Abstract: An improved method of making a high performance x-ray system having cathode cup assembly which reduces tube manufacturing costs and failures due to filament misalignment during the manufacturing process is available.

Abstract: A microelectronic light-emitting device (10) is made with dual lateral thin-film emitters (35 and 40) substantially parallel to a substrate (20). A region containing phosphor (50) extends between the two emitters and contacts them. A fabrication process is specially adapted to produce the light-emitting devices and/or arrays of light-emitting devices. The process allows the use of conductive or insulating base or starting substrates.

Abstract: A method for manufacturing low-cost electroluminescent (EL) lamps is disclosed. The method of the present invention includes the first step of die cutting, embossing or chemically etching a metal foil to form one or more rear capacitive electrodes. Next, the capacitive electrodes are bonded to a paper core stock which is coupled to a precisely positioned indexing system. In the third step, a layer of EL phosphor ink is applied to the capacitive electrodes to precisely form the areas of illumination. In step four, a layer of conductive ITO ink is applied to cover the layer of EL phosphor ink. Next, in step five a transparent polyester film or ultraviolet activated dielectric coating is applied to the entire surface of the lamp. Finally, in step six electrical terminations are provided to the rear capacitive electrode and the layer of conductive ITO ink.

Abstract: A flat panel device is provided with an internal support structure in the form of a spacer. In one fabrication technique, the spacer is formed as a laminate of multiple layers of ceramic, glass-ceramic, ceramic-reinforced glass, devitrified glass, or/and metal coated with electrically insulating material. The spacer is placed between a backplate structure and a faceplate structure which are connected together to form an enclosure that encases the spacer. In another fabrication technique, the spacer constitutes a spacer wall placed between the backplate and faceplate structures. When the backplate structure is connected to the faceplate structure to form an enclosure that encases the spacer wall, the spacer wall follows a corrugated path adjacent to at least one of the faceplate and backplate structures.

Abstract: A casting is produced using a non-sand plastic core. The plastic core is made of a thermoplastic resin and set in a casting mold so as to form a cavity in the casting mold. A molten metal such as aluminum is poured under pressure into the cavity to form the casting (product). The plastic core maintains its initial shape during casting. The remaining heat of the casting or the solidifying metal causes the plastic core to melt after the casting so that the molten plastic core is easily removed.

Abstract: An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.

Abstract: A method for manufacturing a color liquid crystal display device is available where light-blocking layers are provided for the color filter stripes on a pixel-by-pixel basis by inserting the light-blocking layers between stripes of transparent conductive films that are already striped as scanning electrodes. The manufacturing method is characterized by the steps of the formation of a transparent conductive film on a first transparent substrate, patterning of the transparent conductive film by coating the transparent conductive film with a colored, positive resist, exposure and development, coating of patterned transparent conductive films with a blackened, negative resist, formation of black stripes of the negative resist between the patterned transparent conductive films by performing back exposure through the first transparent substrate and development, and the removing the positive resist remaining on the patterned transparent conductive films.

Abstract: A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, and a face on the end of the capillary tip extending away from the hole at multiple angles of increasing magnitude.

Abstract: There is disclosed a single point TAB technology of sequentially bonding a number of inner leads to corresponding electrodes arranged along each edge of a rectangular principal surface of a semiconductor chip, one lead at a time.

Abstract: A method for manufacturing a large basically spherical vessel from plane aluminum plates having a thickness in the range from about 20 mm to about 70 mm, comprises (a) forming at least first and second plane plate assemblies by downhand welding together plane plates controlled by a welding device including an adjustably lockable portal, (b) cutting each welded plane plate assembly to a peripheral shape that fits into the structural pattern of the vessel except for an allowance for machining in step (d), (c) bending each plate assembly to part-spherical configuration, (d) machining respective edges of the first and second bent plate assemblies to a profile suitable for welding in step (e), and (e) downhand welding the first and second plate assemblies together along the machined edges using a manipulator device that includes a tiltable support.

Abstract: A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is available. The apparatus includes a supporting structure, a mechanism for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage, The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.

Abstract: The present invention provides a method for aging a field emission cold cathode, wherein a gate electrode of the field emission cold cathode is not applied directly with the voltage. The gate electrode remains floated electrically. A high voltage is applied to either an anode electrode or a convergence electrode so as to generate a field with a sufficiently large intensity for causing electron emission from a pointed top of a cone-shaped cathode toward the anode electrode or the convergence electrode.

Abstract: A method is available for wave-soldering component groups, especially printed circuit boards with shielding from the environment, in which lead-free or at least low-lead solders, especially tin solders, with a melting point of more than 210.degree. C., are used. Since in wave soldering the solder bath temperature must usually be set considerably higher than the melting point of the solder, problems with overheating the components are encountered with higher-melting lead-free or low-lead solders. This problem is solved in accordance with the invention by setting a solder bath temperature which is only a few degrees Celsius above the melting point of the solder material, and performing the wave-soldering by the action of a plasma of a process gas atmosphere at low pressure.

Abstract: A die is disclosed for applying radial force to an eccentric workpiece. The die includes a set of faces that are each inclined from an orthogonal relationship with a different radial plane of the workpiece by an offset angle. The die also includes wedges that are positioned on the faces. They each have a jaw surface and a slide surface that are inclined from a parallel relationship with each other by a wedge angle that equals the offset angle of their respective face. The wedges can move over the faces to abut the workpiece along each of a plurality of transverse planes. In each of these planes, their movement can accommodate the workpiece's eccentricity in that plane. In addition, each jaw surface abuts the workpiece in a tangential relationship.

Abstract: The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.

Abstract: Platelet assemblies are formed from bondable platelets, such as diffusion-bondable, brazable, or adhesive-bondable platelets, with void regions in the platelets to form channels or open spaces in the finished platelet assembly. To improve the response of the platelet assembly to pressure bonding as well as to post-bonding fabrication processes such as forming, machining and welding, the void regions are filled with a sacrificial material which transmits the load of the applied pressure in the same manner as the remainder of the platelet, and yet which is removable from the finished platelet assembly by either thermal or chemical liquefaction after all potentially damaging fabrication procedures have been performed on the platelet assembly.

Abstract: Repairing an abradable seal includes the step of removing only a portion of the abradable material 38. Various detailed steps have been developed that speed repair time and decrease repair costs over methods removing all abradable material.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C.

Abstract: A selective etching and chemical mechanical planarization process is employed for the formation of self-aligned gate and focus ring structures surrounding an electron emission tip for use in field emission displays. The process is employed to construct an emission grid whereby the gate structure is capable of producing a field strength at the cathode tip sufficient to generate electron emission. The gate is disposed at a location above the tip such that the gate physically intercepts the outermost lateral portions of the beam, yet does not induce a significant electrostatic outward divergence of the beam, thereby reducing the cross-section of the beam.

Abstract: A process and apparatus is available for producing a bonded metal coating. older material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and which acts in the manner of a stamp, towards a bonding surface (24) of a substrate (25). The solder material then is acted upon by energy by means of the energy transfer device (13) for shaping and connection to the bonding surface (24).