Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

Abstract: Substrates to be paired are alternately aligned. One substrate of a pair of substrates adjacent to each other is turned over thereby to face the other substrate, and the substrates held in a state facing each other are sent to a bonding position. An adhesive is supplied annularly into an interval of the substrates, and the substrates are rotated in a planar direction to thereby narrow the interval and eventually spread the adhesive in a radial direction to form an adhesive layer. The lower substrate is supported from below and carried from the bonding position to a setting position, and the adhesive layer is set, whereby an optical disk is obtained. The optical disk is taken out from the setting position.

Abstract: A disk bonding system or method comprises a first element for forming an annular adhesive layer on an upwardly facing joint surface of a lower side disk, and a second element for forming a dotted adhesive layer on a downwardly facing joint surface of an upper side disk. Then, a third element sets the upper and lower side disks in a confronting state, and reduces the spacing between the upper and lower side disks until the annular adhesive layer and the dotted adhesive layer are sandwiched between the upper and lower side disks. During this, the annular adhesive layer and the dotted adhesive layer are brought into contact with each other, and the contact region expands in a manner to prevent occurrence of bubbles.

Abstract: A method for the production of a sunroof includes a step for applying adhesive into an edge section and a molding groove along the edge section of glass disposed accurately on a lower mold. A foaming material is applied in the molding groove at a peripheral portion of the glass outside the applied adhesive. The adhesive and the foaming material applied on the glass are molded by connecting the lower mold to an upper mold with a frame, and then heated a step of heating in a state in which the molds are pressed in a vertical direction. The lower and upper molds are detached, and a sunroof is discharged as a finished product.

Abstract: A method is provided for attaching electronic components (12) onto a substrate (10) which allows quick, easy and inexpensive subsequent removal and re-attaching of the electronic component (12) to obtain an undamaged printed wiring board package. The method for attaching the electronic component (12) onto the substrate (10) includes bonding a component interlayer (18) onto the electronic component (12) with a component bonding layer (16), and forming an adhesive bond (14) between the component interlayer (18) and the substrate (10). If the removal of the electronic component (12) is needed, the electronic component (12) is removed from the substrate (10) by heating the component interlayer (18), thus melting the component bonding layer (16). If the re-attachment of the electronic component (12) is needed, the method for attaching the electronic component (12) onto the substrate (10) is repeated, using a new component interlayer (18).

Abstract: A magnetic head chip bonding device for bonding plural magnetic head chip to a base member to produce a composite type magnetic head is disclosed. The device includes a magnetic head chip retention unit for applying the pressure to the magnetic head chip for applying the magnetic head chip against the base member, and a magnetic head chip holding unit for holding the magnetic head chip. The device also includes a magnetic head chip detection unit for detecting the position of the magnetic head chip and a magnetic head chip shifting unit for shifting the magnetic head chip and the magnetic head chip holding unit responsive to an output of the magnetic head chip position detection unit. The pressure exerted by the magnetic head chip retention unit on the magnetic head chip is preferably variable, and the magnetic head chip holding unit preferably is made up of a pair of supporting members clamping the magnetic head chip in- between.

Abstract: A method for making an improved radar absorbing structure which includes forming a stack of layers of elastomeric sheet material, at least one of which supports conductive material, with a layer of dielectric material, shaping the stack, and curing the shaped stack. The stack of layers has a thickness of no more than 0.1″, and may be wrapped about a mandrel or fitted to another forming body to impart a final, complex, shape to the stack, and then cured.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: Two electroluminescent substrates, each emitting light having different color, are laminated and bonded together with adhesive layer interposed therebetween. An insulation film such as an epoxy film is placed between two substrates and deformed into an adhesive layer under pressure and heat. The adhesive layer serves as a bonding material and a humidity-protection layer as well. Electrical connection between electrodes of the electroluminescent substrates and outside driving circuits is made at the same time two substrates are bonded by the adhesive layer by bonding wiring sheets together. To further improve the humidity-protection ability of the adhesive layer, the surface of the electroluminescent substrates may be covered by resin which is hardened by radiating ultraviolet light at the same time the insulation film is deformed into the adhesive layer. Thus, the electroluminescent display panel having two substrates can be manufactured in a simple and inexpensive manufacturing process.

Abstract: The present invention provides a tire monitor retainer assembly and monitored vehicle tire. A module which monitors tire information is supported by a rubber ply affixed to the inside surface of the tire. The module has electrical components for monitoring tire information by collecting, storing and/or reading information about the tire. A fastener assembly is used to secure the module to the rubber ply such that the module is support within the tire's cavity. The module is mounted to be isolated from tire loads such that the durability of the monitoring system is improved. The fastener assembly has first parts carried by the rubber ply and second fastener parts built into the module. The first and second fastener parts cooperate to support said module from said rubber ply. The module is made with a retainer opening having edges to receive a fastener device having standoff or indexing elements.

