Abstract: A printed circuit board (PCB) includes first and second signal pads and a guard trace formed on a surface of the PCB. The first and second signal pads are for connecting to signal contacts of a high-speed data communication interface. The guard trace is located between the first signal pad and the second signal pad. The PCB further includes first, second, and third ground vias that couple the guard trace to a ground plane of the PCB. The first ground via is located at a first end of the guard trace. The second ground via is located at a second end of the guard trace. The third ground via is located between the first via and the second via.

Abstract: A composite printed wiring board includes a first printed wiring board, a second printed wiring board, an intermediate plate, a first bonding layer, and a second bonding layer. The intermediate plate is provided to surround a space. The first printed wiring board closes one side of the space and is bonded to the intermediate plate. The second printed wiring board closes the other side of the space and is bonded to the intermediate plate. At least any of the first printed wiring board and the second printed wiring board has a through hole. A cavity is provided that is the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer. The through hole in communication with the cavity.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the opening is exposing 50% or more of an area of a surface of the conductor pad on the opposite side with respect to the insulating layer and exposing a side surface and the surface of the conductor pad at side portions of a peripheral edge of the conductor pad and that the solder resist layer is covering the side surface and the surface of the conductor pad at one or more of corner portions of the peripheral edge of the conductor pad.

Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

Abstract: A battery wiring module includes a plurality of connecting members to be connected to electrode terminals and a flexible printed circuit board having a plurality of voltage detection lines for detecting the voltages of a plurality of power storage elements via the plurality of connecting members, at least one of the plurality of voltage detection lines being constituted to include a front surface wiring and a back surface wiring respectively formed on a front surface and a back surface of the flexible printed circuit board, and a front-back conduction part passing through the flexible printed circuit board in the plate thickness direction and connecting the front surface wiring and the back surface wiring, and the resistance value per unit length of the front-back conduction part being less than or equal to the maximum resistance value per unit length of the front surface wiring and the back surface wiring.

Abstract: A multi-layer printed circuit board includes a base-layer metal, multiple middle metal layers and a top-layer metal. The middle metal layers are stacked on the base-layer metal sequentially. The top-layer metal is disposed on the middle metal layers. The base-layer metal, each middle metal layer and the top-layer metal are formed with multiple through holes respectively. Part of the middle metal layers are separately formed with multiple hole groups corresponding to the through holes. Each hole group includes multiple passing holes. The passing holes jointly surround a corresponding one of the through holes to form multiple connecting channels. Therefore, the multi-layer printed circuit board may reduce the cooling speed of the through holes to avoid an excessively low temperature of a pad to affect the soldering efficiency with keeping the high-frequency transmission and the signal isolation.

Abstract: A printed wiring board includes resin insulating layers, and conductor layers laminated on the resin insulating layers, respectively. The conductor layers includes a conductor layer including a conductor circuit formed such that the conductor circuit has recesses each having a depth of 2.0 ?m or more and a bottom whose diameter is larger than a diameter of an opening part of a respective one of the recesses.

Abstract: A printed circuit board for transmitting electrical energy and for signal transmission includes electrical conductor tracks coupled to the printed circuit board wherein the electrical conductor tracks include a first electrical conductor track with a superconducting material. The first electrical conductor track is designed to provide electrical energy directly to a power electronics system. The electrical conductor tracks include a second electrical conductor track which is designed to provide a signal transmission to a signal electronics system. A system is disclosed having such a printed circuit board.

Abstract: A component carrier has a stack including a plurality of electrically insulating layer structures and at least one electrically conductive layer structure, wherein two of the at least two electrically insulating layer structures form a dielectric double layer made of two different materials; a through-hole extending through the double dielectric layer; and an electrically conductive material filling at least a part of the through-hole. A method of manufacturing a component carrier is also disclosed.

Abstract: A circuit board may include an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms. The ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is within a range of 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is within a range of 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is within a range of 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is within a range of 0.5-1.5.

Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.

Abstract: A glass structure includes a glass plate; a connecting member placed on one surface of the glass plate, and is electrically connected to a conductor placed on the glass plate or placed in the vicinity of the glass plate, the connecting member including a connecting portion at one end thereof and a power supply portion at the other end thereof, and a portion other than the connecting portion and the power supply portion are covered by a resin portion; wherein the glass structure is adhered to a predetermined portion by an adhesive; and the glass structure including a base layer extending as a strip along the edge of the glass plate is placed on the surface of the glass plate and the surface of the resin portion of the connecting member, wherein the base layer including a resin primer layer, a glass primer layer and a sealant layer.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer, and a coating film formed on a surface of the conductor layer such that the coating film is adhering the conductor layer and the second insulating layer. The conductor layer includes a conductor pad and a wiring pattern, and the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has a through hole exposing the component mounting region and that the first region is covered by the second insulating layer and roughened to have a surface roughness higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.

Abstract: An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first through portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.

Abstract: An electronic device is provided, including a substrate, a conductive element, and an insulating layer. The conductive element is disposed on the substrate. The conductive element includes a first layer, a second layer, and a third layer. The second layer is disposed on the first layer. The third layer is disposed on the second layer. The insulating layer is disposed on the conductive element. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer. There is a gap between the insulating layer and the conductive element.

Abstract: An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

Abstract: A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.

Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.