Abstract: A can is closed with a membrane by heat-sealing, using a packaging apparatus with an inner, heat-sealing die and an outer sealing ring displaceably located around the heat-sealing die, wherein an outer surface of the heat-sealing die and an inner surface of the sealing ring are beveled slightly, preferably by approximately two degrees, in mating fashion.

Abstract: In a method of making rolls or strips of material having no flaws except joints a supply of material, such as a roll of fabric is inspected for flaws. If any flaws are discovered portions of the material containing the flaws are cut away. The material is attached together after each portion is removed to create a joint for each reattachment. The portions that are cut away are sized so that the joints will be separated by a multiple of a selected distance from one another. The resulting material can then be fabricated into a panel of window covering material in which all the joints are co-linear along a perpendicular to the surface of the material. The joints are positioned so that they will be on a cut line for subsequent processing. In one embodiment the material is wound into a tubular structure that is cut along the joints to form a panel of window covering material.

Abstract: In order to manufacture compound composite bodies having at least two lay with a support material made completely or substantially from a polymer and with a porous layer firmly connected thereto, a substantially microwave-permeable polymer is utilized for the support material and a polymer having microwave absorbing properties is utilized for the porous layer. The polymer for the porous layer, treated with foaming agent, is heated with microwave energy up to the decomposition temperature of the foaming agent. The resulting polymer foam is sufficiently heated using microwave energy that the support material, at its bordering layer adjacent the foamed polymer, is sufficiently melted substantially due to heat conduction out of the foamed layer that, subsequent to cooling, a firm composite between the support material and the foamed polymer is effected.

Abstract: Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate,formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructurebring the said selected region (16) into contact with the final substrate,treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force,breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).

Abstract: Disclosed is an adhesion apparatus for modifying a surface of a substrate with an adhesion promoter so as to improve the adhesive force of a solution coated on the substrate surface in a photolithography process, comprising a support for holding the substrate, the support having a first contact face, a vacuum suction port formed in the support in a manner to surround the substrate held on the support, a lid having a second contact face which can be brought into contact with the first contact face, a processing space being formed between the table and the lid when the second contact face of the lid is brought contact with the first contact face of the support, unit for supplying an adhesion promoter into the processing space, a first annular sealing member positioned intermediate between the first and second contact faces and outside the vacuum suction port so as to surround the processing space, and a second annular sealing member positioned intermediate between the first and second contact faces and inside t

Abstract: A method of making a glass panel assembly for a motor vehicle includes a glass panel and a membrane mounted to one side of the glass panel. The glass panel mounting assembly also includes an adhesive disposed between the membrane and the glass panel, whereby the membrane is severed to allow the adhesive to secure the glass panel directly to vehicle structure.

Abstract: A method of producing an optical disc of bonded type includes the processes of: (A) forming a first reflection film, which is half transparent for partially reflecting and partially transmitting an incident light, on a first information record surface of a first transparent substrate; (B) forming a second reflection film, which has a reflective index higher than that of the first reflection film, on a second information record surface of a second transparent substrate; (C) dripping a liquid resin of ultraviolet hardening type onto one of the first and second reflection films by a spin coating method to form a first resin layer in a non-hardened condition; (D) dripping a liquid resin of ultraviolet hardening type onto the other of the first and second reflection films by a spin coating method; (E) emitting ultraviolet onto the liquid resin dripped by the process (D) to form a second resin layer of ultraviolet hardening type in a hardened condition; (F) provisionally bonding the first and second transparent sub

Abstract: A temperature compensated optical isolator and a method of manufacturing optical assemblies. The isolator utilizes a bimetallic element to rotate a polarization element of the isolator in response to temperature variations. The isolator maintains an effectively constant isolation over a substantially wide temperature range. Advantageously, the isolator is simple, compact and a viable solution to a wide range of optical applications. The manufacturing method employs a lamination procedure to create an array of optics-receiving micro-fixtures. The method is well adapted for the automated manufacturing of optical assemblies. Desirably, the method provides for high speed, high volume production, thereby advantageously, maintaining low manufacturing costs.

Abstract: A method for making mineral insulated cables in which a mineral powder is purified to remove magnetic particles. The purified mineral powder and at least one wire are fed into a seam-welded metal sheath as it is being formed to produce the mineral insulated cable. The mineral insulated cable may then be drawn and annealed to reduce the diameter of the cable to the desired size.

Abstract: A method of coating a fuser member with a polymeric sheet is disclosed. Initially, the fuser member is placed in a substantially perpendicular position with respect to the polymeric sheet. The polymeric sheet is then wrapped around the fuser member such that the sheet first comes into contact with an end of the fuser member and is wrapped along the length of the fuser member from one end to the other to form a continuous layer over the fuser member. Last, the wrapped polymeric sheet is sintered to the fuser member to form a seamless coated polymer layer.

Abstract: An electric wire-connecting portion (11) is formed by connecting together conductive ends of a plurality of electric wires (W). One end of a heat shrinkable tube (12) is sealed with hot melt adhesive (15). The heat shrinkable tube (12) is attached onto the electric wire-connecting portion (11). A tube holding tool (13) for protecting the one end of the heat shrinkable tube (12) against heat is attached to the one end of the heat shrinkable tube (12). The heat shrinkable tube (12) is heated to shrink thereby sealing the electric wire-connecting portion (11). The tube holding tool (13) includes a holding portion (13a) for holding the one end of the heat shrinkable tube (12), and a shaft portion (13b) integrally formed with the holding portion (13a).

Abstract: A method for forming coatings of constant thickness on sheets of dielectric substrate (10), which may be curved, includes the step of adhesively applying foil (12) to one side of the dielectric substrate. An electrode (16) is set at a constant distance (D) from the side (10fs) of the substrate to be coated. If the substrate is curved, the electrode is preferably also curved. The region to be coated is evacuated, gaseous precursor materials are infused into the gap, and voltage is applied between the foil (12) and the electrode (16) sufficient to ionize the precursors to a plasma state, whereupon the deposition occurs. The foil may be applied as an adhesive-backed foil. The adhesive may be electrically conductive.

Abstract: The invention provides a mounting method for a semiconductor chip, wherein after disposing the anisotropic conductive adhesive on a circuit board, the circuit board is preheated to a temperature lower than the hardening temperature of the anisotropic conductive adhesive, the semiconductor chip is disposed on the circuit board thereafter, and the anisotropic conductive adhesive is hardened by thermally press-bonding the semiconductor chip onto the circuit board by applying pressure as well as heat so that generation of air bubbles is minimized ensuring good adhesion therebetween. It is also possible to prevent occurrence of thermal strain by heating simultaneously the under surface of the circuit board at a temperature lower than a heating temperature for the semiconductor chip.