Abstract: Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

Abstract: [Problem] To provide a composition, which is a reverse pattern formation composition comprising an aqueous solvent having little influence on a resist pattern, and which is excellent in flatness and filling properties after coating and has excellent etching resistance. Furthermore, a method for forming a pattern using the same is provided. [Means for Solution] A reverse pattern formation composition comprising a polysiloxane compound comprising a repeating unit having a nitrogen-containing group and a solvent comprising water, and a method for forming a fine pattern using the same.

Abstract: A salt represented by the formula (I). wherein Z+, Q1, Q2, R1, R2, R3, R4, R5, Z, X1, X2, Xa, Xb, L1, L2, L3 and L4 are defined in the specification.

Abstract: An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.

Abstract: A photolithiographic method for fabricating bank structures with improved non-wetting properties to form well regions on a substrate using a photoresist composition comprising a cresol novolak resin, a photoactive diazonaphthoquinone sulfonic ester of a polyhydroxybenzophenone compound with at least one free hydroxyl group, and a non-ionic urethane polyglycol fluorosurfactant. Inkjet methods can be used to deposit active materials into the well areas. Color filter arrays and optoelectronic devices such as OLED devices can be made by this method.

Abstract: A resist composition comprising a base polymer and a sulfonium or iodonium salt of sulfonic acid containing a morpholino group offers dimensional stability on PPD and a satisfactory resolution.

Abstract: A resist composition comprising a base polymer and a sulfonium or iodonium salt capable of generating fluorobenzenesulfonic acid bonded to iodized benzoic acid offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.

Abstract: A resist composition comprising a base polymer and a sulfonium or iodonium salt capable of generating sulfonic acid bonded to iodized benzene ring offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.

Abstract: A resist composition including a polymeric compound having a structural unit derived from a compound represented by general formula (a0-1), an onium salt having an anion moiety with a specific structure, and a photodecomposable base which is decomposed upon exposure and then loses the ability of controlling of acid diffusion. In formula (a0-1), Rax0 represents a polymerizable group-containing group; Wax0 represents an aromatic hydrocarbon group having a valency of (nax0+1), provided that Rax0 and Wax0 may together form a condensed ring structure; nax0 represents an integer of 1 to 3; Yax01 represents a carbonyl group or a single bond; Rax01 represents a hydrogen atom or a hydrocarbon group which may have a substituent.

Abstract: [Object] To provide a composition capable of forming a cured film having low permittivity and excellence in chemical resistance, in heat resistance and in resolution; and further to provide a production process employing the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit; a polysiloxane; a diazonaphthoquinone derivative; a compound generating acid or base when exposed to heat or light; and a solvent.

Abstract: A resist composition comprising a base polymer and a quencher in the form of an iodonium salt capable of generating fluorobenzoic acid bonded to iodized benzene offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.

Abstract: Various vinyl addition polymers of nadic anhydride are disclosed. Examples of such polymers include copolymers and terpolymers of nadic anhydride with a wide variety of norbornene-type monomers. The nadic anhydride polymers are found to be useful in forming a wide variety of photosensitive compositions, both positive and negative, which are capable of forming high resolution imagable films exhibiting excellent dielectric properties (low-k) and thermal properties, and thus are useful in the fabrication of a variety of microelectronic and optoelectronic devices, among others.

Abstract: The present application relates to a negative type photosensitive resin composition including a compound of Chemical Formula 1, an alkali soluble resin binder, a polyfunctional monomer, a colorant, a photoinitiator, and a solvent, and a display apparatus including a black bank formed by using the same.

Abstract: A resist composition which contains a resin (A1) which has a structural unit represented by formula (I), a structural unit represented by formula (II) and a structural unit having an acid-labile group, and an acid generator: wherein R1 and R2 independently represent a hydrogen atom, a halogen atom or a C1-6 alkyl group that may have a halogen atom, Ra25 represents a carboxy group, a cyano group or a C1-4 aliphatic hydrocarbon group, A1 represents a single bond, *-A2-O—, *-A2-CO—O—, etc., A2 and A3 independently represents a C1-6 alkanediyl group, and w1 represents an integer of 0 to 8, L1 represents a single bond or *-L2-CO—O-(L3-CO—O)g—, L2 and L3 independently represent a C1-12 divalent hydrocarbon group, g represent 0 or 1, R3 represents a C1-12 liner or branched alkyl group except for a tertiary alkyl group and * represents a binding position to an oxygen atom.

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a resin (B) having a group that decomposes by the action of an alkali developer to increase the solubility in the alkali developer and having at least one of a fluorine atom or a silicon atom, and a resin (C) having a phenolic hydroxyl group, different from the resin (B), an actinic ray-sensitive or radiation-sensitive film and a mask blank, each formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: A chemically amplified positive resist composition is provided comprising a specific alkali-soluble polymer adapted to turn soluble in alkaline aqueous solution under the action of acid as base resin, an alkali-soluble polymer, and a photoacid generator in an organic solvent. The composition forms a resist film which can be briefly developed to form a pattern at a high sensitivity without generating dimples in pattern sidewalls.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution by the action of acid, which includes a polymeric compound having at least two specific structural units.

Abstract: A resist composition which generates an acid through exposure and whose solubility in a developer changes by the action of an acid. The resist composition contains a polymer compound having at least two kinds of specific constituent units. A resist pattern forming method, including forming a resist film on a support using the resist composition, subjecting the resist film to exposure, and forming a resist pattern through patterning by developing the resist film having undergone exposure by using a developer.

Abstract: A patterning process, comprises: (i) forming a radiation-sensitive film on a substrate, wherein the radiation-sensitive film comprises: (a) a resin, (b) a photoacid generator, (c) a first quencher, and (d) a second quencher; (ii) patternwise exposing the radiation-sensitive film to activating radiation; and (iii) contacting the radiation-sensitive film with an alkaline developing solution to form a resist pattern; wherein the resin comprises the following repeat units: wherein: R1 is selected from a hydrogen atom, an alkyl group having from 1 to 4 carbon atoms, a cyano group or a trifluoromethyl group; Z is a non-hydrogen substituent that provides an acid-labile moiety; n is from 40 to 90 mol %; m is from 10 to 60 mol %; and the total combined content of the two repeat units in the resin is 80 mol % or more based on all repeat units of the resin; and the first quencher is selected from benzotriazole or a derivative thereof.