Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system; and, a controller configured to receive a signal from the monitoring system and generate a measure of polishing pad wear rate by applying a predictive filter to the signal.

Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

Abstract: A polishing pad including a polishing layer and at least one detection window is provided. The polishing layer includes a polishing surface and a back surface having at least one protrusion. The at least one detection window is disposed at a location corresponding to the at least one protrusion in the polishing layer, and the at least one protrusion surrounds the at least one detection window. A manufacturing method and a polishing method of the polishing pad are also provided.

Abstract: Disclosed are a detection method and a detection apparatus for a polishing pad of a chemical mechanical polishing device, particularly a detection method and a detection apparatus for detecting a surface of a polishing pad dynamically. An isolation region isolated by a gas to expose the polishing pad is formed by the detecting device, and a detection is performed on the isolation region, such that the chemical mechanical polishing device is capable of detecting the polishing pad without interrupting a manufacturing process and the detection results with more accurate can be achieved. Thereby, the polishing pad can be repaired and replaced more timely.

Abstract: A tool sharpener has first and second guide surfaces to respectively support a cutting tool adjacent first and second abrasive surfaces. A drive assembly moves the first and second abrasive surfaces with respect to the first and second guide surfaces. A control circuit directs a user to place the cutting tool against the first abrasive surface using the first guide surface to sharpen a cutting edge of the tool during a first sharpening operation. The control circuit activates an indicator mechanism at a conclusion of the first sharpening operation to direct the user to perform a second sharpening operation in which the user presents the cutting tool against the second abrasive surface using the second guide surface to sharpen the cutting edge.

Abstract: A wafer grinding method includes grinding a central portion of a wafer by using a plurality of abrasive members annularly arranged so as to form a circular ring, thereby forming a circular recess at the central portion of the wafer and simultaneously forming an annular projection around the circular recess, recognizing a height of a grinding unit after grinding the center by using a height recognizing unit and next storing the height recognized above, and grinding an upper surface of the annular projection to a predetermined value for a height of the annular projection previously set by a setting section as a grinding end height where the grinding of the annular projection by the grinding unit is ended.

Abstract: The present disclosure presents a grinding apparatus for sharpening an edge tool. The grinding apparatus may comprise a grinding apparatus casing; a cylindrical grindstone and a support element. The cylindrical grindstone is removably attachable to the grinding apparatus casing. The support element is also removably attachable to the grinding apparatus casing for supporting the edge tool to be sharpened during the grinding operation. The support element includes an elongated member, which may be embodied as a cylindrical support bar. The cylindrical support bar may be configured to extend in a direction which is perpendicular to the rotation axis of the cylindrical grindstone, during operation, in such way that a grinding operation is enabled where the edge tool to be sharpened can be sharpened by means of the side surface facing outwardly from the grinding apparatus casing during the grinding operation.

Abstract: Apparatus and systems are disclosed of a splash guard for a grinder/polisher having a base, a bowl, and a platen having an outer edge to prevent splashing during the grinding/polishing operation. The splash guard includes an inner sidewall, a lower rib, and outer sidewall, and an upper rib. The lower rib has an inner edge that is spaced at least 2.5 centimeters from the outer edge of the platen to prevent pinching of an operator's hands between the platen and the splash guard. The splash guard may also include a recess formed by the upper rib, outer sidewall, and lower rib, and at least a portion of an inner edge of the upper rib is extending further inwardly towards that platen than the inner edge of the lower rib.

Abstract: A wet media blasting system with a water injection system that provides more uniform distribution of the water, air and media components for achieving better application of the mixture while minimizing the amount of water required to contain and minimize or eliminate airborne particulate matter such as dust produced during the blasting operation. By more thoroughly mixing the water into the abrasive/water mix, the amount of water required is reduced. The abrasive feed is placed and shaped to optimize spray coverage and minimize abrasive flow into injection space thus mitigating water nozzle clogs. The abrasive flow is shaped as it is released from the metering valve in order to tighten the abrasive flow before it enters into the blast air stream. The shaped and tightened abrasive flow is maintained at the lower portion of the blast air stream. This positions the abrasive flow in optimum placement for spray wetting the abrasive as it flows into and through the nozzle.

Abstract: A knife sharpener comprises a grinding surface for grinding a blade of the knife when the blade is moved relative to the grinding surface and an observation device including a sensor element and a display element. The sensor element is configured to observe the blade and to collect data regarding the blade when the blade is moved relative to the sensor element. The display element is configured to communicate a condition of the blade to an operator of the observation device. The condition of the blade is based on the data collected by the sensor element when the blade is moved relative to the sensor element.

