Patents Examined by Ishwarbhai B. Patel
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Patent number: 11756846Abstract: A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.Type: GrantFiled: May 13, 2020Date of Patent: September 12, 2023Assignee: TOPPAN PRINTING CO., LTD.Inventor: Tetsuyuki Tsuchida
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Patent number: 11751329Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.Type: GrantFiled: October 6, 2022Date of Patent: September 5, 2023Assignee: AUO CorporationInventors: Tsung-Ying Ke, Chun-Nan Chen, Zih-Shuo Huang
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Patent number: 11744012Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.Type: GrantFiled: March 11, 2021Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng
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Patent number: 11744014Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.Type: GrantFiled: November 10, 2021Date of Patent: August 29, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon
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Patent number: 11737208Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.Type: GrantFiled: February 6, 2019Date of Patent: August 22, 2023Assignee: Intel CorporationInventors: Brandon C. Marin, Andrew James Brown, Rahul Jain, Dilan Seneviratne, Praneeth Kumar Akkinepally, Frank Truong
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Patent number: 11729916Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.Type: GrantFiled: July 9, 2021Date of Patent: August 15, 2023Assignee: MD ELEKTRONIK GMBHInventors: Gerd Mittermaier, Matthias Borkowski, Nikolaus Lechleitner, Johann Friesinger, Alexander Haas, Christian Stoemmer, Martin Sterkel, Lutz Rissing
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Patent number: 11678435Abstract: An electronic device is provided and includes a wiring structure including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side and two side walls opposite to each other. The insulating layer wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. The conductive wiring includes a first layer, a second layer and a third layer, the second layer is disposed between the first layer and the third layer, and the first layer is disposed between the second layer and the substrate. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer.Type: GrantFiled: November 18, 2021Date of Patent: June 13, 2023Assignee: Innolux CorporationInventors: Roger Huang, Joe Huang, Lavender Cheng, Sean Chang
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Patent number: 11678440Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.Type: GrantFiled: May 15, 2020Date of Patent: June 13, 2023Assignee: IBIDEN CO., LTD.Inventors: Yoji Sawada, Nobuhisa Kuroda, Kazuyuki Ueda, Shota Tachibana
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Patent number: 11659654Abstract: A stretchable wiring board that includes: a stretchable substrate; a first wiring line on the stretchable substrate; an insulating layer overlapping a first part of the first wiring line in a plan view of the stretchable wiring board; and a second wiring line overlapping the first part of the first wiring line in the plan view with the insulating layer interposed therebetween. The insulating layer has at least one first notch, and in the plan view, the at least one first notch does not overlap the first wiring line and overlaps the second wiring line.Type: GrantFiled: April 23, 2021Date of Patent: May 23, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahito Tomoda, Shinsuke Tani, Takaaki Miyasako, Takayuki Okada, Yui Nakamura, Hayato Katsu, Keisuke Nishida
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Patent number: 11653445Abstract: A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.Type: GrantFiled: November 16, 2021Date of Patent: May 16, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hayato Katsu, Keisuke Nishida, Ryo Asai, Takayuki Okada, Shinsuke Tani
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Patent number: 11622442Abstract: A circuit member joint structure includes a first circuit member including a first main surface on which a first mounting electrode is provided, a second circuit member including a second main surface on which a second mounting electrode is provided, a conductive joining material with which the first mounting electrode and the second mounting electrode are joined to each other, and an insulating joining material with which an end portion of the first circuit member and an end portion of the second circuit member are joined to each other. The first circuit member includes a first recess on the first main surface and spaced away from the first mounting electrode, and at least a portion of the insulating joining material is disposed in the first recess.Type: GrantFiled: December 2, 2020Date of Patent: April 4, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Daisuke Tonaru
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Patent number: 11617264Abstract: An interconnect substrate includes a first insulating layer, an interconnect layer formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer to cover the interconnect layer, wherein the second insulating layer includes a first resin layer and a second resin layer, the first resin layer covering at least part of a surface of the interconnect layer exposed outside the first insulating layer, the second resin layer covering the first resin layer, wherein both the first resin layer and the second resin layer contain a resin and a filler, and wherein a proportion of the resin in the first resin layer per unit area is higher than a proportion of the resin in the second resin layer per unit area.Type: GrantFiled: September 17, 2021Date of Patent: March 28, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yuji Yukiiri
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Patent number: 11602051Abstract: A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.Type: GrantFiled: February 4, 2021Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Seok Heo, Hyung Ki Lee
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Patent number: 11596061Abstract: In a stretchable wiring member having a relatively hard portion, such as a contact point, there is provided a solution to malfunction of the stretchable wiring member caused by stress generated at a boundary between the hard portion and a flexible portion. A stretchable wiring member includes a flexible substrate having stretchability, a stretchable wiring line disposed along the flexible substrate and configured to be stretched in association with stretching deformation of the flexible substrate, and a hard member that is harder than the flexible substrate. The flexible substrate has an extension layer portion interposed between the hard member and the stretchable wiring line.Type: GrantFiled: June 28, 2019Date of Patent: February 28, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Takaya Kimoto
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Patent number: 11596063Abstract: A composite substrate that includes: an upper ceramic layer; a lower ceramic layer; a middle resin layer between the upper ceramic layer and the lower ceramic layer; and a side surface resin layer on all side surfaces of the composite substrate, wherein the middle resin layer and the side surface resin layer are integral resin layers.Type: GrantFiled: January 21, 2021Date of Patent: February 28, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Tsuyoshi Katsube
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Patent number: 11589458Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.Type: GrantFiled: October 17, 2019Date of Patent: February 21, 2023Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Xinnan Wang, Jianwei Mu, Shiming Wang, Ting Gao, Jiaao Zhang
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Patent number: 11582860Abstract: The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A?B)/B?0.1 wherein A is the maximum value of the thickness in the wiring portion (?m) and B is the minimum value of the thickness in the non-wiring portion (?m).Type: GrantFiled: September 10, 2018Date of Patent: February 14, 2023Assignee: JSR CORPORATIONInventors: Isao Nishimura, Nobuyuki Miyaki, Toshiaki Kadota, Shintarou Fujitomi, Tomotaka Shinoda
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Patent number: 11576261Abstract: A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.Type: GrantFiled: March 9, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joo Hwan Jung, Jae Woong Choi, Seung Eun Lee, Yong Hoon Kim, Jin Won Lee
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Patent number: 11576255Abstract: A flexible printed circuit board includes: a base film; a first circuit pattern disposed on an upper surface of the base film; a second circuit pattern disposed on a lower surface of the base film; and a boundary reinforcing pattern expanding the first circuit pattern in a width direction of the first circuit pattern based on a virtual boundary along which the first circuit pattern and the second circuit pattern meet each other in an overlay of the first circuit pattern and the second circuit pattern.Type: GrantFiled: February 25, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Won Lee, Kwang Youl Pyo, Chul Hyun Kim
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Patent number: 11570882Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.Type: GrantFiled: March 28, 2019Date of Patent: January 31, 2023Assignee: KYOCERA CORPORATIONInventors: Yukio Morita, Noboru Kitazumi, Yousuke Moriyama