Patents Examined by Jason L Savage
  • Patent number: 6740427
    Abstract: The invention relates to a ball limiting metallurgy stack for an electrical device that contains a tin diffusion barrier and thermo-mechanical buffer layer disposed upon a refractory metal first layer. The multi-diffusion barrier layer stack resists tin migration toward the upper metallization of the device.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: May 25, 2004
    Assignee: Intel Corporation
    Inventors: Madhav Datta, Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King, Zhiyong Ma, Thomas Marieb, Michael Mckeag, Doowon Suh, Simon Yang
  • Patent number: 6733899
    Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: May 11, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Sumio Uehara, Yoshihisa Nagamine, Toshifumi Iizuka
  • Patent number: 6720086
    Abstract: A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a nickel-alloy honeycomb core and a nickel-alloy facing sheet bonded thereto. The composition and method of this invention are useful in applications where high strength, heat resistant materials are required, such as in aircraft and aerospace-related structures.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: April 13, 2004
    Assignee: Rohr, Inc.
    Inventor: Andrew J. Strutt
  • Patent number: 6709766
    Abstract: A method of manufacturing a structural assembly is provided. In one embodiment, the method includes the steps of providing first and second structural members having preselected shapes and dimensions. The first structural member defines a first raised portion and the second structural member defines a second raised portion. According to one embodiment, the providing step includes forming the first and second structural members into preselected shapes and dimensions. The first and second structural members can comprise plates, T-stiffeners or tubular members. The first raised portion of the first structural member is positioned adjacent to the second raised portion of the second structural member following the providing step to thereby define an interface therebetween and wherein the first and second raised portions define a substantially consumable weld land.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: March 23, 2004
    Assignee: The Boeing Company
    Inventors: Gary W. Coleman, Terry L. Smith, Joseph Peter Reilley, Warner B. Vanaken, James H. Lee, Kevin L. Nash, Julius J. Schaan, Scott W. Franz
  • Patent number: 6696137
    Abstract: PCD and PCBN composite constructions have an ordered structure of two or more material phases that are combined together in a packed or interwoven configuration. One of the material phases is formed from materials selected from the group consisting of: polycrystalline diamond, polycrystalline cubic boron nitride; carbides, borides, nitrides, and carbonitrides from groups IVA, VA, and VIA of the Periodic Table; and mixtures thereof. Another material phase is preferably formed from a material having a degree of ductility that is higher than that of the first material phase. Example second material phase materials include those selected from the group consisting of cermets, Co, Ni, Fe, W, Mo, Cu, Al, Nb, Ti, Ta, and mixtures thereof.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: February 24, 2004
    Assignee: Smith International, Inc.
    Inventor: Zhou Yong
  • Patent number: 6696168
    Abstract: A composite strip of compacted powders, which has a three layers structure, is continuously obtained by means of a rolling machine for powder compacting. The composite strip is sintered at a temperature of 460° C. to 550° C. to form a sintered composite strip. The sintered composite strip is continuously bonded by rolling to a steel strip. The bonded composite strip is optionally subjected to a heat treatment of heating at a temperature of 250° C. to 400° C. followed by heating to a temperature of 400° C. to 510° C., holding the strip under the temperature for not less than 30 seconds, and rapidly cooling down to 300° C. at a cooling rate of not lower than 50° C./minute, whereby obtaining a multi-layered composite material consisting of the steel strip, a sintered bonding layer, a sintered sliding layer and a sintered sacrificial layer.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: February 24, 2004
    Assignee: NDC Company Ltd.
    Inventors: Yasukuni Hasegawa, Koue Ohkawa, Hiroyuki Sugawara
  • Patent number: 6692842
    Abstract: Wires and cables made from ceramic oxide fibers encapsulated within a matrix that includes aluminum.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: February 17, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Colin McCullough, Doug E. Johnson
  • Patent number: 6692841
    Abstract: A friction welded joint structure includes friction welded dissimilar first and second metallic materials. The first metallic material has a rigidity greater than the second metallic material. The angle of the first metallic material to a free edge of the first metallic material, at an end portion of a joined surface between the first and second metallic materials, is greater than or equal to 120 degrees or in the range of from 55 degrees to 85 degrees. A reaction layer between the first and second metallic materials is more than zero and less than or equal to 20 &mgr;m. The first metallic material is copper. The second, which has the smaller rigidity, is aluminum.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: February 17, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takahiko Shindo, Yoshiyasu Itoh, Katsumi Suzuki
  • Patent number: 6673469
    Abstract: Arrangement (1) for decreasing galvanic corrosion between metal components that includes at least a first component (2) in which a first metal is a part, and at least a second component (3) in which a second metal is a part, whereby the first metal has a higher normal-electrode potential (e0) than the second metal. The first component (2) is intended, after mounting, to be in electrical contact with the second component (3). The first component (2) is coated with a substantially continuous surface layer (4) that is adjusted to give the second component (3) an insignificant galvanic corrosion velocity after mounting. The invention is preferably applied in association with attachment elements such as bolt or screw joint reinforcements, which include a more noble metal than the component or the components with which the attachment element should be in contact with after mounting, and is particularly, preferred for vehicle components.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: January 6, 2004
    Assignee: Volvo Personvagnar AB
    Inventors: Malte Isaccsson, Henrik Hyttel, Thomas Hermansson, Stig Andersen, Kalsten Andersen, Mikael Fransson
  • Patent number: 6666994
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: December 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6660405
    Abstract: An abradable coating composition for use on shrouds in gas turbine engines (or other hot gas path metal components exposed to high temperatures) containing an initial porous coating phase created by adding a “fugitive polymer” (such as polyester or polyimide) to the base metal alloy, together with a brittle intermetallic phase such as &bgr;-NiAl that serves to increase the brittle nature of the metal matrix, thereby increasing the abradability of the coating at elevated temperatures, and to improve the oxidation resistance of the coating at elevated temperatures. Coatings having about 12 wt % polyester has been found to exhibit excellent abradability for applications involving turbine shroud coatings. An abradable coating thickness in the range of between 40 and 60 ml provides the best performance for turbine shrouds exposed to gas temperatures between 1380° F. and 1850° F.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: December 9, 2003
    Assignee: General Electric Co.
