Patents Examined by Jerry Rahll
  • Systems and methods for wafer-level photonic testing
    Patent number: 11694935
    Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: July 4, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Roy Edward Meade, Anatol Khilo, Forrest Sedgwick, Alexandra Wright
  • Wafer-scale-integrated silicon-photonics-based optical switching system and method of forming
    Patent number: 11693188
    Abstract: A large-scale single-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: July 4, 2023
    Assignee: The Regents of the University of California
    Inventors: Tae Joon Seok, Ming Chiang A Wu
  • Photonic semiconductor device and method of manufacture
    Patent number: 11686908
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Universal cable anchoring for plug connectors
    Patent number: 11681109
    Abstract: One or more cables are axially, laterally, and/or rotationally secured to an anchor member. A plug connector can be assembled to or around the anchor member. The anchor member also can be used to handle the cable prior to assembling the plug connector. A connectorization system for assembling plug connectors includes multiple types/sizes of cables; optionally types/sizes of plug bodies; and the anchor member sized and shaped to connect a selected one of any of the cables with any of the plug bodies of the connectorization system.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: June 20, 2023
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventor: Michael James Ott
  • Optical transceiver
    Patent number: 11675147
    Abstract: An optical transceiver includes a groove-shaped accommodating portion that extends in a longitudinal direction, the housing being configured to be inserted and removed from a cage of an external device. The optical transceiver includes a movable member attached to the housing and a leaf spring member accommodated in the accommodating portion. The spring member includes a first pressing portion pressing a protrusion toward a first surface of the accommodating portion. The spring member includes and a second pressing portion pressing, in the longitudinal direction, a second surface of the accommodating portion. An end of the spring member toward the first pressing portion is configured to curve away from the first surface of the accommodating portion in the longitudinal direction as a distance from first pressing portion increases.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: June 13, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Kuniyuki Ishii
  • Optical assembly and manufacturing method thereof
    Patent number: 11675146
    Abstract: An optical assembly includes a base plate, a light transmitting component arranged on the base plate, a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component, a supporting member, and an auxiliary member. The supporting member includes a bottom surface that bonds to the base plate and a side surface that connects to the auxiliary member. The auxiliary member includes a side surface on which the lens component is disposed and a bonding surface that bonds to the side surface of the supporting member. The lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component. A bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than the top surface of the base plate.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: June 13, 2023
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventor: Long Chen
  • Aligning a collimator assembly with LED arrays
    Patent number: 11668942
    Abstract: Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs and apparatuses formed using the disclosed techniques. According to certain embodiments, a display projector includes a display device and a collimator assembly. The display device includes a backplane including a first plurality of features. The display device further includes a plurality of dies. Each die of the plurality of dies comprises a plurality of light emitting diodes and is bonded to the backplane. The collimator assembly includes a plurality of lenses and a second plurality of features. The collimator assembly is attached to the display device through coupling the first plurality of features with the second plurality of features such that the plurality of dies are aligned with the plurality of lenses.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: June 6, 2023
    Assignee: META PLATFORMS TECHNOLOGIES, LLC
    Inventor: Rajendra D. Pendse
  • Optical filter having a tapered profile
    Patent number: 11668874
    Abstract: Disclosed herein is an optical filter configured for wavelength division and multiplexing capable of transmitting and receiving signals. The optical filter includes an optical waveguide configured to receive at an input multiple signals with different wavelengths. The optical filter includes a plurality of channels coupled at different locations along a length of the optical waveguide. Each of the plurality of channels is configured to transmit a respective one of the multiple signals. A number of ring filter stages in a first channel of the plurality of channels that is closer to the input of the optical waveguide is greater than a second channel in the plurality of channels further away from the input of the optical waveguide.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: June 6, 2023
    Assignee: XILINX, INC.
