Abstract: A modular apparatus (10) for machining flat sheets, in particular glass, plate glass, or mirror sheets or sheets made from stone materials or the like, comprising machining moduli consisting of a first store (16) suitable for receiving sheets to be machined (25) and a second store (18) suitable for receiving machined sheets (27), a first grinding machine (12), and a second grinding machine (14) suitable for performing grinding machinings along the peripheral edges of said sheets (25), one or more further moduli for machining said flat sheets, if any, of the corner cutting, drill, or washing machine types, possibly associated with said first and second grinding machines (12, 14), and interface means for transferring said flat sheets between said machining moduli.

Abstract: A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more inorganic binders and fillers. The composition is formed into a rigid plate blank, and the abrasive plate is mounted on a substrate forming a lapping/polishing plate. The abrasive plate is capable of delivering high material removal rates coupled with reduced surface roughness when lapping/polishing advanced materials, including sapphire, titanium carbide reinforced alumina, silicon carbide, gallium nitride, aluminum nitride, zinc selenide, and other compound semiconductor materials, as well as, glass, ceramic, metallic, and composite workpieces. The diamond beads incorporated in the fixed abrasive three-dimensional plate include diamond particles ranging in size from a few nanometers to a few tens of microns, bonded with one or more inorganic binders and additives.

Abstract: An automatic machine and an automatic method for grinding the edges of glass sheets are disclosed. The machine is provided with a machine body with motorized support and conveyance rollers or belts, an input conveyor with motorized support and conveyance rollers or belts, an output conveyor with motorized support and conveyance rollers and belts. There are at least two elements for conveying the glass sheets, a lower one and an upper one, which actuate respectively the synchronous motions about a lower axis and an upper axis, which engage and convey the glass sheets, which are interfaced alternately, for example the odd sheets with the lower conveyance elements and the even sheets with the upper conveyance.

Abstract: Method for the grinding of a gear wheel workpiece using a dressable worm grinding wheel, wherein the worm grinding wheel is rotationally driven about a tool axis of rotation and the gear wheel workpiece is rotationally driven about a workpiece axis of rotation, and relative movements are executed between the worm grinding wheel and gear wheel workpiece, and wherein after the execution of a dressing procedure of the worm grinding wheel, which is carried out by means of a rotationally-drivable dressing unit, the following steps are carried out: executing a relative shift movement between the worm grinding wheel and gear wheel workpiece parallel to the tool axis of rotation, executing an axially-parallel relative movement between the worm grinding wheel and gear wheel workpiece in parallel or diagonally to the workpiece axis of rotation, wherein a ratio between the shift movement and axially-parallel relative movement is specified, which is variable.

Abstract: An apparatus for blasting having a distribution block for receiving a blasting medium, a pressure medium and/or a fluid/liquid medium, said distribution block having an outlet connectable with at least one distributing tube.

Abstract: A wet media blasting system with a water injection system that provides more uniform distribution of the water, air and media components for achieving better application of the mixture while minimizing the amount of water required to contain and minimize or eliminate airborne particulate matter such as dust produced during the blasting operation. By more thoroughly mixing the water into the abrasive/water mix, the amount of water required is reduced. The abrasive feed is placed and shaped to optimize spray coverage and minimize abrasive flow into injection space thus mitigating water nozzle clogs. The abrasive flow is shaped as it is released from the metering valve in order to tighten the abrasive flow before it enters into the blast air stream. The shaped and tightened abrasive flow is maintained at the lower portion of the blast air stream. This positions the abrasive flow in optimum placement for spray wetting the abrasive as it flows into and through the nozzle.

Abstract: A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

Abstract: The present utility model provides a cutter sharpener including a housing, a height adjusting mechanism and a cutter clamping mechanism mounted on the housing, and a grinding mechanism rotatably connected to the height adjusting mechanism. The housing includes a first mounting location, the height adjusting mechanism is movably connected to the first mounting location, the height adjusting mechanism includes a lifting body, and the lifting body can move up and down relative to the first mounting location. The cutter sharpener further includes a degree indicating mechanism fixedly connected to the lifting body.

Abstract: A grinding apparatus including a robot, a grinding tool attached to the robot, a force sensor configured to detect a force exerted on the grinding tool, and a controller connected with the force sensor and configured to control the robot. The controller includes a variation acquiring section configured to acquire the present position of the robot by pressing the grinding tool against a reference surface in such a manner that a pressing force detected by the force sensor is constant, and to acquire a difference between the acquired present position and a reference position of the robot stored in advance, the difference being acquired as a variation of the grinding tool.

