Abstract: Apparatus and methods for inserting and retention testing an electrically conductive contact in an electrical connector. The method includes the following steps: manually partially inserting the contact into a hole formed inside the electrical connector; inserting the contact further into the hole by pushing the contact along an axis using an insertion tip that is aligned with the axis and that displaces in a first direction along the axis during inserting; and after inserting the contact further into the hole, testing retention of the contact inside the electrical connector by pushing the contact along the axis using a test probe that is aligned with the axis and that displaces in a second direction opposite to the first direction during retention testing. The force exerted by the test probe on the contact is less than a specified contact retention force.

Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

Abstract: Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

Abstract: A method of preparing a piezoelectric single crystal with high piezoelectricity and near- perfect transparency. The method includes depositing electrodes on two opposition surfaces of a piezoelectric single crystal which is a ferroelectric crystal; AC-poling the piezoelectric single crystal through the electrodes by repeatedly changing polarity of an AC electric field; and after polarization, removing the electrodes on the two opposition surfaces of the piezoelectric single crystal and then depositing Ag nanowire or indium tin oxide (ITO) as electrodes on the two opposition surfaces of the piezoelectric single crystal. Repeatedly changing the polarity of the polarized electric field can increase the domain size of the ferroelectric crystal, or reduce the domain wall density of the domain structure, thereby improving the transparency of the piezoelectric single crystal having high piezoelectric.

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

Abstract: A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and at least one semiconductor device formed on the front side, a shielding structure formed on the at least one semiconductor device, and a piezoelectric layer formed on the shielding structure.

Abstract: A method for producing a piezoelectric transducer device is provided, including a membrane including at least one silicon and/or silicon nitride layer; a piezoelectric layer including at least one piezoelectric material with crystalline perovskite structure and arranged on the membrane; first and second electrodes electrically in contact with the piezoelectric layer; and in which the piezoelectric layer is in direct contact with the silicon and/or silicon nitride layer, or in which the piezoelectric layer is in contact with the silicon and/or silicon nitride layer solely through one or more metal layers.

Abstract: A self-powered automobile exhaust gas sensor including a supporting frame, a ferroelectric-triboelectric coupling functional film, and two metal electrodes. The ferroelectric-triboelectric coupling functional film comprises a first end fixed on the supporting beam in middle of the supporting frame, and a second end is freestanding. The two metal electrodes are grounded and adhered on the upper and lower sides of the supporting frame, respectively. An iron block is mounted on the top of the supporting frame.

Abstract: A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

Abstract: A robotic system includes an electrosurgical generator; an electrosurgical instrument including an electrosurgical connector; and a robotic arm having an instrument drive unit coupled to the electrosurgical instrument. The instrument drive unit includes a drive unit housing having: an electrosurgical receptacle coupled to the electrosurgical generator and configured to engage the electrosurgical connector; an activation link configured to engage the electrosurgical connector; and a detection switch actuatable by the actuation link upon being engaged by the electrosurgical connector.

Abstract: A method of manufacturing a piezoelectric resonator unit that includes preparing a piezoelectric resonator having a piezoelectric element, a pair of excitation electrodes respectively disposed on a first main surface and a second main surface of the piezoelectric element so as to face each other with the piezoelectric element therebetween, and a pair of connection electrodes that are respectively electrically connected to the pair of excitation electrodes; electrically connecting the pair of connection electrodes to a pair of electrode pads on a third main surface of a base member using an electroconductive holding member so as to excitably hold the piezoelectric resonator on the third main surface of the base member; and attaching an electroconductive material, which is scattered from an electroconductive member, to a surface of the electroconductive holding member.

Abstract: A metal foil flaring apparatus includes a frame, a flaring mechanism mounted on the frame and having a flaring mouth adapted to open and close, and a first driver mounted on the frame and adapted to drive the flaring mouth to open and close. The flaring mouth has a cone shape gradually contracted toward a front end of the flaring mouth. The front end of the flaring mouth is adapted to be forwardly inserted in a first direction between an inner insulation layer of a cable and a metal foil wrapped around the inner insulation layer when the flaring mouth is closed, flaring the metal foil outwardly into the cone shape.

Abstract: A method for producing an inductive charging device may include inserting a ferrite and a coil, wound from a braid, into a mould; and encasing the ferrite and the braid at least partially with a plastic in a low pressure casting method, a pressing transfer moulding method, or an injection moulding method.

Abstract: Sensor devices including dissolvable tissue-piercing tips are provided. The sensor devices can be used in conjunction with dissolvable needles configured for inserting the sensor devices into a host. Hardening agents for strengthening membranes on sensor devices are also provided. Methods of using and fabricating sensor devices are also provided.

Abstract: The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.

Abstract: In accordance with some embodiments, a method of forming an auto-focusing device is provided. The method includes forming a cantilever beam member. The cantilever beam member has a ring shape. The method further includes forming a piezoelectric member over the cantilever beam member. The method also includes forming a membrane over the cantilever beam member. The membrane has a first region and a second region. The first region has a planar surface, and the second region is located between the first region and an inner edge of the cantilever beam member and has a plurality of corrugation structures. In addition, the method includes applying a liquid optical medium over the membrane and sealing the liquid optical medium with a protection layer.

Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.

Abstract: Pressing jaws for opposite arrangement in crimping pliers, the pressing jaws having ribs, which extend in a rib longitudinal direction and move into each other during pressing. A guide surface extending transversely to the rib longitudinal direction outside of a working region of the ribs is formed, which guide surface interacts with a guide protrusion extending from the opposite pressing jaw. In another version, the pressing jaws have ribs, which are designed to mesh with each other and which have a rib longitudinal direction. Crimping pliers comprise two plier jaws, which are provided with oppositely arranged pressing jaws having ribs, which extend in a rib longitudinal direction and which, during pressing, move into each other and delimit a pressing jaw opening.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: In a component replenishment management system, a setting unit sets work allowable time of an operator in a work area, a replenishment target identification unit identifies component replenishment target devices which are targets of component replenishment work by the operator, and a work progress determination unit determines a progress state of the component replenishment work. Then, an extraction unit extracts the component replenishment target devices for which the component replenishment work is to be performed before work time in the work area by the operator reaches the work allowable time among the component replenishment target devices whose progress state of the component replenishment work is work not performed.