    Inventors: Yuk-Chiu Lau, Farshad Ghasripoor, Dennis M. Gray, Chek Beng Ng
  • Patent number: 6659333
    Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: December 9, 2003
    Assignee: Emitec Gesellschaft fuer Emissionstechnologie mbH
    Inventors: Ludwig Wieres, Ferdi Kurth, Helge Schlotmann
  • Patent number: 6623867
    Abstract: The present invention is generally directed towards a carrier of a motor vehicle. The carrier is formed of a first portion and the second portion. The first portion is made of aluminum having ceramic particles reinforcing the aluminum matrix. The second portion is made of unreinforced aluminum metal or metal alloy. Preferably the second portion is present in form of discrete pockets in the first portion and is adapted to be machined or welded.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: September 23, 2003
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Frank Victor Crocco, Jonathan Mark Adler, Nicholas James Gianaris
  • Patent number: 6610415
    Abstract: Thin, flexible composite materials, which are magnetic or magnetizable and processes for producing and using the materials. The composite material contains a laminate formed from a mixture of magnetic or magnetizable particles, binder particles (and optionally active particles), applied to and fused and/or coalesced with a first substrate. The composite preferably contains an additional second substrate fused to and/or coalesced with, the laminate on the side of the laminate opposite that of the first substrate.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: August 26, 2003
    Assignee: Koslow Technologies Corporation
    Inventor: Evan E. Koslow
  • Patent number: 6607841
    Abstract: An improved silicon steel sheet has two lateral ends each having a side edge narrower than the width of the silicon sheet. The side edge has two end points linking respectively to two lateral sides of the silicon steel sheet to form two symmetrical slant edges for reducing tension area of the silicon steel sheet at the side edge. The slant edges and the side edges form two solder zones to anchor the silicon steel sheet for soldering at the initial winding stage and after the winding is completed.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: August 19, 2003
    Inventor: Albert Chow
  • Patent number: 6598782
    Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: July 29, 2003
    Assignee: Emitec Gesellschaft fuer Emissionstechnologie mbH
    Inventors: Ludwig Wieres, Ferdi Kurth, Helge Schlotmann
  • Patent number: 6592787
    Abstract: An improved porous article and a method for forming such porous article are provided. A mixture of ceramic or metal particles and pliable organic hollow spheres is prepared in a liquid, typically as a suspension. The article is formed by pressing, slip casting, extruding or injection molding the mixture. The article is dried to remove the liquid, and then is fired so that the particles are bonded such as by sintering, and the organic spheres are eliminated, resulting in a strong porous article having uniformly spaced interconnected voids.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: July 15, 2003
    Assignee: Porvair Corporation
    Inventors: Gary R. Pickrell, Kenneth R. Butcher, Chi Li Lin
  • Patent number: 6586111
    Abstract: Multilayer metal foil pads or panels for heat or sound insulation or shielding comprising two or more corrugated metal foil or metal sheet layers wherein a flat metal foil or metal sheet layer is positioned between each pair of corrugated layers. The corrugated layers and/or the flat layers may be embossed, patterned or textured to enhance performance of the pad or panel. A preferred pad or panel comprises an embossed, patterned or textured flat exterior layer adapted for contacting the surface to be insulated or shielded to provide air space between the pad or panel and the surface and to separate the first corrugated layer from the surface. Methods are provided for making the pads and panels, which are useful in automotive applications, food cooking devices and other uses.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: July 1, 2003
    Assignee: ATD Corporation
    Inventors: Christopher V. Ragland, Raymond E. Ragland, Matthew S. Remke, J. Bradley Pearce
  • Patent number: 6524385
    Abstract: In a single crystal SiC composite material for producing a semiconductor device, and a method of producing the same according to the invention, a single crystal SiC film which is produced on an Si substrate by the heteroepitaxial growth method and obtained by removing the Si substrate, is stacked and bonded via a film-like SiO2 layer onto the surface of a polycrystalline plate consisting of Si and C atoms in a closely contacted manner forming thereby a stacked composite member. The stacked composite member is then heat-treated, whereby single crystal SiC in which the crystal is transformed in the same orientation as the single crystal of the single crystal SiC film is integrally grown on the polycrystalline plate. The thickness and the strength which are requested for producing a semiconductor device can be ensured, and lattice defects and micropipe defects seldom occur, so that an accurate and high-quality semiconductor device can be produced.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: February 25, 2003
    Assignee: Nippon Pillar Packing Co., Ltd.
    Inventors: Kichiya Tanino, Nobuhiro Munetomo
  • Patent number: 6511758
    Abstract: A porous structural material having a solid shape with a curved surface of which the dimensional accuracy is high and the uses are wide is produced. The porous structural material is made form metallic chips containing at least one kind of ingredients, and comprises a solid-shaped body having a smooth and curved surface, the solid-shaped body being reformed by compacting a plate-shaped intermediate product in the hot state, the product being a molding with heating under a pressure while being highly electrified.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: January 28, 2003
    Assignee: Suitaya Co., Ltd.
    Inventor: Katsumi Kaitani