Abstract: An acoustic resonator structure is provided. The acoustic resonator structure includes an acoustic resonator configured to resonate in a first frequency to pass a radio frequency (RF) signal. However, the acoustic resonator may create an electrical capacitance outside the first frequency, which can cause the acoustic resonator to resonate at a second frequency in parallel to the first frequency, thus compromising performance of the acoustic resonator. In this regard, a passive acoustic circuit is provided in parallel to the acoustic resonator in the acoustic resonator structure. The passive acoustic circuit can be configured to resonate in the second frequency to cancel the electrical capacitance created by the acoustic resonator. As such, it may be possible to improve performance of the acoustic resonator without significantly increasing complexity and footprint of the acoustic resonator structure.

Abstract: A resonator is provided that includes a vibrating section that vibrates in a contour vibration mode, a frame that surrounds at least a portion of the vibrating section, supporting sections extending along a Y-axis direction and connecting the vibrating section and the frame. The vibrating section includes a through hole that extends along an X-axis direction perpendicular to the Y-axis direction such that a coupling section is disposed between the through hole and each of the supporting sections. The length SL of the through hole in the X-axis direction is longer than the length Sd of the coupling section in the Y-axis direction.

Abstract: A system of free running oscillators synchronized to the lowest frequency running one and following PVT variation generates a system clock. A method is particularly applicable to clock relatively small clock domains within a multi-core chip containing thousands of cores, and where the clock domain encompasses one or more cores and additional logic blocks. The resulting system clock is divided by 2k using latches or flip-flops to achieve a symmetric 50-50 duty cycle of the system clock. Further, such PVT insensitive system clock can be used as a reference for a PLL or DLL generated clock for the domain.

Abstract: A transmitter transmits a first channel quality information report for reporting an average of channel quality measurement values of resource blocks with a first predetermined reporting frequency. The transmitter also transmit a second channel quality information report on channel quality measurement values of a predetermined number of selected resource blocks. The second channel quality information report is transmitted between two transmissions of the first channel quality information report. The second channel quality information report on the channel quality measurement values of the predetermined number of selected resource blocks is transmitted with a second predetermined reporting frequency in the periodic transmission. The first predetermined reporting frequency is different from the second predetermined reporting frequency in the periodic transmission.

Abstract: A resonator includes a vibration portion with a vibration arm extending from a base and having an open end that performs bending vibration. The vibration portion includes upper and lower electrodes with a piezoelectric film disposed therebetween that causes bending vibration of the vibration arm when a voltage is applied between the upper and lower electrodes. A protective film faces the piezoelectric film with the upper electrode interposed therebetween and a conductive film faces the piezoelectric film with the protective film interposed therebetween. Moreover, the conductive film is exposed in a region at the open end and a via electrode is formed in the protective film to electrically connect the conductive film to one of the upper and lower electrodes. The via electrode is positioned closer to a first region than the open end in the second region of the vibration arm in a plan view of the piezoelectric film.

Abstract: A method for generating high order harmonic frequencies includes: providing a piezoelectric resonant film; and inputting a driving signal with a single tone frequency for driving the piezoelectric resonant film to oscillate in a non-linear region so as to generate a plurality of high order harmonic frequencies. Therefore, the quantity of the high order harmonic frequencies can be adjusted by applying an electrical controlling method.

Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.

Abstract: A micromechanical system (MEMS) acoustic wave resonator is formed on a base substrate. A piezoelectric member is mounted on the base substrate. The piezoelectric member has a first electrode covering a first surface of the piezoelectric member and a second electrode covering a second surface of the piezoelectric member opposite the first electrode, the second electrode being bounded by a perimeter edge. A first guard ring is positioned on the second electrode spaced apart from the perimeter edge of the second electrode.

Abstract: An electronic component includes a metal cap including a first main-surface having a flat plate-like shape with a first main surface and an annular portion that has an annular shape and that surrounds the first main surface when viewed in a direction perpendicular to the first main surface. The first main-surface and the annular portion forming a recess. A substrate is provided having a flat plate-like shape with a second main surface that hermetically seals the recess, a joining member that joins the cap and the substrate to each other, with an element accommodated in the recess. An outer peripheral surface of the annular portion has a band-shaped region between the first and second main surfaces in the direction perpendicular to the first main surface. A groove is formed in the band-shaped region that extends in a circumferential direction of the annular portion.