Abstract: A CMP tool for polishing a semiconductor wafer is disclosed. The CMP tool includes a polishing head with a wafer carrier unit on which a wafer is mounted for polishing. The wafer carrier unit includes a support plate with a seal disposed on its sidewall. The seal improves sealing of the flexible membrane to the support plate. This improves reliability by avoiding slippage during the dechucking stage as well as wafer slippage during wafer loading stage, thereby avoiding wafer damage as well as non-uniform polishing.

Abstract: Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductor devices. The polishing pad may secure excellent polishing rate and within-wafer non-uniformity by controlling the physical properties such as initial load resistivity and compressive elasticity of the cushion layer and/or the laminate as defined by Equations 1 and 2: L ? R L ? ( % ) = T ? 1 ? L - T ? 2 ? L T ? 1 ? L - T ? 3 ? L × 100 [ Equation ? ? 1 ] C ? E L ? ( % ) = T ? 4 ? L - T ? 3 ? L T ? 2 ? L - T ? 3 ? L × 1 ? 00.

Abstract: An SiC ingot forming method includes: a holding step of holding by a chuck table a cut section of a primitive SiC ingot cut from an SiC ingot growth base; a planarization step of grinding an end surface of the primitive SiC ingot held by the chuck table, to planarize the end surface; a c-plane detection step of detecting a c-plane of the primitive SiC ingot from the planarized end surface; a first end surface forming step of grinding the planarized end surface, to form a first end surface inclined at an off angle relative to the c-plane; and a second end surface forming step of holding the first end surface by the chuck table and grinding the cut section of the primitive SiC ingot in parallel to the first end surface, to form a second end surface.

Abstract: Processe and system for preparing a vehicle surface (e.g., an aircraft fuselage) for painting include a preparation booth (100) which is sized and configured to house the vehicle (F). At least one robotic assembly (200a, 200b) is reciprocally movable within the preparation booth (100) relative to a longitudinal axis of the vehicle (F), and is provided with a robotic hand (230) having at least one abrasive disc (242a) attached to an attachment pad (242) of the robotic hand (230), and at least one nozzle (252a, 252b, 252c) for discharging a stream of rinse fluid. Operation of the at least one robotic assembly (230) will cause the at least one abrasive disc (242a) of the robot hand (230) to abrade the surface of the vehicle (F). The robotic hand (230) may thereafter be maneuvered so that the at least one nozzle (252a, 252b, 252c) is directed toward the abraded vehicle surface (F).

Abstract: Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.

Abstract: A floor polishing machine for concrete includes a frame with an integrated hydraulic fluid tank, a hydraulic drive system, and a hydraulic pump vacuum system. Further, the machine provides a swivel polishing head that provides abutting contact with a floor and includes a floating ring and rubber skirts that seals the polishing head. The machine provides interchangeable wet and dry vacuum systems for collection of the slurry during wet operation and dust during dry operation. A support member inserts into a receiving sleeve for a choice of wet or dry option. A squeegee system attached to the rear of the apparatus collects slurry and operates to send the slurry to a collection tank. The squeegee lifts out of the way during dry operation.

Abstract: A polishing pad useful in chemical mechanical polishing comprises a base, and a plurality of structures protruding from the base wherein a portion of the plurality of structures are defined by a cross section having a perimeter which defines an area. The perimeter can be defined by parametric equations and can have six or more inflection points or the cross-section can comprise three or more lobes. The cross-section has a Delta parameter in the range of 0.2 to 0.75.

Abstract: A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

Abstract: A novel polishing apparatus which determines a polishing end point of a substrate on the basis of a strain of a constituent element of the polishing apparatus caused by friction between a substrate such as a wafer and a polishing pad. The polishing apparatus includes a rotatable polishing table which supports a polishing pad, a polishing head which presses the substrate against the polishing pad, a rotating shaft connected to the polishing head, a support structure which rotatably supports the rotating shaft, a strain measuring instrument which measures a strain of the support structure, and an end point detector which determines a polishing end point of the substrate on the basis of a change in the strain. The strain measuring instrument includes at least one strain sensor fixed to the support structure.

Abstract: Provided is a glass film manufacturing method in which manufacture-related processing is performed on a glass film while the glass film (G) is conveyed, the glass film manufacturing method comprising the step of conveying the glass film (G) on a suction roller (46), wherein the suction roller (46a) is configured to suck only a center portion of the glass film in a width direction of the glass film (G).

Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.