Abstract: The present disclosure relates to an electric circuit system. The system includes a housing, a printed circuit board mounted within the housing, an electric component conductively mounted to the printed circuit board, and a cooling system for transferring heat away from of the electric component. The printed circuit board is compartmentalizing the inside of the housing into a first compartment and a second compartment, and the electric component is situated in the first compartment. The cooling system includes at least one first heat transferring element located adjacent to the electric component. The at least one first heat transferring element is secured to the housing surrounding the second compartment capable of forming a heat flowing path defined to transfer heat from the electric component to the housing via the at least one first heat transferring element.

Abstract: In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

Abstract: A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

Abstract: A system includes a printed circuit board (PCB). The PCB includes a radio frequency (RF) circuit that includes a plurality of circuit modules and signal trace lines. Each circuit module is electrically connected to at least one other circuit module by a signal trace line. The system includes a via fence comprising fence walls having at least two materials laminated using a printed wire board (PWB) process. The fence walls include a plurality of vias. The fence walls form a plurality of free-form RF isolation chambers, each chamber includes chamber walls that surround each circuit module outside of the PCB. The embodiments also include a method of manufacturing and/or isolating the system or components of the system.

Abstract: A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

Abstract: A flexible and/or stretchable structural system for transmitting electrical signal between first and second rigid portions comprises a body structure and said first and second portions arranged to said body structure. The modulus of elasticity of said first portion is lower than the corresponding modulus of elasticity of said second portion. In addition the modulus of elasticity of said body structure is lower than the corresponding modulus of elasticity of said second portion. The system comprises also an interface portion, such as e.g. an electrically conducting fabric, textile or knit, which is arranged to said body structure and between said first and second portions. The interface portion electrically connects said first and second portions. The modulus of elasticity of said interface portion is lower than the corresponding modulus of elasticity of said second portion.

Abstract: A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.

Abstract: A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

Abstract: A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.

Abstract: The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Abstract: A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

Abstract: A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

Abstract: A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

Abstract: In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

Abstract: A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component.

Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

Abstract: Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

Abstract: A circuit board device includes a multilayer structure, a main ground area and a circuit module. The multilayer structure includes a plurality of plates. The main ground area is arranged in the multilayer structure. The circuit module includes a differential signal circuit and a surrounding circuit module. The differential signal circuit is located in the multilayer structure, and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a configuration surface of one of the plates. The negative signal pad is located on the disposition surface, and is separated from the positive signal pad. The surrounding circuit module is located on the disposition surface, and electrically connected to the main ground area. The surrounding circuit module surrounds the positive signal pad and the negative signal pad in an enclosing way, and is physically separated from the differential signal circuit.