Abstract: Micro-machined acoustic and ultrasonic transducer (MAUT), particularly piezoelectric MAUT (PMAUT), performance tradeoffs have meant reasonable pixel depth resolution necessitated low quality factor (Q) transducers with power distributed over a large bandwidth yielding modest imaging ranges whilst high-Q transducers providing higher acoustic power output for longer imaging ranges exhibit extended ringing limiting pixel depth information. Accordingly, the inventors have established MAUTs supporting high-Q transducers for long-range high-resolution imaging by integrating electromechanical actuators (dampers) which can be selectively engaged to mechanically damped the MAUT. In several applications PMAUT arrays are required where all transducer elements should have almost identical resonant frequencies. However, prior art fabrication processes have tended to produce PMAUTs with large inter-chip and inter-wafer variances.

Abstract: A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.

Abstract: A system includes a Zero IF transmitter having a mixer and a programmable gain stage. The Zero IF transmitter also includes an intermediate stage between the mixer and the programmable gain stage, wherein the intermediate stage is configured to decouple the mixer and the programmable gain stage.

Abstract: A method for measuring equivalent circuit parameters and resonant frequency of a piezoelectric resonator, by which the phase-frequency curve of the piezoelectric resonator is measured, and the resonant frequency and the anti-resonant frequency are obtained. Then, the slopes of the phase-frequency curve at the resonant frequency and the anti-resonant frequency are respectively measured. The resonant angular frequency and the anti-resonant angular frequency are also calculated. Finally, the equivalent circuit parameters of the piezoelectric resonator are obtained by solving a system of nonlinear equations.

Abstract: A resonator that includes a piezoelectric vibrating portion; a retainer provided in at least part of an area surrounding the piezoelectric vibrating portion; a first node generating portion disposed between the piezoelectric vibrating portion and the retainer; a first connecting arm that connects the first node generating portion to a region in the piezoelectric vibrating portion that faces the first node generating portion; and a first retaining arm that connects the first node generating portion to a region in the retainer that faces the first node generating portion. The first node generating portion is substantially symmetrical with respect to each of two lines passing through a center of the first node generating portion along a first direction and a second direction orthogonal to the first direction, with the first direction being a direction that the first connecting arm connects the first node generating portion to the piezoelectric vibrating portion.

Abstract: A resonator is provided that includes a base, and three or more vibrating arms each including a first and second electrodes and a piezoelectric film disposed therebetween and having a top surface facing the first electrode. The piezoelectric film vibrates in a predetermined vibration mode when a voltage is applied between the first and second electrodes. Moreover, the three or more vibrating arms include two first arms each located on an outermost side in a direction in which the three or more vibrating arms are arranged and that vibrate in a same phase, and one or more second arms disposed between the two first arms. Each first arm is greater in mass than each second arm.

Abstract: An oscillator includes: a bulk-acoustic wave (BAW) resonator having a first BAW resonator terminal and a second BAW resonator terminal; and an active circuit coupled to the first and second BAW resonator terminals and having a series resonance topology with: a first transistor; a second transistor; a first resistor; a second resistor; a capacitive network coupled to first and second BAW resonator terminals and to respective current terminals of the first and second transistors; and an inductor having a first inductor terminal and a second inductor terminal, the first inductor terminal coupled to the capacitive network, and the second inductor terminal coupled to ground terminal.

Abstract: In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.

Abstract: A bulk acoustic wave (BAW) structure includes a single crystal piezoelectric material layer, a first electrode, a second electrode and an acoustic reflector. The first and second electrodes are respectively located on a first surface and a second surface of the single crystal piezoelectric material layer. The area of the second electrode is greater than or equal to that of the second surface of the single crystal piezoelectric material layer, and the contact area of the single crystal piezoelectric material layer with the second electrode is equal to the area of the second surface of the single crystal piezoelectric material layer. The acoustic reflector is disposed on a surface of the first electrode.

Abstract: A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. The piezoelectric layer is a single crystal of LiNbO3 cut at an angle of 130°±30°. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.

Abstract: An oscillator system includes a first oscillator structure configured to oscillate about a first rotation axis at a first oscillation frequency; a second oscillator structure configured to oscillate about a second rotation axis at a second oscillation frequency; a driver circuit configured to generate a first driving signal to drive an oscillation of the first oscillator structure with a first oscillation phase and the first oscillation frequency and generate a second driving signal to drive an oscillation of the second oscillator structure with a second oscillation phase and the second oscillation frequency. The first oscillation frequency and the second oscillation frequency have a variable frequency ratio with respect to each other that varies over time. The driver circuit is configured to modulate at least one of the first oscillation phase or the second oscillation phase to modulate the variable frequency ratio.