Abstract: An optical disk pasting apparatus 1 for pasting two disks by overlapping the second disk D2 on the first disk D1 on which an adhesive agent 4 is coated, is featured in that said second disk D2 is overlapped on the first disk D1 while adsorbing and holding said second disk D2 by warping so that the second disk is swelled in a direction (the direction of the arrow X) opposite to the first disk D1 side opposed the second disk D2, wherein closed space 5 formed between both disks D1 and D2 is vacuumed and attracted by bringing the outside areas of the first disk D1 and the second disk D2 in contact with each other.

Abstract: A method is disclosed for manufacturing an optical disk with multiple layers efficiently with improved reliability. An optically transparent sheet is laminated on a first information recording surface, and an ultraviolet light hardened resin is formed thereon which has a second information recording surface.

Abstract: A process for mounting a semiconductor chip onto a circuit board adheres resin of ACF to a peripheral lateral surface of the semiconductor chip to a higher height level while avoiding the generation of voids within the resin of the ACF extending out of the periphery of the semiconductor chip. A semiconductor chip is mounted onto a circuit board via ACF and is pressed against the circuit board while heating the ACF and the peripheral region thereof extending out of the periphery of the semiconductor chip. A frame for adding a load is placed on the peripheral region of the ACF so that a gap is formed between the inside surface of the frame and the lateral surface of the semiconductor chip, and presses the peripheral region of the ACF against the circuit board, whereby the resin of the ACF is forced into the gap and adheres to the peripheral lateral surface of the semiconductor chip. Together therewith, gas dwelling in the inside of the peripheral region of the ACF is expelled therefrom to the outer air.

Abstract: An attachment between a monitoring device and an innerliner of a tire includes the use of an epoxy adhesive that bonds the monitoring device directly to the inner surface of the innerliner of the tire. The innerliner is first roughened in a manner that provides a roughened portion of the innerliner without removing the entire thickness of the innerliner. The entire thickness of the innerliner is not removed because the innerliner is preferably more than {fraction (1/16)} of an inch thick. The thickness of the innerliner allows the rigid cured epoxy to bond the monitoring device to the inner surface of the innerliner while allowing the innerliner to flex with the tire so as to not break the seal between the rigid epoxy and the innerliner. The monitoring device is preferably located at a low flex area of the tire to help avoid the problem of the innerliner flexing.

Abstract: A method for making cards with an electronic module is disclosed. The method comprises the steps of providing a card body (1) having a cavity (3, 4), an electronic module (5) shaped to fit said cavity, and a cyanoacrylate adhesive, depositing said adhesive in said cavity, inserting said module into the cavity in a substantially centered position, and pressing said adhesive between the card and the module. According to the method, said adhesive is deposited in an amount sufficient to cover an adhesion surface constituting 50-100% of the surface of said cavity, after pressing, at a temperature of 15-30° C. and at a humidity level of 50-75%. The cards produced by carrying out the method are also disclosed.

Abstract: A method for forming a longitudinally water-tight section in a predetermined area of a multi-conductor wiring system. The multi-conductor wiring system has a plurality of individual conductors, each individual conductor being encased in an insulative sheath.

Abstract: Disclosed is a method for surrounding electrical cable, such as coax cable or twinax cable, with an elastomer to form a twist capsule cable. The cables are placed in a fixture and stretched to a desired tautness using rubber bands at opposite ends of each cable without allowing the cables to sag in the fixture. The cables are clamped into yokes at opposite ends of the fixture. An elastomer, such as silicone, is poured into the fixture and allowed to cure. The portion of the cables within the fixture are embedded into the elastomer after the elastomer cures. Additional length of twist capsule cable can be fabricated by performing a similar process on adjoining sections of cable. The elastomer is then coated with a polyxylylene or similar polymer such as Parylene™ to prevent the elastomer from rubbing on itself when coiled and when uncoiling. Advantageously, any number of cables can be embedded in the elastomer to form the twist capsule cable.

Abstract: A method of manufacturing a wound insulator pipe, in particular for a high voltage insulator, having one or more ducts for conductors of any kind is provided. A laminate structure is achieved by winding a material onto a spindle and impregnating with a resin. Initially first layers of the material to be wound are applied; then at least one groove is made in the surface obtained and then the winding is completed until the final diameter is attained.

Abstract: An electronic component connecting method of connecting a first electronic component and a second electronic component via a connecting structure like a bump electrode in which a thermosetting conductive adhesive is applied on connecting electrodes on an IC chip, which serves as the first electronic component, by printing or the like, and is hardened, whereby tapered projecting electrodes as bump electrodes are formed to project in the form of, for example, a circular cone. Then, a conductive adhesive for connection is applied on the projecting electrodes. Before the conductive adhesive for connection is hardened, the IC chip is aligned with a wiring board, which serves as the second electronic component, so that the ends of the projecting electrodes and connecting electrodes on the wiring board are in contact with each other. In this aligned state, the conductive adhesive for connection is hardened.

