Abstract: Core-type structures are formed by extruding elongated tubular members or sheets of a thermoplastic material that are subsequently cut into segments or plates having a defined length and then assembled into a bundle. The bundle is then simultaneously cut at a number of spaced-apart locations along the length of the bundled segments, or plates, whereby a plurality of separate core structures are simultaneously formed.

Abstract: The invention provides a process for treating a metallic surface, other than a clean aluminum or aluminum alloy surface, which comprises treating the surface with an organosilane and exposing the surface to a laser.

Abstract: Process for the radiation crosslinking of double-sided adhesive tapes, in which a backing material coated on both sides with adhesives is irradiated asymmetrically from both sides with different doses in an irradiation means.

Abstract: A system using several wavelengths, preferably from the output of a single laser, is described for curing a dual cure glue seal that affixes two substrates to form a liquid crystal display panel. Here the liquid crystal is already in place before the glue seal is cured so that a high temperature bake to promote the sealant curing is not permissible . The multiple wavelengths from the single source of radiation result both from frequency doubling and mixing of the fundamental laser to achieve frequency tripling. Generally a UV wavelength is required for curing the photolytic component of the glue seal so that in the present invention the fundamental from a ˜1 micron (1000 nm) wavelength laser is frequency tripled. The UV is scanned along the entire peripheral region of the glue seal.

Abstract: Apparatus and process to form structural preforms from an electromagnetic energy activated binder and reinforcing material using low cost tooling. The apparatus includes one or more lay-up stations and forming stations.

Abstract: Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.

Abstract: This invention relates to how to obtain an optical recording disc with a good quality, capable of achieving a beautiful outline shape of the inner peripheral part side rim part of the cured ultraviolet ray curing type resin substantially concentrically even in the case there is irregularity of the wettability of both round substrates with respect to the ultraviolet ray curing type resin, and capable of providing an even film thickness of the resin with the film thickness controlled to a predetermined value or less even in the case there are irregularity of the wettability of both round substrates, difficulty in controlling the centrifugal force applied on the resin, irregularity of the plate thickness of both round substrates, or the like.

Abstract: We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.

Abstract: A method and apparatus for fabricating a three-dimensional object from porous solid preform layers and at least a pore-filling material.

Abstract: The present invention is designed to effectively band ornamental trims onto panel edges, such as those of furniture tops. The present invention utilizes pneumatic forces to hold the ornamental trims against the panel edges instead of traditional clamps, resulting in asserting a uniform pressure press-fitting the trims against the panel edges along a good length of the trims instead of merely along several points of the trims. furthermore, since the contacting surface of the present invention is made of a soft material, it would not leave any pressmarks or indentations on the trims as can left by a hardened clamp.

Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.

Abstract: An apparatus for mounting electronic parts on a printed circuit board in which a number of electronic parts to be mounted on a printed circuit board are arranged as a set and loaded in a loading member for electronic parts. A set of such loading members for electronic parts, each carrying a set of electronic parts of the same type, are arrayed in a loading member furnishing casing. This set of the loading members for electronic parts, arrayed and held in the loading member furnishing casings inserted and held by a loading member holder by which the set of the loading members for electronic parts can be held in register with an electronic part mounting portion of the printed circuit board. The loading member holder holding the set of the loading members for electronic parts is loaded on an electronic part loading device. The set of the electronic parts held by the loading member holder is loaded at one time on the sole printed circuit board by the electronic part loading device.

Abstract: Method for the production of a laser-inscribable sheet of glass, wherein a laser-sensitive coating, comprising a) a base polymer and b) a radiation-sensitive additive which exhibits a color change on laser irradiation, is applied to at least part of a sheet of glass and hardened, and the sheet of glass is subsequently inscribed by means of a laser.

Abstract: A method for gluing two disc elements together, in particular substrates for digital audio, video or data discs, such as Digital Versatile Discs (DVDs). The disc elements are held essentially horizontally and coaxially with one another so that a gap is formed between the disc elements, after which, in an inner area of the gap, a liquid adhesive is applied in the form of separate strands in the circumferential direction on the facing sides of the disc elements. The disc elements are brought together against one another and made to rotate rapidly in conjunction with the bringing together in order, by the gravitational force of the upper disc element and the capillary force of the adhesive, in association with the centrifugal force on the latter during the rapid rotation, to form a homogeneous and bubble-free adhesive layer of predetermined thickness between the disc elements.

Abstract: A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.

Abstract: Process for manufacturing anti-theft and/or traceability devices associated with stoppering and covering means The invention relates to the high-rate industrial manufacture of remote-detectable devices used in particular as anti-theft devices but also to carry information, associated with means for stoppering and covering containers. To this end, a material in web form is unwound and caused to travel along, and at least one detectable means such as a filament or an oriented-particles film or an electronic tag is deposited in continuous or discontinuous form on this material, this or these detectable means running or following on from one another in the direction of travel of the web-form material. This material is cut according to the singular or plural detectable means deposited on it, so as to separate individual elements each equipped with a detectable means such as a filament, and themselves constituting stoppering or covering means, or parts of such means, for example gaskets for caps.

Abstract: A method and apparatus for temporarily attaching a pellicle membrane and frame to a photomask substrate until the assembly passes inspection, and then permanently bonding the frame to the substrate. In the preferred embodiment, a vacuum channel is provided in the pellicle frame to permit a vacuum to be drawn between the frame and the substrate. In alternate embodiments, a static adhesion is obtained between the flat surfaces of the pellicle frame and the substrate, and this static adhesion is improved by wiping a solvent on the bottom surface of the pellicle frame.

Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.

Abstract: A process for making a picture frame includes the step of printing border art and registration marks on a piece of sheet material, such as paper, and marking a laser cut path on the printed sheet of material and then zone coating an adhesive onto the sheet material over the printed artwork. The process includes attaching the sheet material to a transparent polymer sheet, cutting the printed sheet material along the marked cut path to form a cutout in the printed sheet and removing the cutout portion of the printed sheet material which does not have adhesive applied thereto. The transparent polymer sheet is heated and folded to form a backing for the picture frame. The process can also utilize a zone coating of ultraviolet activated adhesive applied over the printed artwork, then passing the polymer sheet having the printed sheet attached thereto through a pair of rollers for removing air bubbles and directing ultraviolet light through the polymer sheet onto the adhesive to activate the adhesive.

Abstract: This invention relates to a heat sensitive glue activating labeler using one drum in which a label adsorbing portion capable of being adjusted to a size of a label.