Patents Examined by Jason L Savage
  • Patent number: 6818322
    Abstract: The present invention provides a surface treated steel sheet for electronic components which does not include lead, which is a hazardous substance with environmental impact, and, in particular, satisfies the solder wettability after retort treatment, a rust-proof property and a whisker-proof property simultaneously. More specifically, the present invention is a surface treated steel sheet with less environmental impact for electronic components excellent in solder wettability, a rust-proof property and a whisker-proof property and having an Sn—Zn alloy layer which is formed by plating Sn and Zn on a steel sheet or a Ni plated steel sheet and then applying thermal diffusion treatment, or by plating Sn—Zn alloy on a steel sheet or a Ni plated steel sheet, characterized in that the amount of said Sn—Zn alloy layer is not less than 3 g/m2, the Zn/Sn ratio (in weight ratio) is 0.01 to 10, more preferably 0.01 to 0.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: November 16, 2004
    Assignee: Nippon Steel Corporation
    Inventors: Ryoichi Yoshihara, Tokitsugu Shirakawa, Yasuhiko Miura
  • Patent number: 6818315
    Abstract: A method for the manufacture of a metal matrix composite by the SHS technique comprises a reaction between titanium and carbon or between titanium and borium, forming titanium carbide or titanium diboride. Tantalum and molybdenum or chromium are blended to the raw materials of the metal matrix composite to improve the resistance of the metal matrix composite to high temperatures and/or corrosion. The invention also relates to a metal matrix composite which contains elements at whose presence a protective oxide layer is formed on the surface of the metal matrix composite during the use.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: November 16, 2004
    Assignee: Valtion Teknillinen Tutkimuskeskus
    Inventors: Pertti Lintunen, Pekka Lintula, Tomi Lindroos, Anssi Jansson, Simo-Pekka Hannula
  • Patent number: 6815084
    Abstract: The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-coated carbon fibers are mixed with copper powder. In another implementation, the mixture is consolidated to a carbon fiber metal matrix composite by using a vacuum hot press. The resultant backing plate has a coefficient of thermal expansion of 4.9×10−6/C, thermal conductivity of at least 300 W/mK, density of greater than 99% of theoretical, and the composite material of the backing plate is 30% lighter than Cu while also having higher stiffness than Cu. The high-modulus fiber metal matrix composite backing plate can be used for high power W, Ta, and ceramic PVD targets.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: November 9, 2004
    Assignee: Honeywell International Inc.
    Inventors: Tim Scott, Tamara White, Jianxing Li
  • Patent number: 6811892
    Abstract: A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250° C. or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: November 2, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Shing Yeh, Bradley H. Carter, Frank Stepniak, Scott D. Brandenburg
  • Patent number: 6808817
    Abstract: Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: October 26, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Donald T. Morelli, Alaa A. Elmoursi, Thomas H. Van Steenkiste, Brian K. Fuller, Bryan A. Gillispie, Daniel W. Gorkiewicz
  • Patent number: 6805946
    Abstract: Fibrous monolith processing techniques to fabricate multifunctional structures capable of performing more than one discrete function such as structures capable of bearing structural loads and mechanical stresses in service and also capable of performing at least one additional non-structural function.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: October 19, 2004
    Assignee: Advanced Ceramics Research, Inc.
    Inventors: Anthony C. Mulligan, John Halloran, Dragan Popovich, Mark J. Rigali, Manish P. Sutaria, K. Ranji Vaidyanathan, Michael L. Fulcher, Kenneth L. Knittel
  • Patent number: 6805968
    Abstract: A member for a semiconductor manufacturing apparatus comprises a steel substrate and a composite oxide film formed on a surface thereof and comprised of silicon oxide-aluminum oxide-chromium oxide and a sintering aid.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: October 19, 2004
    Assignee: Tocalo Co., Ltd.
    Inventors: Yukimasa Saito, Hiroshi Sakurai, Kazumi Tani, Kiyoshi Miyajima, Takema Teratani, Tatsuya Hamaguchi
  • Patent number: 6805759
    Abstract: A shaped part or article of manufacture is formed of a selected gamma titanium aluminide alloy with outstanding mechanical properties which can be produced particularly economically. First, a semi-finished article is formed in a hot forming process with a degree of deformation of greater than 65%. Then the semi-finished article is shaped with the alloy being in a solid-liquid phase by applying mechanical forming forces during at least part of the shaping process.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: October 19, 2004
    Assignee: Plansee Aktiengesellschaft
    Inventors: Andreas Hoffmann, Heinrich Kestler
  • Patent number: 6805970
    Abstract: The properties of a metal piece are altered by laser peening the piece on the first side using an acoustic coupling material operatively connected to the second side and subsequently laser peening the piece on the second side using an acoustic coupling material operatively connected to the first side.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: October 19, 2004
    Assignee: The Regents of the University of California
    Inventors: Lloyd A. Hackel, John M. Halpin, Fritz B. Harris, Jr.
  • Patent number: 6802430
    Abstract: A fuel tank and a fuel-filler tube, which maintain excellent corrosion-resistance over a long term even in a severely corrosive atmosphere, is made of a ferritic stainless steel sheet good of formability. The steel sheet, which has elongation of 30% or more after fracture by a uniaxial tensile test and minimum Lankford value (value-rmin) of 1.3 or more, is formed to a product shape, and paint is cathodically electrodeposited on a surface of the formed stainless steel sheet. The stainless steel sheet may be one coated with an Al or Zn plating layer. When the fuel tank or fuel-filler tube is fabricated by welding, Zn-rich paint is preferably applied to a welded part in prior to cathodic electrodeposition coating.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: October 12, 2004
    Assignee: Nisshin Steel Co., Ltd.