Abstract: Methods and apparatus for monitoring and controlling relative concentrations of polishing fluid additives and, or, the distribution of a polishing fluid and, or, polishing fluid additives across the surface of a polishing pad during chemical mechanical planarization (CMP) of a substrate are provided herein. In one embodiment, a method for polishing a substrate includes delivering a polishing fluid to one or more locations on a polishing surface of a polishing pad, wherein the polishing fluid comprises an optical marker; detecting optical information at a plurality of locations across a scan region of the polishing surface using an optical sensor facing theretowards; communicating the optical information to a system controller; determining a polishing fluid distribution across the scan region using the optical information; and changing an aspect of the delivery of the polishing fluid based on the polishing fluid distribution.

Abstract: The present invention provides a polishing pad, a polishing apparatus and a polishing method for a silicon wafer. The polishing pad comprises a polishing surface in contact with the silicon wafer. The polishing surface is provided with at least one groove. When polishing the silicon wafer, the edge of the silicon wafer is at least partially suspended above the groove. The polishing pad, polishing apparatus and silicon wafer polishing method according to the present invention can reduce the polishing rate at the edge of the silicon wafer while keeping the polishing rate of the entire wafer basically unchanged, thereby improving the flatness of the edge thickness of the silicon wafer as well as improving the production yield.

Abstract: A multi-functional wheel deburring device is capable of removing burrs at the center hole, the flange weight reducing socket, the spoke back cavity weight reducing socket and the spoke edge of the wheel during the use.

Abstract: The present invention provides an end face polishing device capable of improving a polishing accuracy by polishing an end face of an optical fiber ferrule with adjusted polishing pressure. An end face polishing device 1 for optical fiber ferrule for polishing an end face of an optical fiber ferrule by applying a polishing pressure between a polishing plate 5 driven by a polishing drive shaft and an optical fiber ferrule held by a holding portion 9.

Abstract: The invention provides a method for producing a synthetic quartz glass substrate, the method includes arranging spacers to be in contact with outer peripheral side surfaces of a synthetic quartz glass substrate, arranging plate materials to be in contact with the outer peripheral side surfaces of the spacers in a state that the plates are protruded from the surface of the substrate, and sandblasting the surface of the substrate.

Abstract: An object of the present invention is to provide an abrasive slurry regeneration method capable of efficiently regenerating an abrasive slurry having a high polishing rate. The abrasive slurry regeneration method is an abrasive slurry regeneration method for polishing a polishing target containing silicon oxide as a main component using an abrasive slurry containing abrasive particles and a plurality of kinds of additives and then regenerating a collected abrasive slurry, characterized by including a regeneration step of collecting an additive having a molecular weight of 500 or more and an additive adsorbed by the abrasive particles among additives contained in the collected abrasive slurry together with the abrasive particles while an abrasive concentration (% by mass) is maintained within a range of 0.2 to 3000% with respect to an abrasive concentration (% by mass) of an unused abrasive slurry when being used for polishing a polishing target.

Abstract: A sand source selecting structure for a sandblasting gun has a main body; a channel provided in the main body, for passing pressurized gas; at least two sub-channels provided in the main body respectively connected to the channel; a sandbox mounted on the main body connected to the channel through the first sub-channel; a first control valve installed in the first sub-channel; and a second control valve installed in the second sub-channel. Therefore, the combination of the first control valve with the second valve provides a selecting structure, which can offer different sand supply sources.

Abstract: A method for the manufacture of a component comprises the following steps, in sequence using an additive layer manufacturing process to build a three-dimensional net shape of the component; performing a first abrasive blasting operation on a region of a surface of the component; and performing a second abrasive blasting operation on the region. The angle of incidence of the abrasive on the surface in the first abrasive blasting operation is less than the angle of incidence of the abrasive on the surface in the second abrasive blasting operation.

Abstract: An optical fiber polishing fixture assembly comprises a fixture base and a clamping assembly. The clamping assembly has first and second base portions, a lever, and a biasing member. Each of the first and second base portions has an inner facing side with a slot and an inner facing surface. The slots are adapted to receive bars on opposing sides of a fiber optic connector and cable assembly. The lever has a first end positioned between the inner facing surfaces and a second end extending outward therefrom. The clamping assembly has a locked position, when the first and second base portions are biased toward one another by the biasing member, and an unlocked position, when the lever overcomes a biasing force of the biasing member and separates the first and second base portions.

Abstract: A sharpening device. In one aspect, the sharpening device includes: a sharpening assembly including a sharpening unit and a rod coupled to the sharpening assembly; a retainer assembly; a coupler for coupling the sharpening assembly to the retainer assembly; an attachment device coupled to the retainer assembly for coupling the retainer assembly to a head of a blade to be sharpened.