Abstract: A polishing pad has a disk-shaped substrate and a polishing layer of which an upper surface side is adhered to the substrate. The polishing layer includes a plurality of through-holes which penetrate the polishing pad vertically and which are supplied with a polishing liquid, and a plurality of grooves which are formed on the lower surface side of the polishing pad and which are connected to the through-holes. The plurality of through-holes are formed such as to surround the center of the polishing layer, and the plurality of grooves are formed radially from the plurality of through-holes toward the outer periphery of the polishing layer.

Abstract: A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

Abstract: A wafer processing apparatus includes a chuck table that holds a wafer with metal electrodes embedded therein, a processing unit that grinds or polishes the wafer held by the chuck table, a cassette mounting table for a cassette in which such wafers can be accommodated, a transfer unit that holds and transfers each wafer between the cassette and the chuck table, a checking unit configured to check whether or not at least one of the metal electrodes is exposed on the wafer, a notification unit that notifies that the at least one metal electrode is exposed, and a control unit that controls operations of the processing unit and the transfer unit. If the exposure of the at least one metal electrode on the wafer is detected by the checking unit, the control unit stops the processing of the wafer and the transfer of the wafer.

Abstract: An apparatus for transporting a component at least partially coated with a flowable coating material is provided. The apparatus includes a holder adapted for selectively forming a releasable coupling with the component. The holder including a screen for minimizing contact with the component during the transfer. The screen thus serves as a spacer for creating multiple areas of contact with the component, yet the contact is achieved in a manner such that damage to the coating is minimized. Related methods are also disclosed.

Abstract: A method and apparatus for processing a metallic workpiece with defined edges (e.g., a gear) comprises media blasting of the workpiece by directing a first media against exposed surfaces on the workpiece to increase the root strength of the gear, the blasting causing the defined edges to be radiused or mushroomed, ceasing the media blasting, loading the workpiece into a finishing apparatus, and subjecting the workpiece to a finishing process with a second media, the exposed surfaces on the workpiece being subjected to the finishing process to reduce the radiused edges on the workpiece created from the media blasting. The process of moving the workpiece to the spindle-finishing apparatus from the media blasting may be performed automatically by a machine. Once the workpiece has been subjected to the finishing process with the second media, it may be removed from the spindle-finishing machine, washed, and rinsed with rust inhibitor whereby wear properties of the workpiece are enhanced.

Abstract: A grinding wheel includes a support body which has a circumferential surface and a central coupling region for attaching the grinding wheel to a rotary drive for rotating the grinding wheel about a rotational axis running through the central coupling region. The grinding wheel also includes a grinding layer which is applied onto the circumferential surface of the support body. The support body includes a first part and a second part connected to the first part. The first part has the circumferential surface, and the second part has the coupling region and consists essentially of a vibration-damping material.

Abstract: A tile saw gauge has a receiver, an extension arm, and a slidable gauge. In one embodiment, the slidable gauge has one or more protrusions for fixing various lengths. The receiver may be permanently attached to a tile saw, such as by welding, or may removably attachable, such as by using screws, a bolt and nut, or similar mechanism. The tile saw gauge may be retrofitted on saws in the art, allowing tile saws in the market to make consistent cuts on larger tiles or tile lengths.

Abstract: To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

Abstract: A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

Abstract: A torque limiter can include a housing and a shaft. The housing can include a housing magnet enclosed within the housing. The shaft can be at least partially surrounded by the housing and can be rotatable within the housing. The shaft can include a shaft magnet integrated with the shaft to magnetically couple with the housing magnet to transmit a torque between the housing and the shaft and configured to uncouple from the housing magnet allowing the shaft to rotate within the housing when a threshold torque is reached.

Abstract: A machine (10) for machining workpieces with optical quality has at least one workpiece spindle (12), which rotatably drives a workpiece (L) to be machines about a workpiece axis of rotation (C). A swivel head (14) located opposite the workpiece spindle, is pivotable about a pivot axis (B), and bears at least two tool spindles (16, 18), each of which rotatably driving at least one machining tool (T1, T2, T3) about a tool axis of rotation (D, D?). The workpiece spindle and the swivel head (14) are adjustable relative to one another along three mutually perpendicular linear axes (X, Y, Z). One axis (Y) extends parallel to the pivot axis (B). Another axis (Z) extends parallel to the axis (C) of workpiece rotation. At least one tool spindle is attached to the swivel head with its tool axis of rotation (D?) extending parallel to the pivot axis (B).

Abstract: A grinding method includes a step of imaging a bonded workpiece by a camera in such a manner as to include the outer circumference of a workpiece and the outer circumference of a support component with a larger diameter than that of the workpiece before a step of holding the support component of the bonded workpiece by a holding surface. The grinding method also includes a step of recognizing the outer circumference of the support component and the outer circumference of the workpiece on the basis of the brightness difference between pixels adjacent to each other in a taken image and a step of recognizing the center of the support component from the recognized outer circumference of the support component and recognizing the center of the workpiece from the recognized outer circumference of the workpiece.

Abstract: A method of processing a rotatable assembly is described herein. The method includes mounting a grinding wheel on an arbor to form the rotatable assembly. The grinding wheel has a ring-structure formed from a plurality of grit particles dispersed within a metallic material. The method also includes mounting the rotatable assembly within at least one dressing machine, wherein the rotatable assembly is rotatable relative to a dressing tool within the at least one dressing machine, and shaping the grinding wheel with the dressing tool to define a final outer profile of the grinding wheel configured to machine a workpiece.

Abstract: A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

Abstract: A multi-station wheel deburring device is disclosed, which consists of a lower lifting translation system, a first brush system, a second brush system, a synchronous clamping drive system and a third brush system, etc. The multi-station wheel deburring device can be used for removing burrs from the root of a wheel flange, a center hole, bolt holes and a back cavity, can automatically adjust the position of each brush according to the dimension and shape of a wheel, and at the same time, has the characteristics of high automation, high removal efficiency, advanced technology, strong universality and high safety and stability.

Abstract: An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

Abstract: A sharpening device, components thereof, and associated methods. The sharpening device includes a sharpening assembly and a housing. The sharpening assembly is selectively receivable in the housing in a stowed configuration and supportable by the housing in an operational configuration to support the sharpening assembly for sharpening a blade. The sharpening assembly can include first and second arms having respective abrasive sharpening surfaces pivotable away from each other about a pivot connection.

Abstract: A retaining ring used in the polishing of semiconductor substrates is described herein. A retaining ring includes a bottom surface configured to contact a polishing pad and a top surface configured to attach to a carrier head. The top surface includes a plurality of screw holes and a plurality of alignment slots. The top surface also includes a first insert disposed in a first alignment slot of the plurality of alignment slots, the first insert flush with or below the top surface, and where the first insert configured to prevent insertion of an alignment pin into the first alignment slot.