    Inventors: Kouki Tomimura, Yasutoshi Hideshima, Naoto Hiramatsu, Toshiro Adachi, Kazushi Shirayama
  • Patent number: 6787247
    Abstract: Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: September 7, 2004
    Assignee: Intel Corporation
    Inventor: Joseph A. Benefield
  • Patent number: 6783798
    Abstract: Thin, flexible composite materials, which are magnetic or magnetizable and processes for producing and using the materials. The composite material contains a laminate formed from a mixture of magnetic or magnetizable particles, binder particles (and optionally active particles), applied to and fused and/or coalesced with a first substrate. The composite preferably contains an additional second substrate fused to and/or coalesced with, the laminate on the side of the laminate opposite that of the first substrate.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: August 31, 2004
    Assignee: Koslow Technologies Corporation
    Inventor: Evan E. Koslow
  • Patent number: 6777105
    Abstract: A part has a body unit; and one or more leg formed on the body unit. One or more slit is formed on the body unit adjacent to the leg. The legs are inserted to insert holes of a printed wiring board or the like and soldered thereto. Since the slit is formed adjacent to the leg, the heat applied to the leg for the soldering is not radiated by the body unit by virtue of the slit. Therefore, the part can be reliably attached to the printed wiring board or the like.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: August 17, 2004
    Assignee: Pioneer Corporation
    Inventor: Kazuto Kadokawa
  • Patent number: 6773824
    Abstract: A clad article of a substrate of one powdered metal that is clad with a second dissimilar powdered metal. A separation layer may be provided between the substrate and the clad layer to separate these layers during consolidation and to facilitate bonding thereof. The consolidation operation may be performed by hot isostatic pressing of the powders within a deformable container.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: August 10, 2004
    Assignee: Crucible Materials Corp.
    Inventors: Frank J. Rizzo, Brian A. Hann, Joseph F. Perez
  • Patent number: 6773825
    Abstract: An improved porous article and a method for forming such porous article are provided. A mixture of ceramic or articles and pliable organic hollow spheres is prepared in a liquid typically as a suspension. The article is formed by pressing, slip casting, extruding or injection molding the mixture. The article is dried to remove the liquid, and then is fired so that the particles are bonded such as by sintering, and the organic spheres are eliminated, resulting in a strong porous article having uniformly spaced interconnected voids.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: August 10, 2004
    Assignee: Porvair Corporation
    Inventors: Gary R. Pickrell, Kenneth R. Butcher, Chi Li Lin
  • Patent number: 6770375
    Abstract: The fire-resistant glazing includes one or more glass pane, at least one of which consists of glass containing nucleating agents so that the glass pane is at least partially ceramicized when subjected to high thermal stress sufficient to cause ceramicizing, for example during a fire. The glass may be tempered and contains, in percent by weight based on oxide content SiO2, 55 to 69; Al2O3, 19 to 25 and Li2O, 3.2 to 5.0. This glass pane combines the advantages of the strength of tempered glass at low temperature with the stability and long-term resistance to thermal stress of glass-ceramic material at high temperature. The fire-resistant glazing can also include at least one other glass pane made of a conventional glass and at least one plastic layer of PVB film.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: August 3, 2004
    Assignee: Schott Glas
    Inventors: Thomas Karschti, Roland Leroux
  • Patent number: 6767648
    Abstract: There are provided a copper-based sintered sliding material comprising a steel back metal layer, and a sintered layer made of Cu or a Cu-based alloy which is bonded onto the steel back metal layer, the steel back metal layer having a hardness not less than 160 Hv and an elongation not less than 10%, the sintered layer having a hardness not more than 130 Hv and crystal grains each provided with a grain size not more than 45 &mgr;m, a method of producing the sliding material, and a sliding bearing formed of the sliding material.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: July 27, 2004
    Assignee: Daido Metal Company Ltd.
    Inventors: Yasushi Saitou, Eisaku Inoue, Masahito Fujita, Takayuki Shibayama
  • Patent number: 6764772
    Abstract: A sandwich material comprising two metal plates affixed to and separated by a fibrous core, is characterised in that the core comprises a three-dimensional porous network comprising metal fibres, wherein substantially all of the fibres are inclined at an acute angle to the plates. The sandwich material is lightweight, thin and handles like a monolithic sheet. It displays high beam stiffness and is easy to weld. It as therefore particularly useful in the manufacture of aircraft and vehicle parts.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: July 20, 2004
    Assignee: Cambridge University Technical Services Ltd.
    Inventors: Trevor William Clyne, Athina Markaki
  • Patent number: 6753093
    Abstract: A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: June 22, 2004
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Katsufumi Tanaka, Kyoichi Kinoshita, Takashi Yoshida, Tomohei Sugiyama, Eiji Kono
  • Patent number: 6753092
    Abstract: A multilayer material comprising a backing material (10) and a obverse material (12) made of a metal different from the backing material, said obverse material being bonded to the backing material, said obverse material having a rapidly cooled dendrite structure extended substantially vertically to the backing material, said dendrite structure having a grain size not more than 0.02 mm in a cutting plane in parallel to the backing material and/or a dendrite arm spacing not more than 0.02 mm in a cutting plane vertical to the backing material.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: June 22, 2004
    Assignee: Daido Metal Company Ltd.
    Inventors: Masahito Fujita, Eisaku Inoue, Takayuki Shibayama