Abstract: This application discloses a circuit board and a manufacturing method of the circuit board. The circuit board includes a signal transmission pin pad configured to connect with signal transmission pins of an external same kind connectors to transmit a signal, and fixing pads configured to fix fixing pins of the connectors. A number, location, and size of the fixing pads are matched with a same kind connector. The same kind connector is a connector with a same number of signal transmission pins and a same distance of pins. The number of the fixing pads is greater than or equal to a maximum number of fixing pins of the same kind connector.

Abstract: A high-speed transmission circuit design reduces or eliminates the presence of unwanted stub-effects and avoids uncontrolled line impedances that in existing circuits cause impedance mismatches that give rise to unwanted reflections and, ultimately, degrade signal integrity, e.g., in belly-to-belly configurations involving Quad Small Form-Factor Pluggable Double Density (QSFP DD) connectors. In various embodiments, by preventing overcrowding of signal lines, the circuit design further reduces crosstalk and increases signal integrity.

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

Abstract: An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.

Abstract: An electric module with a planar transformer has a housing with an interior having an internal length and an internal height. The electric module additionally has a main printed circuit board with a first thickness, the main printed circuit board being equipped with at least one electronic component. The planar transformer is arranged on an additional printed circuit board with a second thickness, and the main printed circuit board has a recess which receives the additional printed circuit board. Additionally, the main printed circuit board and the additional printed circuit board are connected together via a connection.

Abstract: A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

Abstract: An electronic device according to various embodiments may include: a board; a communication circuit disposed on one face of the board and configured to process a communication signal in a designated frequency band; an antenna disposed on the one face of the board or inside the board; a connector disposed on another face of the board, and including a first contact electrically connected to a first signal path through which the communication circuit is configured to transmit a signal to the antenna in a first direction, and a second contact electrically connected to a second signal path through which the communication circuit configured to transmit a signal to the antenna in a second direction; and conductive pads disposed on the another face of the board spaced apart from the connector, and including at least two first pads corresponding to the first contact and at least two second pads corresponding to the second contact.

Abstract: A touch LED component and a touch device, and the touch LED component includes a metal cap, a touch button sheathed on an inner wall of the metal cap, and an LED lamp bead coupled to an inner wall of the touch button, a first through hole formed at the top of the metal cap, an induction pin installed at the bottom of the touch button, and an anode pin and a cathode pin installed on both sides of the bottom of the LED lamp bead respectively. The touch device includes a touch panel, a circuit board, and plural touch LED components. The touch LED component with high integration can be packaged by carrier tapes to facilitate automatic plug-ins and simplify production and assembling processes for mass production. The touch device has the features of simple structure, high reliability, good effect and long life.

Abstract: The invention provides an IG unit comprising two panes and a between-pane space located between the two panes. A desired surface of a selected one of the two panes bears a coating comprising both a transparent conductive oxide film, and an overcoat film located over the transparent conductive oxide film. The IG unit further comprises a bus bar and a transparent conductor bridge each located over the desired surface. The bus bar is spaced apart from the coating and is connected electrically to the transparent conductive oxide film by virtue of the transparent conductor bridge extending from the bus bar to a top surface of the overcoat film. In some embodiments, the IG unit further comprises a frit located over the desired surface and extending around a perimeter thereof. The bus bar is located over the frit. Certain embodiments provide a refrigerator having a door comprising such an IG unit.

Abstract: An electromagnetic device and a method for manufacturing the same are disclosed. The electromagnetic device includes a base plate, a magnetic core, multiple transmission units, and connection layers. The base plate includes a central part defining multiple inner via holes and a peripheral part defining multiple outer via holes. An annular accommodating groove is defined between the central part and the peripheral part. The magnetic core is received in the annular accommodating groove. Transmission units are located on both sides of the base plate. Each transmission unit includes a transmission wire layer including multiple conductive wire patterns, and each conductive wire pattern bridges one inner via hole and one outer via hole. Each of the connection layers is set on one side of the transmission wire layer close to the base plate. At least one connection layer has a dielectric loss no larger than 0.02.

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

Abstract: There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder.

Abstract: An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.

Abstract: Flexible circuits are described including markings that indicate connections between their flat-wire conductors and specific circuits of a vehicle electrical system. Wire conductors within the flexible circuit share connections with different circuits of the vehicle electrical system. To indicate a connection between a wire conductor and a vehicle circuit, the flexible circuit includes one or more human or machine-readable marks specifically indicating the connection, in some cases, at a position where the connection is to be made. The marks can include etchings or printings on the wire conductors or printings on or otherwise visible from the insulating body that protects the wire conductors.

Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.

Abstract: A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.

Abstract: A circuit board structure for improving isolation is provided. The circuit board structure can increase the isolation by adding a section of floating metal between two signal transmission lines and adjusting the distance between the floating metal and the two signal transmission lines.

Abstract: Provided is a display apparatus including: a display panel including a display area and a peripheral area; a printed circuit board attached to the peripheral area and including a ground portion and a test electrode spaced apart from the ground portion; a connector including a plurality of connector terminals connected to an external control apparatus and electrically connecting the printed circuit board and the external control apparatus to each other; and a cover layer arranged on the printed circuit board and covering at least a part of the printed circuit board. Accordingly, not only the display quality and reliability of the electric characteristics of the display apparatus are improved, but also a loss is reduced and a yield is improved during manufacturing processes.

Abstract: A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.