Abstract: Disclosed is a new desiccant composition containing calcium chloride and a modified starch, preferably a modified corn starch. The composition contains from about 5 to about 95 percent calcium chloride and from about 5 to about 95 percent starch.

Abstract: Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those locations where the surfaces of the leads will interface with the enclosure material, molding the package around the leads, and curing the adhesive during the molding process or during a post-cure. The adhesive is formulated to form a gas-tight seal around the leads and to maintain the seal during the thermal cycling that the components are exposed to during the typical procedures involved in manufacturing the packages and in making the electrical connections to other circuitry, as well as the typical environmental changes that the finished and installed product is exposed to during use.

Abstract: One-side ends of fine metal wires are bonded onto pads of a semiconductor chip via wire bonding and the other ends of the fine metal wires are mounted on the board by flip chip.

Abstract: A method of flocking a surface, and treating the flocking, achieves a decorative effect when applied to toys where the invention may be used to simulate different types of human and animal hair and fur. After applying an adhesive to a surface to be flocked, a group of flocking particles are directed onto the surface, and the result is modified using alternative techniques to achieve the desired effect. In one embodiment, the particles are in the form of fibers which “ball up” upon the application of heat, and the outwardly exposed ends of the particles are flame-treated to create a kinky appearance. Nylon fibers are suitable in this case. In an alternative embodiment, an adhesive is applied to the flocking particles attached to the surface, and additional flocking particles are applied to the adhesive-coated fibers. As further alternative embodiment, air pressure is applied to the particles before the adhesive cures, so that the particles assume a preferred orientation with respect to the surface.

Abstract: A method for mass producing thin IC cards having beautiful surfaces using a non-polluting polyethylene telephthalate material in which a hot-melt type adhesive is applied and formed on a joint surface of a cover sheet formed from polyethylene telephthalate, and in which a hot-melt adhesive is used as a sealing adhesive at an opening of a core sheet that is held by the cover sheets. To improve the heat-resisting bonding strength of this hot-melt adhesive, a thermosetting resin may be mixed with the hot-melt adhesive.

Abstract: A method and apparatus for use in impregnating an absorbent fibrous layer or similar portion of a tubular liner with a curable resin material to prepare such a liner for installation into a pipe to repair the pipe. Several vacuum applicators such as hollow needles, all connected to a vacuum, are used simultaneously to evacuate air from the entire absorbent fibrous layer of the tubular liner, beginning at a time significantly before curable resin is first introduced to be absorbed. A timer is used to begin the evacuation automatically.

Abstract: An apparatus for applying a pad to a component has a flexible diaphragm held in a continuous frame for holding the pad. On its front side which faces the component when the apparatus is in use, the frame has a circumferential, resilient gasket. Through a vacuum connection, a space between the diaphragm and the component is to be attached to a vacuum source. By that the pad applies itself against the component.

Abstract: An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a conventional epoxy or frit. The electrostatic thermal bonding method uses a silicon-glass bonding mechanism. First, a silicon thin film is deposited on a metal thin film formed on a side of one glass substrate, and the two glass substrates are brought face to face with each other by bringing the silicon thin film into contact with the surface of the other glass substrate. A predetermined direct current voltage is applied between the metal thin film and the other glass substrate under a predetermined temperature, thereby the bonding between glass substrates is performed. In the glass-glass bonding method utilizing the silicon thin film, the direct current voltage in the range of 0 to 1000V is applied under a bonding temperature between 100 to 500° C.

Abstract: In a method and molding apparatus for laminated molded bodies, a thermal-molding felt and a thermoplastic resin sheet, respectively in hot and soft condition, are set or placed on a mold face of cold-pressing-molding lower mold. A cold-pressing-molding upper mold lowers onto the lower mold to press the the thermal-molding felt and thermoplastic resin sheet. Simultaneously, cooling air is supplied to center portion of the thermal-molding felt through a blowing pipe protruding from mold face of the thermal-molding felt side and intruding into the felt accelerating circulation of cooling air and cooling of the thermoplastic resin sheet.

Abstract: A bonding system for glazing assemblies for mounting a glass pane on a bay of a vehicle, comprising: a first film of a coupling agent, bonded to a portion of a glass pane; a second film of a primer bonded to said first film; a gasket formed on a portion of the second film, adhered to said second film; a third film of a chemical extender, on a portion of the gasket and on a portion of the second film, bonded to said portion of the gasket and said portion of the second film and linking them to each other; a projecting molding of a sealant on said third film, bonded to said third film; a chemical coating, bonded to a bay of a vehicle; and a fourth film of a primer, bonded to said chemical coating, to be bonded in turn with the sealant, firmly retaining adhered the glass pane to the bay of the vehicle.