Patents Examined by Jeffrey T Carley
  • Patent number: 12208435
    Abstract: A modified lug press and use thereof is described. The modified lug press includes a press and a cartridge. The press includes a drive which, when activated, crimps a lug, positioned on a die, to a wire. A cartridge holds the given lug and at least one additional lug, and successively aligns the given lug and the at least one next lug for insertion onto the die for crimping by the press. The cartridge includes a left rail, with a track therein, at least one middle rail, and a right rail. Distances between the rails may be adjustable. A drive motor, when activated, successively pushes lugs onto the die. A lug separator permits one lug to be pushed on the die at any given time. A lug placement device inhibit lateral lug movement during wire insertion and crimping operations.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: January 28, 2025
    Assignee: DISH Wireless L.L.C.
    Inventor: Jimmy A. Pollard, Jr.
  • Patent number: 12213383
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a piezoelectric membrane overlying a substrate. A plurality of conductive layers is disposed within the piezoelectric membrane. The plurality of conductive layers comprises a first conductive layer over a second conductive layer. The first conductive layer comprises a first electrode and the second conductive layer comprises a second electrode. A first conductive via is disposed in the piezoelectric membrane and contacts the first electrode. A second conductive via is disposed in the piezoelectric membrane and contacts the second electrode. A sidewall of the second conductive via comprises a vertical sidewall segment overlying a slanted sidewall segment.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Jung Chen, Ming Chyi Liu
  • Patent number: 12199587
    Abstract: A surface acoustic wave (SAW) device according to the present invention includes: a substrate; an intermediate layer formed on an upper surface of the substrate; a piezoelectric layer formed on an upper surface of the intermediate layer; and an inter-digital transducer (IDT) electrode formed on an upper surface of the piezoelectric layer to generate a SAW, wherein an upper portion of the substrate is deformed by a predetermined thickness by ion implantation to form an ion trap layer and the intermediate layer is formed on an upper surface of the ion trap layer.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: January 14, 2025
    Assignee: WISOL CO., LTD.
    Inventors: Tae Hyun Kim, Chul Hwa Lee, Hun Yong Lee, Kihara Yoshikazu
  • Patent number: 12200870
    Abstract: A component mounting system includes a component mounting device (15) configured to mount a component (E) on a board (S), a component storage (20) configured to store a component containing member (200) configured to contain a plurality of the components to be mounted on the board by the component mounting device, and a controller (22) configured to control an order in which the component containing member is unloaded from the component storage. The controller is configured to control the order in which the component containing member is unloaded based on an unloading priority when a plurality of the component containing members are scheduled to be unloaded.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 14, 2025
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Hiroaki Nitta
  • Patent number: 12193612
    Abstract: An apparatus and a method relate to forming a filled roll, a sushi roll with a nori seaweed wrap, for example. An issue arises in quickly and easily forming the filled roll at a place of convenience at home, for example. The present disclosure addresses the issue by providing the apparatus with two horizontal rods, front and back rods, the back rod positioned higher than the front rod. The rods are wrapped and connected by a continuous mat that grips without adhering to the rods and the filling. The back rod is positioned higher than the front rod. The continuous mat forms a longitudinal pocket between the two rods to receive filling. Rotating one of the two rods in one direction causes the filling to roll and forms a roll. The filled roll arises from the longitudinal pocket for removal while rotating the rods in another direction.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: January 14, 2025
    Inventors: Deborah A. Campbell, Ian L. Campbell
  • Patent number: 12191838
    Abstract: Methods of fabricating resonator and filter devices. A first conductor pattern formed on a front surface of a piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. An acoustic Bragg reflector is between a substrate and a back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode. A second conductor pattern including a second plurality of contact pads is formed on a back surface of the interposer. The first plurality of contact pads is directly connected to respective contact pads of the second plurality of contact pads. A perimeter of the acoustic resonator chip is sealed to a perimeter of the interposer.