    Inventors: Zhaoyin Daniel Wu, Chuan Xie, Mayank Raj, Parag Upadhyaya
  • Online helix adjustment to control connector location on preconnectorized tapered assemblies
    Patent number: 11662534
    Abstract: Embodiments of the disclosure relate to a method of preparing a bundled cable. In the method, a plurality of subunits is wound around a central member in one or more layers of subunits to form the bundled cable. For a section of the central member, each layer of subunits has a pitch over which a subunit of the layer of subunits makes one revolution around the section of the central member and a length of the subunit required to make the one revolution. The subunits are configured to have a nominal helical length equal to the ratio of a nominal length to a nominal pitch. Further, in the method, a measurement of the bundled cable is monitored, and a winding rate of the plurality of subunits is adjusted based on the measurement in order to account for deviations from the nominal helical length.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: May 30, 2023
    Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
    Inventors: Mark Edward Conner, Eric Scott Quinby, James Arthur Register, III, Hieu Vinh Tran
  • Hollow core optical fiber and a laser system
    Patent number: 11662518
    Abstract: A hollow core photonic crystal fiber (PCF) including an outer cladding region and seven hollow tubes surrounded by the outer cladding region. Each of the hollow tubes is fused to the outer cladding to form a ring defining an inner cladding region and a hollow core region surrounded by the inner cladding region. The hollow tubes are not touching each other, but are arranged with distance to adjacent hollow tubes. The hollow tubes each have an average outer diameter d2 and an average inner diameter d1, wherein d1/d2 is equal to or larger than about 0.8, such as equal to or larger than about 0.85, such as equal to or larger than about 0.9. Also, a laser system.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: May 30, 2023
    Assignee: NKT PHOTONICS A/S
    Inventors: Jens Kristian Lyngsøe, Christian Jakobsen, Mattia Michieletto
  • Optical multi/demultiplexing circuit
    Patent number: 11656405
    Abstract: Provided is an optical wavelength multi/demultiplexing circuit with a high rectangular transmission loss spectrum that is able to secure loss flatness of a transmission band, maintain/reduce a guard bandwidth of wavelength channel spacing, and broaden a transmission bandwidth. The circuit uses a multimode waveguide for a connecting part between a field modulation device and an AWG. The field modulation device is constituted by a common input waveguide, an optical branching unit, optical delay lines, a multiplex interference unit, and a mode converter/multiplexer.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: May 23, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Manabu Oguma, Osamu Moriwaki, Kenya Suzuki
  • PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components
    Patent number: 11650381
    Abstract: PIC die packages may include a PIC die including: a body having a plurality of layers including a plurality of interconnect layers. A first optical fiber is positioned in a groove and a second optical fiber positioned in another groove in the edge of the body. The first optical fiber is aligned with an optical component in a first layer of the body at a first vertical depth, and the second optical fiber is aligned with another optical component in a second, different layer of the body at a second different vertical depth. A cover is over at least a portion of the body. The cover includes a member having a face defining a first seat therein having a first height to receive a portion of the first optical fiber, and defining a second seat therein having a second, different height to receive a portion of the second optical fiber.
    Type: Grant
    Filed: February 12, 2022
    Date of Patent: May 16, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Nicholas A. Polomoff, Yusheng Bian, Thomas Houghton
  • Expanded photonic bell state generators
    Patent number: 11646803
    Abstract: An expanded Bell state generator can generate a Bell state on four output modes of a set of m output modes, where m is greater than four. Some expanded Bell state generators can receive inputs on any four of a set of 2m input modes. Subsets of the m output modes can be multiplexed to reduce the number of modes to four. According to some embodiments, a set of 2×2 muxes can be used to rearrange the output modes prior to reducing the number of modes.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 9, 2023
    Assignee: Psiquantum, Corp.
    Inventors: Terence Rudolph, Hugo Cable
  • Fiber optic inspection tool with integrated cleaning mechanism
    Patent number: 11644626
    Abstract: Various implementations of fiber optic inspection tools with integrated cleaning mechanisms are disclosed. The fiber optic inspection and cleaning tool includes a housing, a cleaning system and an imaging system. The cleaning system includes a pay-off reel, a take-up reel, a spindle and a cleaning tape that travels off the pay-off reel, around the spindle, and onto the take-up reel. The imaging system includes a camera and a light source. The camera, spindle, and cleaning tape are aligned along a visual axis. The pay-off reel, take-up reel, camera and light source are all located within the housing.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: May 9, 2023
    Assignee: Panduit Corp.
