Abstract: The invention relates to an apparatus (70) and method for removing particles from an interior of a CRT envelope (12). The CRT envelope includes a faceplate panel (14), with a color selection electrode assembly (30) detachably mounted therein, sealed to a funnel (18). The apparatus comprises a plurality of thumper mechanisms (84, 184 and 284) for imparting asynchronous vibrations to the funnel of the envelope while the interior of the funnel is flushed with a suitable fluid. The embodiment further includes a plurality of vibrators (51) for imparting asynchronous vibrations to the color selection electrode assembly to remove particles therefrom, before the color selection electrode assembly is mounted into the panel and sealed to the funnel. A method for removing particles using the apparatus also is described.

Abstract: A low mounting impedance ultrasonic transducer for mounting on a bonding machine comprises a prior art type transducer having a modified mounting flange which includes one or more elongated apertures in the mounting flange or the transducer body to isolate transverse radial stress in the transducer body from entering into the mounting flanges and coupling to the bonding machine.

Abstract: A field emission display with enhanced brightness and contrast, and a method for making such a display, is described. The display has a backplate and an opposing face plate, where a glass plate acts as a base for the faceplate. A patterned layer of transparent conductive material is formed over the glass plate, and acts as an anode for the display. There is a plurality of phosphorescent elements formed over the anode. Openings extending between the phosphorescent elements and through the anode. The baseplate, formed on a substrate, is mounted opposite and parallel to the faceplate. There is a reflective, conductive layer over the substrate. A plurality of electron-emitting tips are formed on the baseplate, extend through openings in the reflective, conductive layer, and are formed directly opposite to the phosphorescent elements, and are divided into smaller groups, or pixels. There is black matrix material over the anode around the periphery of each of the pixels.

Abstract: A method of manufacturing an electron source having a plurality of surface-conduction electron-emitting devices arranged on a substrate in row and column directions includes the forming of electron emission portions of the plurality of surface-conduction electron-emitting devices. The forming is carried out by supplying current through the plurality of surface-conduction electron-emitting devices upon dividing them into a plurality of groups. An image forming apparatus passes a current through a plurality of electron sources, which are formed on a substrate and arrayed in the form of a matrix, in dependence upon an image signal, and an image is formed by a light emission in response to electrons emitted from the plurality of electron sources.

Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are available wherein a solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a low melting point metal component having a melting point of about 70.degree. C. or less and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.

Abstract: A cooling drum can continuously cast a favorable band-shaped cast piece having little thermal deformation. The cooling drum comprises a three-layer structure including a rigid member, a cooling member metallurgically bonded to the outside of the rigid member, and a heat-resistance member plated by electro-deposition on the outer circumferential surface of the cooling member. The rigid member is made of austenite group stainless steel, the cooling member is made of Cu or Cu-alloy, and the heat-resistance member is made of either Ni or its alloy or Co or its alloy.

Abstract: An electrical connector comprises a housing and terminals mounted therein, the terminals comprising contact tails for soldered connection to a printed circuit board. The contact tails have sealing material deposited thereon for sealing between the contact tail and housing to prevent solder and flux wicking onto contact sections of the terminals. The concept also advantageously provides sealing of the connector from the environment, whilst using minimal quantities of sealing material and having very small sealing surfaces for increased reliability thereof.

Abstract: A wire bonding method includes the steps of a lowering a capillary tool supplying a wire, restraining the lowering of the capillary tool, and wire bonding the wire to a bonding face. The inertial force of the capillary tool is reduced to almost zero by restraining the lowering of the capillary tool. As a result, wire bonding is performed under proper bonding force since no bonding force is applied to a ball on the tip of wire from the inertial force of the capillary tool. The bonding force is provided using torque control from an electric motor which lowers the capillary tool.

Abstract: A picture apparatus includes a vacuum envelope which has a phosphor screen and a plurality of electron gun assemblies for emitting electron beams to the phosphor screen, and a deflection device for deflecting the electron beams emitted from the electron gun assemblies. The deflection device has a plate-like coupling member arranged to face the vacuum envelope, and a plurality of elemental deflection units for deflecting the electron beams to scan the phosphor screen dividedly. The deflection units are fixed to the coupling member and located at predetermined positions, respectively.

Abstract: A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Abstract: A method for recrystallization of tungsten filaments for incandescent lamps includes the steps of providing a tungsten filament fixed to lead-in wires, providing a light-transmitting glass envelope having a closed first end and an open second end, the first end being closed by an envelope press portion integral with the remainder of the envelope, the press portion having the lead-in wires sealed therein and extending therethrough into the envelope, introducing a forming gas into the envelope, flushing the envelope with infusions of the forming gas, flashing the filament in the presence of the forming gas to recrystallize the filament, evacuating the forming gas from the envelope, introducing fill gas into the envelope, and closing the envelope second end.

