Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer, and a coating film formed on a surface of the conductor layer such that the coating film is adhering the conductor layer and the second insulating layer. The conductor layer includes a conductor pad and a wiring pattern, and the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has a through hole exposing the component mounting region and that the first region is covered by the second insulating layer and roughened to have a surface roughness higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.

Abstract: A glass structure includes a glass plate; a connecting member placed on one surface of the glass plate, and is electrically connected to a conductor placed on the glass plate or placed in the vicinity of the glass plate, the connecting member including a connecting portion at one end thereof and a power supply portion at the other end thereof, and a portion other than the connecting portion and the power supply portion are covered by a resin portion; wherein the glass structure is adhered to a predetermined portion by an adhesive; and the glass structure including a base layer extending as a strip along the edge of the glass plate is placed on the surface of the glass plate and the surface of the resin portion of the connecting member, wherein the base layer including a resin primer layer, a glass primer layer and a sealant layer.

Abstract: An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first through portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.

Abstract: An electronic device is provided, including a substrate, a conductive element, and an insulating layer. The conductive element is disposed on the substrate. The conductive element includes a first layer, a second layer, and a third layer. The second layer is disposed on the first layer. The third layer is disposed on the second layer. The insulating layer is disposed on the conductive element. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer. There is a gap between the insulating layer and the conductive element.

Abstract: A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.

Abstract: An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

Abstract: A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to 1/4 of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.

Abstract: A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

Abstract: A component carrier includes a first stack with an electrically insulating layer structure and an electrically conductive layer structure with a first density of trace structures and a second density of first connection structures, a second stack with a second electrically insulating layer structure and a second electrically conductive layer structure with a third density of second trace structures and a fourth density of second connection structures. A first component is applied to the first stack and a second component is embedded in the second stack. The first connection structures are respectively connected to the second connection structures. The first density of first trace structures is lower than the third density of second trace structures. The first stack and the second stack are connected with each other by the first connection structures and by the second connection structures. The first component is connected to the second component.

Abstract: A interconnect substrate includes an insulating layer including an organic resin layer and a plurality of embedded portions that are embedded in the organic resin layer and exposed at an upper surface of the organic resin layer, and an interconnect layer in contact with the upper surface of the organic resin layer and an upper surface of the embedded portions, wherein the embedded portions are made of an oxide, nitride, or oxynitride of inorganic material, and wherein the upper surface of the organic resin layer is partially exposed in areas where the interconnect layer is not formed on the insulating layer.

Abstract: A circuit board, comprising a multi-layer circuit board, a first conductive circuit, a first circuit layer, an adhesion promoter layer, a second conductive circuit, and a second circuit layer. The multi-layer circuit board comprises an inner circuit and an opening. The opening exposes the inner circuit. The first conductive circuit is disposed in the opening and on the inner circuit. The first circuit layer is disposed on the first conductive circuit in the opening and lower than the depth of the opening. The adhesion promoter layer is disposed in the opening and on the surface of the multi-layer circuit board and connected to the first conductive circuit. The second conductive circuit is disposed on the adhesion promoter layer and on the first circuit layer in the opening. The second circuit layer is disposed on the second conductive circuit in the opening and on the second conductive circuit.

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including pads, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the pads, and plating bumps formed on the pads such that each plating bump includes a base plating layer formed in a respective one of the openings, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer. The plating bumps are formed such that the base plating layer has a side surface including a portion protruding from the solder resist layer, that the intermediate layer has a thickness in a range of 2.7 to 7.0 ?m, and that the top plating layer has a hemispherical shape and is covering only an upper surface of the intermediate layer.

Abstract: A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.