    Inventors: Jose M. Castro, Thomas M. Sedor, Yu Huang, Steven M. Bytnar, Surendra Chitti Babu, Andrew R. Matcha
  • Enhancing imaging by multicore fiber endoscopes
    Patent number: 11640027
    Abstract: Multicore fibers and endoscope configurations are provided, along with corresponding production and usage methods. Various configurations include an adiabatically tapered proximal fiber tip and/or proximal optical elements for improving the interface between the multicore fiber and the sensor, photonic crystal fiber configurations which reduce the attenuation along the fiber, image processing methods and jointed rigid links configurations for the endoscope which reduce attenuation while maintaining required flexibility and optical fidelity. Various configurations include spectral multiplexing approaches, which increase the information content of the radiation delivered through the fibers and endoscope, and configurations which improve image quality, enhance the field of view, provide longitudinal information. Various configurations include fiber-based wave-front sensors.
    Type: Grant
    Filed: July 11, 2021
    Date of Patent: May 2, 2023
    Assignee: ZSQUARE LTD.
    Inventors: Asaf Shahmoon, Zeev Zalevsky
  • Photonics light signal transmission
    Patent number: 11635568
    Abstract: There is set forth herein a photonics device. The photonics device can comprise a substrate, a conductive material formation, a dielectric stack, and a barrier layer. The photonics device can transmit a light signal.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: April 25, 2023
    Assignee: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
    Inventors: Douglas Coolbaugh, Gerald L. Leake, Jr.
  • Package structure
    Patent number: 11630271
    Abstract: A package structure is provided. The package structure includes a waveguide, a passivation layer, and a reflector. The waveguide is over a substrate. The passivation layer is over the substrate and covers the waveguide. The reflector includes a metal layer and a semiconductor layer on the passivation layer. The metal layer and the first semiconductor layer are in contact with the passivation layer.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sung-Hui Huang, Jui-Hsieh Lai, Shang-Yun Hou
  • Active photonic devices incorporating high dielectric constant materials
    Patent number: 11624964
    Abstract: An optical switch structure includes a substrate, a first electrical contact, a first material having a first conductivity type electrically connected to the first electrical contact, a second material having a second conductivity type coupled to the first material, and a second electrical contact electrically connected to the second material. The optical switch structure also includes a waveguide structure disposed between the first electrical contact and the second electrical contact and comprising a waveguide core coupled to the substrate and including a first material characterized by a first index of refraction and a first electro-optic coefficient and a waveguide cladding at least partially surrounding the waveguide core and including a second material characterized by a second index of refraction and a second electro-optic.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: April 11, 2023
    Assignee: Psiquantum, Corp.
    Inventors: Chia-Ming Chang, Hung-Hsi Lin, Gary Gibson
  • Ribbed and grooved cable having embedded strength member with water blocking coating
    Patent number: 11619796
    Abstract: A ribbed and grooved fiber cable (100) includes a core with a plurality of optical fibers, a sheath (102) enveloping the core and one or more strength members (108) embedded in the sheath (102). The strength members (108) are coated with a water blocking coating material having at least one of an ultraviolet (UV) curable water swellable resin composition and a layer of ethylene acrylic acid (EAA). Particularly, the water blocking coating material applied over the strength members (108) has a thickness of 50±10 microns. The sheath (102) of the cable (100) has at least one of a plurality of ribs (104) and grooves (106) on an external surface of the sheath (102), and a plurality of ribs (104a) and grooves (106a) on an internal surface of the sheath (102). The plurality of ribs (104) have variable height.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: April 4, 2023
    Assignee: Sterlite Technologies Limited
    Inventors: Sharun Kuhar, Vikash Shukla, Swapnil Sharma, Kishore Sahoo
  • Fiber optic tapered coupler
    Patent number: 11614587
    Abstract: Fiber optic tapered coupler and methods of manufacturing same. One method of manufacturing a fiber optic tapered coupler arrangement includes providing an output fiber having a first end and a second end opposite the first end. The method also includes applying heat to the first end of the output fiber, wherein the first end expands forming a taper at the first end of the output fiber. The method also includes splicing the tapered first end of the output fiber to a first end of an input fiber, wherein a non-tapered portion of the output fiber has a first diameter and the input fiber has a second diameter different from the first diameter.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: March 28, 2023
    Assignee: MEDICAL INSTRUMENT DEVELOPMENT LABORATORIES, INC.
    Inventor: Devashish R. Kulkarni