    Type: Grant
    Filed: November 7, 2021
    Date of Patent: January 7, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ventsislav Yantchev, Bryant Garcia, Viktor Plesski, Soumya Yandrapalli, Robert B. Hammond, Patrick Turner, Jesson John
  • Patent number: 12186791
    Abstract: Shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can include applying a rotational shearing force and an axial extrusion to the same location on the feedstock material. Devices for this can include a die tool defined by a die face extending from a rim of the die face inwardly at an angle greater than zero in relation to a sidewall of the die tool in at least one cross section; and/or a die tool defining an opening configured to receive feedstock material for extrusion and further defining a die face defining a recess within the die face and contiguous with the opening. Shear-assisted extrusion processes are also provided that can mix different portions of the feedstock material within a recess about the opening prior to feedstock material entering the opening; and extruding the mixed portions.
    Type: Grant
    Filed: September 27, 2020
    Date of Patent: January 7, 2025
    Assignee: Battelle Memorial Institute
    Inventors: Scott A. Whalen, Darrell R. Herling, Xiao Li, MD. Reza-E-Rabby, Brandon Scott Taysom, Glenn J. Grant
  • Patent number: 12191837
    Abstract: Resonator and filter devices and methods of fabrication. A resonator chip includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between the substrate and a back surface of the piezoelectric plate. A conductor pattern on a front surface of the piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic Bragg reflector is configured to reflect the shear primary acoustic mode. An interposer has a second plurality of contact pads on a back surface. A seal connects a perimeter of the piezoelectric plate to a perimeter of the interposer. Each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.
    Type: Grant
    Filed: November 7, 2021
    Date of Patent: January 7, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ventsislav Yantchev, Bryant Garcia, Viktor Plesski, Soumya Yandrapalli, Robert B. Hammond, Patrick Turner, Jesson John
  • Patent number: 12184132
    Abstract: Various embodiments include a method for manufacturing a magnetic sheet comprising: positioning a nonmagnetic sheet with recessed regions; filling the recessed regions with a soft-magnetic material using additive manufacturing; and fixing the soft-magnetic material to the sheet in a material-bonded manner.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 31, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Carsten Schuh, Rolf Vollmer
  • Patent number: 12184133
    Abstract: A device for adhering magnetic pole shoes on a rotor includes a soleplate, wherein a support seat is arranged on the soleplate; a magnet positioning seat is arranged above the support seat; the magnet positioning seat has a support frame, which includes an upper plate and a lower plate, with the lower plate having a first evading groove for evading a rotor core, and the upper plate having a second evading groove for evading an upper end of a rotor shaft; and fixation units and a plurality of positioning plates being provided between the upper and lower plates, each fixation unit including a push rod in sliding fit with the support frame and the push rod can move axially, a magnet positioning block being fixed at an inner end of the push rod, each positioning plate being located between two adjacent fixation units.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: December 31, 2024
    Assignee: HENGDIAN GROUP INNUOVO ELECTRIC CO., LTD.
