprises localized defects that degrade performance of the curved mirror surface; b) spin-coating the curved mirror surface with a material to cover at least some of the defects; and c) curing the spin-coated material on the curved mirror surface to reduce the number of defects and improve the performance of the curved mirror surface. Also disclosed is a mirror made by the method.

Abstract: A liquid crystal exposure apparatus that moves a substrate supported in a noncontact manner by a noncontact holder to a projection optical system, and performs scanning exposure to the substrate equipped with: holding pads that hold a part of the substrate located at a first position above the noncontact holder; adsorption pads that hold another part of the substrate; a first drive section moves the holding pads from below the substrate direction intersecting a vertical direction, where the substrate is located at the first position held by the adsorption pads; and a second drive section that moves the adsorption pads holding the substrate, to a second position where the substrate is supported in a noncontact manner by the noncontact holder, wherein the scanning exposure, the second drive section moves the adsorption pads holding the substrate supported in a noncontact manner by the noncontact holder to the projection optical system.

Abstract: A substrate processing apparatus includes a holder configured to hold, within a processing container, a substrate having a pattern formed of a resist material for EUV lithography on a surface thereof, a rotation driving part configured to rotate the holder, and a light source part including a plurality of light sources configured to emit light to the surface of the substrate held by the holder rotated by the rotation driving part such that a number of rotations of the substrate is 0.5 rpm to 3 rpm.

Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

Abstract: A carrier system and method carries an object to an object mounting member provided with an object mounting section. The system includes: a measurement device which obtains information related to a flatness of the object; a carrier member that carries the object; and a controller which controls a driving speed of the carrier member using the information related to the flatness of the object obtained by the measurement device.

Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.

Abstract: The present disclosure provides a system. The system includes a metrology tool configured to collect overlay errors from a patterned substrate; and a controller module coupled to the metrology tool and configured to generate an overlay compensation from the collected overlay errors, wherein the generating of the overlay compensation includes identifying a portion of the overlay errors as a set of outliers, identifying inside the set of outliers overlay errors not due to reticle effects, thereby creating a set of noise, excluding the set of noise from overlay errors, thereby creating a set of filtered overlay errors, and calculating the overlay compensation based on the set of filtered overlay errors.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: When replacing a mirror in a projection exposure apparatus, a mirror for replacement is initially removed (41). Position- and orientation data of the removed mirror for replacement are measured (43) by a position -and orientation data measuring device. Furthermore, position- and orientation data of a replacement mirror, to be inserted in place of the mirror for replacement, are measured (46) using the position- and orientation data measuring device. Bearing points of the replacement mirror are reworked (48) on the basis of ascertained differences between, firstly, the position- and orientation data of the mirror for replacement and, secondly, the position- and orientation data of the replacement mirror. The reworked replacement mirror is installed (54). This yields a mirror replacement method, in which an adjustment outlay of the replacement mirror in the projection exposure apparatus is reduced.

Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.