Abstract: A method of fabricating an anode plate 80 for use in a field emission device. The method comprises the steps of providing a substantially transparent substrate 88 having spaced-apart, electrically conductive regions 50 on a surface thereof, then coating the anode plate with a substantially opaque material 86. The opaque material 86 is removed from the surface of the conductive regions 50 in the active area 58, and from selected areas 60 of the interconnect portion of the conductive regions 50. A first bus 52 is provided for electrically connecting a first series 50.sub.R of the conductive regions 50, a second bus 54 is provided for electrically connecting a second series 50.sub.G of the conductive regions 50, and a third bus 56 is provided for electrically connecting a third series 50.sub.B of the conductive regions 50. Luminescent material of a first color 84.sub.R is applied to the first series of conductive regions 50.sub.R, luminescent material of a second color 84.sub.

Abstract: In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

Abstract: A porous dielectric material such as silica-based aerogel is used as the dielectric layer 48 between the gate and the cathode on the emitter plate 12 of a field emission device. Aerogel, which can have a relative dielectric constant as low as 1.03, is deposited over the resistive layer 44 of the emitter plate 12. Metal layer 49, functioning as the gate electrode, is subsequently deposited over the aerogel layer 48. The use of aerogel as a gate dielectric reduces power consumption. In a disclosed embodiment, aerogel layer 48 is comprised of sublayers 48a, 48b, and 48c of aerogels of differing densities, thereby providing better adhesion of the aerogel gate dielectric to both the resistive layer 44 and metal layer 49. Methods of fabricating the aerogel gate dielectric are disclosed.

Abstract: An internal welding fixture is disclosed for locating and temporarily retaining two tubular workpieces relative to one another. The internal welding fixture includes a plurality of shoe assemblies, each of the shoe assemblies being radially disposed about a single axis and being radially movable between a contracted position and an expanded position. The shoe assemblies are equally divided into first and second groups of shoe assemblies. The internal welding fixture further includes a drive arrangement operatively connected to each of the shoe assemblies for moving each shoe assembly between its contracted position and its expanded position. The shoes of one of the groups of shoe assemblies are interconnected to the actuator through a delay mechanism which serves to mechanically delay retraction. Upon expansion of the shoe assemblies, the internal welding fixture is operative to reinforce and temporarily retain a joint formed between two tubular workpieces during a joining procedure, such as welding.

Abstract: An arrangement of applying flux in solid, liquid or gaseous form directly to the solder wave avoids prefluxing of printed circuit boards or other elements to be soldered or solder wetted. The process for wave soldering an element comprises the steps of forming a solder wave above a solder reservoir, applying a flux directly to the solder wave separately from a shield gas delivery means to blanket the solder wave, and conveying the element through at least a portion of the solder wave. The process is applicable to wave soldering under a shroud wherein a gas shield is supplied by diffusers under the shroud, the flux being applied by at least one gas applicator directly to the solder wave.

Abstract: An arrangement for vacuum-tight sealing of electron tubes is provided with a vacuum pipe system which is connected to the electron tube by a tubularly-shaped connecting element. The connecting element is sealed in a vacuum-tight manner by a special thermal seal-off or melt-down unit after the electron tube has been evacuated. The thermal seal-off or melt-down unit is provided with a heating coil which is embraced by a component. The component is provided with an arresting element so that the component can be easily removed from the thermal seal-off or melt-down unit.

Abstract: A method for manufacturing a display device is available that is capable of remarkably improving life characteristics of a display device. A display device placed in a chamber is evacuated to about 10.sup.-7 Torr. Then, reducing gas is introduced into the display device and held therein for several minutes, followed by evacuation of the display device to about 10.sup.-5 Torr. The reducing gas introducing and discharge steps are repeated several times. Thereafter, evacuation of the display device is carried out while keeping the chamber at about 300.degree. C., followed by sealing of the display device.

Abstract: A double-sided connector for connection to an electrical cable is provided. According to the invention, the connector comprises two connector parts with connector contacts which are accessible at the front, a positioning mechanism for receiving and positioning the ends of the cable cores and a connecting component for connecting the connector contacts of at least one of the connector parts to the conductors of the cable cores. The connector parts are provided at the back with pin contacts and socket contacts, respectively, which extend perpendicularly to the backs and can be connected back-to-back through a common housing.

Abstract: The method of forming a seamed metal tube having a metal coating of this invention includes galvanizing the strip prior to welding. The strip is then formed into an open seam tube and welded in an inert atmosphere with the seam located in the lower portion of the tube. Finally, the metal coating is caused to flow downwardly over the seam, coating the seam by several means. In one embodiment, the strip is preformed into an arcuate shape and galvanized, wherein the zinc coating in creases in thickness toward the lateral strip edges, such that the coating will flow over the seam following welding. The tube may also be reheated following welding, preferably in an enclosure containing an inert atmosphere which includes the weld apparatus. In an other embodiment, an inert gas is directed over the inner and outer surfaces of the tube, adjacent the seam, driving the molten metal downwardly over the seam to coat the seam.