Abstract: Systems and methods to form concentrated motor windings may include bending wires into a U-shape, inserting the wires onto a stator pole, bending ends of the wires around the stator pole, and welding respective pairs of the ends of the bent wires. In some example embodiments, the U-shape may include a twist along a central portion thereof. In other example embodiments, a twist may be introduced along the respective pairs of bent ends of the wires that are then welded. In addition, the wires may be stacked and laterally inserted onto the stator pole. Further, the wire bending, twisting, insertion, welding, and other forming processes may be performed by automated or robotic machinery or equipment.

Abstract: A method for transferring a piezoelectric layer onto a support substrate comprises: —providing a donor substrate including a heterostructure comprising a piezoelectric substrate bonded to a handling substrate, and a polymerized adhesive layer at the interface between the piezoelectric substrate and the handling substrate, —forming a weakened zone in the piezoelectric substrate, so as to delimit the piezoelectric layer to be transferred, —providing the support substrate, —forming a dielectric layer on a main face of the support substrate and/or of the piezoelectric substrate, —bonding the donor substrate to the support substrate, the dielectric layer being at the bonding interface, and—fracturing and separating the donor substrate along the weakened zone at a temperature below or equal to 300° C.

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.

Abstract: There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.

Abstract: Solid-state devices including a layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, WNx, or alloys thereof, and one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material, the semiconducting or insulating material being one of a Group III N material or alloys thereof or a Group 4b N material or SiC or ScN or alloys thereof.

Abstract: A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode material layer, a piezoelectric layer, and a bottom electrode material layer on a substrate; patterning the bottom electrode material layer to form a bottom electrode; forming a sacrificial layer above the bottom electrode; bonding a bottom cap wafer onto the sacrificial layer; removing the substrate; patterning the top electrode material layer to form a top electrode; and removing a portion of the sacrificial layer to form a lower cavity.

Abstract: A parts replenishment system configured to replenish a parts supply device attached to a parts mounting device with parts includes an instruction device configured to issue an instruction to unload the parts from a storage. The parts replenishment system further includes a presentation device configured to present preprocessing identification information for identifying preprocessing, which is processing on a packaging material for the parts for which an unloading instruction has been issued by the instruction device before replenishment of the parts supply device with the parts.

Abstract: Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.

Abstract: The invention relates to a method for producing a medical electrode, comprising the following steps: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic iridium complex compound dissolved in the solvent; (iii) heating the composition, and thereby forming a noble metal layer on the substrate.

Abstract: Systems and methods for inserting a single pore into a membrane are described herein. A stepped or ramped voltage waveform can be applied across the membranes of the cells of an array, where the voltage waveform starts at first voltage and increases in magnitude over a period of time to a second voltage. The first voltage is selected to be low enough to reduce the risk of damaging the membrane, while the rate of voltage increase is selected to provide sufficient time for the pores to insert into the membranes. Once a pore is inserted into the membrane, the voltage across the membrane rapidly drops, thereby reducing the risk of damaging the membrane even if the applied voltage between the electrodes is further increased.

Abstract: In a component adsorption nozzle, the nozzle can be attached to both of the in-line shaft and the rotary shaft by utilizing the outside (outer wall) of the nozzle body for attaching to the in-line shaft and utilizing the inside (inner wall) of the nozzle body for attaching to the rotary shaft. Therefore, for a user who owns each of the in-line type and rotary type component mounters, it is not necessary to prepare a nozzle dedicated to each type component mounter and it is possible to reduce the burden required for preparing the nozzle.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.

Abstract: Methods and systems for a dielectric material coated busbar are provided. In one example, a conductive material may be formed into a shape of a busbar and portions of the busbar may be selectively coated with a dielectric material which may be both electrically insulating and thermally conductive. The dielectric coated portions of the busbar may dissipate heat to a heat sink via a thermal interface material compressed on the busbar.

Abstract: A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.

Abstract: A battery pack manufacturing method includes (a) stacking battery cells to form a cell stack, (b) coupling the cell stack and a U-frame to each other, (c) measuring the volume of the space between a flat plate coupled to the U-frame and the cell stack, and (d) applying a polymer resin corresponding in amount to the volume measured in step (c).

Abstract: Provided is a method of manufacturing a bulk acoustic wave resonator, which includes: providing a piezoelectric substrate for forming a piezoelectric layer; forming a first electrode structure on the portion of the piezoelectric substrate for forming the piezoelectric layer; forming a dielectric layer on the first electrode structure, and performing a patterning process on the dielectric layer to form a patterned dielectric layer comprising a sacrificial dielectric part and a periphery dielectric part; forming a boundary layer on the patterned dielectric layer, the boundary layer covering a surface of the patterned dielectric layer and surrounding the sacrificial dielectric part; thinning the piezoelectric substrate to form the piezoelectric layer, the first electrode structure being located at a first side of the piezoelectric layer; forming a second electrode structure on a second side of the piezoelectric layer; and removing the sacrificial dielectric part to form a resonant cavity.