Abstract: A method of manufacturing circuit board structure includes forming a sacrificial layer having first openings on a substrate; forming a metal layer on the sacrificial layer; forming a patterned photoresist layer having second openings over the sacrificial layer, in which the second openings are connected to the first openings and expose a portion of the metal layer; forming a first circuit layer filling the second openings and the first openings; forming a first dielectric layer over the sacrificial layer and covering the metal layer, in which the first dielectric layer has third openings exposing the first circuit layer; forming a second circuit layer filling the third openings and covering a portion of the first dielectric layer; removing the substrate to expose the sacrificial layer, a portion of the metal layer and a portion of the first circuit layer; and removing the sacrificial layer and the metal layer.

Abstract: A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.

Abstract: A method of manufacturing a curved electronic device (100) and resulting product. A patterned layer of non-conductive support material (12m) is printed onto a thermoplastic substrate (11) to form a support pattern. An electrical circuit (13,14) is applied onto the support pattern (12), wherein the electrical circuit (13,14) comprises circuit lines (13) comprising a conductive material (13m) applied onto support lines (12b) of the pattern and electrical components (14) applied onto support islands (12a) of the pattern. A thermoforming process (P) is used for deforming (S) the substrate (11) while a relatively high resistance of the support material (12m) to the deforming maintains a structural integrity of the electrical circuit (13,14).

Abstract: In order to provide a mounting structure that has high reliability and easily follows a curved surface, the mounting structure includes a flexible circuit board, a non-flexible component, and a connection portion that is provided in a region smaller than a bottom surface of the non-flexible component and connects the flexible circuit board and the non-flexible component to each other. Further, a protection resin that seals the connection portion in such a way that the flexible circuit board and the non-flexible component are separable from each other outside of the connection portion, is provided. In this configuration, the protection resin covers only a region provided with the connection portion. Thus, the connection portion is mechanically reinforced by the protection resin, and is protected from moisture and dust. Further, on an outside of the connection portion, the flexible circuit board can be bent.

Abstract: A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding portion takes a shape that is a part of an Archimedean spiral. An electronic device, a bonding structure, and a bonding method for the bonding structure are further provided.

Abstract: A method of assembling a hermetically sealed printed circuit board includes: securing a flange of a cap against an electrical contact region on a first side of a substrate, the flange extending across a first end portion of a wall of the cap, the wall extending around the electrical contact region and including a second end portion disposed in an open configuration; and closing the second end portion of the wall to form a hermetically sealed chamber around the electrical contact region.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: This fiber net includes a fiber net having an electrode part, in which a fiber constituting the electrode part includes a core material, a relaxation layer which covers at least a part of a surface of the core material and contains a material having a higher Young's modulus than a material forming the core material, and a conductive layer which covers a surface of the relaxation layer on a side opposite to the core material side.

Abstract: The invention provides a printed circuit board (10) including a first electrically conductive track (210), wherein the printed circuit board (10) comprises a set (15) of two printed circuit board areas (100) both comprising a part of the first electrically conductive track (210), wherein printed circuit board (10) further comprises a perforation line (300) between the two printed circuit board areas (100) for customizing the printed circuit board (10) into two physically separated printed circuit board area comprising parts (1100), wherein the perforation line (300) is configured as a non-straight line, wherein the perforation line (300) comprises relative to one of the printed circuit board areas (100), and in a plane of the printed circuit board (10), a first projecting part (311) and a first recessed part (312), wherein the first recessed part (312) is recessed relative to the first projecting part (311), wherein the first electrically conductive track (210) is intercepted by the perforation line (300) at

Abstract: The disclosure discloses a circuit board, as well as a backlight module and a display device including the circuit board. The circuit board includes a copper exposure region which is covered with a conductive ink. By means of the copper exposure region and the conductive ink thereon, the function of conducting electrostatic charges for the circuit board can be realized at low cost in high efficiency, thereby reducing the risk of subjecting the electrical elements on the circuit board to electrostatic breakdown.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.

Abstract: A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2). 0.0001?(reductant mass/copper oxide mass)?0.10??(1) 0.0050?(dispersing agent mass/copper oxide mass)?0.30??(2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.

Abstract: Through hole filling pastes which include a magnetic powder (A), an epoxy resin (B), and a curing agent (C), in which the magnetic powder (A) is surface-treated with a surface treating agent containing at least one element selected from Si, Al, and Ti, are capable of achieving a cured product excellent in plating adhesion.

Abstract: A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim 1, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.

Abstract: A wiring substrate includes an insulating layer, and a conductor layer formed on the insulating layer and including a mesh-like conductor pattern and conductor pads such that the mesh-like conductor pattern has openings exposing the insulating layer and that the conductor pads are formed at substantially centers of selected ones or all of the openings respectively. The conductor layer is formed such that each of the openings has a polygonal shape, that gaps are formed between the conductor pads and the conductor pattern surrounding the conductor pads, and that each of the conductor pads has a curved outer edge.

Abstract: A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.