    Inventors: Kedi Shan, Junjian Lu, Caiping Xu, Chenhui Jin
  • Patent number: 12184134
    Abstract: In an embodiment a method includes cutting a material coil by a predetermined length, forming a vertex and inclined portions on the material coil, loading the vertex and the inclined portion so as to be interposed between an upper mold and a lower mold, forming the vertex into a front/rear bent portion so that the inclined portions are positioned on different lines based on the vertex by combining the upper and lower molds, loading ends of the inclined portions so as to be interposed between clamping pins and rotating a clamping part so that the inclined portions are rounded in front and rear directions.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: December 31, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Seungkyu Jang
  • Patent number: 12183504
    Abstract: A method and a device for connecting sheet metal parts to form lamination stacks, wherein a sheet metal strip whose top and/or bottom surface has a hardenable polymer adhesive layer is transported continuously through an application device in which a fluid that contains an activator is applied to the adhesive layer, the applied fluid is dried, the sheet metal strip that is coated with the dried activator is continuously fed to a strip accumulator, the sheet metal strip from the strip accumulator is fed to a cyclically operating cutting device in which sheet metal parts are cut from the sheet metal strip and stacked on one another, and the cut and stacked sheet metal parts are connected to one another to form lamination stacks by means of the adhesive layers that are coated with the activator. The invention also relates to the lamination stacks produced according to the method.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: December 31, 2024
    Assignee: voestalpine Automotive Components Dettingen GmbH & Co. KG
    Inventors: Heinrich Bursy, Jochen Lanksweirt, Axel Rainer Nann
  • Patent number: 12184048
    Abstract: A method of manufacturing a plurality of conductor elements includes providing the plurality of conductor elements, each conductor element includes a conductor end section having an electrically insulating surface coating; securing the conductor end sections of the conductor elements with respect to each other; and simultaneously removing at least a portion of the electrically insulating surface coatings of the conductor end sections using a machining surface of a stripping tool being moved along the conductor end sections.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: December 31, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Thomas Baranowski, Julius Maximilian Engelke, Maira Magnani, Maik Broda, Raphael Koch, Marcel Mathissen
  • Patent number: 12170165
    Abstract: Electrical/magnetic components and methods of making such components are provided. One method includes providing a multilayer printed circuit board (PCB) including conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes. The method further includes forming a hole in the PCB at each of the one or more predetermined axes to accommodate one or more core legs. For each hole, an inner edge of one of the windings overlaps an edge of the hole in a lateral direction after the hole is formed. The method further includes assembling a magnetically permeable core including the one or more core legs, each core leg extending into one of the holes at the one or more predetermined axes.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: December 17, 2024
    Assignee: Vicor Corporation
    Inventor: Patrizio Vinciarelli
  • Patent number: 12170466
    Abstract: Systems and methods to form concentrated motor windings may include bending wires into a U-shape, inserting the wires onto a stator pole, bending ends of the wires around the stator pole, and welding respective pairs of the ends of the bent wires. In some example embodiments, the U-shape may include a twist along a central portion thereof. In other example embodiments, a twist may be introduced along the respective pairs of bent ends of the wires that are then welded. In addition, the wires may be stacked and laterally inserted onto the stator pole. Further, the wire bending, twisting, insertion, welding, and other forming processes may be performed by automated or robotic machinery or equipment.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: December 17, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Tausif Husain, Rick Roller, Sung Ho An
  • Patent number: 12167694
    Abstract: A method for transferring a piezoelectric layer onto a support substrate comprises: —providing a donor substrate including a heterostructure comprising a piezoelectric substrate bonded to a handling substrate, and a polymerized adhesive layer at the interface between the piezoelectric substrate and the handling substrate, —forming a weakened zone in the piezoelectric substrate, so as to delimit the piezoelectric layer to be transferred, —providing the support substrate, —forming a dielectric layer on a main face of the support substrate and/or of the piezoelectric substrate, —bonding the donor substrate to the support substrate, the dielectric layer being at the bonding interface, and—fracturing and separating the donor substrate along the weakened zone at a temperature below or equal to 300° C.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: December 10, 2024
    Assignee: SOITEC
    Inventors: Djamel Belhachemi, Thierry Barge
  • Patent number: 12165890
    Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: December 10, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonyong Park, Dongho Kim, Hyunjoon Kim, Seogwoo Hong, Kyungwook Hwang, Junsik Hwang
  • Patent number: 12166467
    Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: December 10, 2024
    Assignee: Statek Corporation
    Inventors: Yue Fang, Thomas Pham
  • Patent number: 12166195
    Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: December 10, 2024
    Assignee: QID OY
    Inventors: Pekka Tapani Saastamoinen, Reijo Lappalainen, Petteri Koljonen
  • Patent number: 12167539
    Abstract: There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: December 10, 2024
    Assignee: FUJI CORPORATION
    Inventor: Hideki Hashimoto