Abstract: A method of manufacturing a curved glass/plastic laminate sheet for lightweight automotive glazing is disclosed. A flat laminate is build up with two thin glass layers, one inner and one outer, and a thick middle layer of thermoplastic. The flat laminate is heated to a plasticity temperature of the thermoplastic and it may be fit into a mould so that bending occurs mainly due to plastic transverse shear deformation of the plastic layer. Glass bending is limited to elastic bending of the single glass layers. Residual bending stresses in the glass layers are avoided by preferably incorporating pre-bending stresses in the flat glass layers. Strengthening of the final glass layers is achieved by incorporating compression stresses on the bent pane through heat treatment and having different thermal expansion coefficients of glass and plastic.

Abstract: A mold is disposed just behind twist ports for forming twisted pair portions of a flat cable. When a plurality of insulated conductors in their portion corresponding to a parallel portion, before fusion, of a flat cable are passed through the twist ports, the rotation of the twist ports is stopped to permit the plurality of insulated conductors to be parallel aligned with an identical pitch. The mold comprises a combination of two molds each having a plurality of grooves for accommodating therein the plurality of insulated conductors delivered from the twist ports. Upon accommodation of the plurality of insulated conductors within the grooves of the mold, fusion between adjacent insulated conductors in their insulative layers is carried out in the mold to form a parallel fused portion.

Abstract: A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

Abstract: An improvement is proposed in the design and manufacturing of the frame-supported pellicle used to protect the photomask- a lithographic template employed in semiconductor manufacturing for creating integrated circuit devices- from airborne contaminants. Addressed, is that the industry's current pellicle frame design always results in the destruction of the frame-supported pellicle and sometimes the photomask itself when- as is frequently the case- defects are found underneath the frame-supported pellicle necessitating its removal to permit photomask repair and/or cleaning. In addition, imperfections in the flatness of the current pellicle frame induce physical distortions in the photomask that result in degradations to the photomask's pattern placement accuracy.

Abstract: A method of preventing bubbles or small bubbles when connecting substrate parts of optical data carriers by means of an adhesive. At least one of the substrate parts and/or the adhesive is provided with electric charges.

Abstract: This invention concerns a process for producing a curved, laminated safety glass sheet from a first curved glass sheet (1), a first laminated layer (2), a thermoplastic substrate sheet (4) with a biaxially drawn thin-layer system (3), a second laminated layer (5), and a second curved glass sheet (10) conforming to the first one.

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free.

Abstract: The present invention protects from excessive heating at least one component on an object during curing of paint at a localized area on the object by exposure to a heat source. The present invention circulates air including cold air near the at least one component to be protected. An air pocket is formed adjacent the at least one component to be protected. This air pocket has an inlet and an outlet. A cold air source is coupled to the inlet via a tubing that directs cold air from the cold air source into the air pocket. Heated air within the air pocket flows out through the outlet of the air pocket such that air circulates through the air pocket. In this manner, the temperature of the at least one component to be protected is maintained below a predetermined temperature when the localized area of the object is exposed to the heat source for curing of the paint at the localized area.

Abstract: An apparatus for joining two optical discs into a disc assembly having multiple layers of data has a disc processing chamber for supporting the first and second discs, wherein each of the discs has a layer of data on a first side thereof. The processing chamber is fluidly connected to a tank containing a bonding fluid. A vacuum pump is selectively connectable to the processing chamber and the tank for selectively evacuating air out of each. An actuator is operatively mounted within the processing chamber and supports the first disc. The actuator moves the first side of the first disc into contact with the first side of second disc after the processing chamber has been evacuated and a bonding fluid is placed on one of the first and second discs, thereby forming a disc assembly having multiple layers of data.

Abstract: Cards, labels and the like containing embedded microcircuits or other elements are fabricated in a continuous process by introducing microcircuits between ribbons of extruded material, pressing the ribbons into adhesion with each other while in a plastic state thereby to make a continuous composite sheet containing the microcircuits, cooling the composite sheet to solidify the extrudate material, and cutting out cards from the composite sheet, each card containing a microcircuit. The microcircuits may be introduced between the extruded ribbons on a continuous carrier sheet which may also serve as a printed circuit substrate for the microcircuits. Alternatively, the microcircuits are inserted as discrete units between the extruded ribbons by a suitable robotic device.

Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.