Abstract: Voltage down converter of a semiconductor memory device shown includes a reference voltage generating circuit, a current mirror amplifier for comparing the reference voltage Vref with internal power supply voltage intVcc, and a PMOS receiving at its gate an output from the current mirror amplifier. Further, the voltage down converter includes a .phi.s generating circuit for generating a signal .phi.s before the operation of sense amplifier, and a PMOS receiving at its gate the signal .phi.s. Voltage down converter generates the internal power supply voltage intVcc such as shown in FIG. 8, before the operation of sense amplifier. Therefore, the voltage down converter can supply a stable internal power supply voltage intVcc, and prevents considerable lowering of the level of the internal power supply voltage intVcc caused by the operation of the sense amplifier.

Abstract: An improved charge pump circuit uses standard low-voltage fabrication process for programming an anti-fuse memory cell from a high-voltage current source. A column-selection transistor which has a gate terminal connected to a control terminal. The column-select transistor is connected between a high voltage programming current source and one terminal of an anti-fuse link. The other terminal of the anti-fuse link is connected through a word-selection transistor to ground. The gate terminal of the word-selection transistor is connected to a word selection line. Two oppositely phased charge pumps provide a boosted voltage. A trapping-diode-connected transistor isolates the boosted voltage from the gate terminal of the column-selection transistor. A charge-kicker circuit further boosts the voltage on the gate of the column-selection transistor to turn on and pass current from the high voltage programming current source through the anti-fuse link.

Abstract: To prompt a repairing operation as and when defective cells appear in an integrated circuit memory, there is provided an auxiliary memory related to a programmable comparator. Whenever the cells of the memory are to be read, the auxiliary memory is read and its content is compared with the address selected in the memory array. The result of this comparison produces, in real time, the addressing signals of a redundant cell and signals for the neutralization of the initially encountered cell. This system can be used more particularly in the field of EEPROM type memories.

Abstract: A pull-up circuit for a DRAM P-channel sense amplifier includes an NMOS transistor and a PMOS transistor connected in parallel with each other between a supply voltage and a pull-up node for the sense amplifier. The transistors are connected to a control circuit that turns on the NMOS transistor during a pull-up cycle and turns on the PMOS transistor only during the initial portion of the pull-up cycle.

Abstract: A collective erasure type nonvolatile semiconductor memory device which allows use of redundant structure to word lines is provided. A row address buffer having address converting function simultaneously selects a plurality of physically adjacent word lines from a memory array in programming before erasure. Programming before erasure is effected on the memory cells on the simultaneously selected word lines. Even when physically adjacent word lines are short-circuited between each other, programming high voltage can be transmitted to the defective word lines, as these word lines are selected simultaneously. Therefore, the memory cells on the defective word lines can be programmed before erasure, so that over erasure at the time of collective erasing operation can be prevented. Thus, redundant structure for replacing defecting word lines by spare word lines can be utilized.

Abstract: A semiconductor memory device includes a sense amp band including a plurality of sense amplifiers, and a plurality of operation power supply potential lines and a plurality of ground potential lines arranged in a meshed shape. The operation power supply potential lines and the ground potential lines include the lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to an operation power supply potential line and a ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. The drive component is provided one for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of operation power supply potential lines and the plurality of ground lines arranged in a meshed shape are contacted at crossings.

Abstract: The current paths of a plurality of floating gate type MOSFETs are series-connected to form a series circuit. The series circuit is connected at one end to receive a reference voltage, and is connected to data programming and readout circuits. In the data programming mode, electrons are discharged from the floating gate to the drain of the MOSFET or holes are injected into the drain into the floating gate. The data readout operation is effected by checking whether current flows from the other end to the one end of the series circuit or not.

Abstract: An integrated circuit comprising a reference voltage generator having an output providing a reference voltage; a selectively engageable filter having an input connected to the output of the reference voltage generator, and having an output; a voltage regulator having an input connected to the output of the filter, and having an output; a dynamic random access memory receiving power from the output of the voltage regulator, the dynamic random access memory having memory cells that are accessed or refreshed in response to a first signal; and a timing circuit which engages the filter in response to presence of a first signal, and causes the filter to filter the reference voltage.

Abstract: An end-of-count detecting device for nonvolatile memories, comprising a decoder in the form of a wired OR structure of a number of transistors of the same type, the gate terminals of which are fed with a count signal generated by a counter element and having a predetermined end-of-count value to be detected. A load, which may be static, pseudo-dynamic or dynamic, is provided between the common node of the decoder transistors and a reference potential line; and the decoder output formed by the common node assumes a different logic level according to whether or not the end-of-count value coded by the wired OR structure is reached. A number of wired OR structures may be arranged side by side with an array of transistors for detecting a number of end-of-count values of the same counter element.

Abstract: A field programmable device includes two separate and electrically isolated arrays of rows and columns of conductors sharing the same area of an integrated circuit substrate, one array interconnecting memory cells to form a random access memory ("RAM"). The other array forms a full or partial cross-point switching network that is controlled by information stored in memory cells, and/or connects to an operating electronic circuit that is configurable and operable in accordance with information stored in memory cells. In addition, the memory array is easily used to access desired nodes of the circuit array in order to be able to easily observe internal signals during operation. A preferred memory structure is a dynamic random access memory ("DRAM") because of a high density and low cost of existing DRAM fabrication techniques, even though periodic reading and refreshing of the states of the memory cells is required.

Abstract: Memory arrays are divided into banks which can be operated independent from each other. Read data storing registers and write data storing registers operating independent from each other are provided for the banks. The memory array is divided into a plurality of small array blocks, local IO lines are arranged corresponding to each array block, and the local IO lines are connected to global IO lines. The global IO lines are connected to preamplifier groups and to write buffer groups. By control signal generating circuits and by a register control circuit, inhibition of writing of a desired bit only during successive writing operation can be done, data can be collectively written to the selected memory cells when the final data is input if the data writing should be stopped before reaching the wrap length in successive writing, and the timing for activating the memory array when the write cycle should be repeatedly carried out can be delayed.

Abstract: An object of the present invention is to provide a semiconductor device that permits easy and efficient testing. A nonvolatile semiconductor memory comprises word lines WLi and bit lines BLi, a memory cell matrix 17 consisting of nonvolatile memory cells Cij, a sense amplifier 15, a write/erase timing circuit 9 for performing timing control necessary for write and erase operations, and a status register 2 for storing the operating state of the memory at the completion of the operation of the circuit 9, wherein there are provided, outside the address of the memory cell matrix 17, two kinds of dummy cells, D1, D2, D3, . . . , whose values are fixed to different values that induce different outputs from the sense amplifier 15. A pass condition or a fail condition is generated by accessing the dummy cells.

Abstract: An electronic transducer array and transfer device and method which provides for activation of selected transducers at selected times. In one application, the device performs data transfer by a combination of suitably interconnected submillimeter transducers (4) capable of sensing and/or actuating microscopic data-storage cells, and electronic switching (402, 602, 702) to activate selected individual transducers. One embodiment of the invention provides for magnetic transducers for reading (304) and writing (302) on a magnetic medium (8). Another embodiment of the invention provides tunneling electron transducers (10) arranged in an array.

Abstract: A dual-port memory having an on-chip color register for storage of input data for use in multiple write cycles is disclosed. The color register is written to during a special cycle, which is enabled by a special function pin in conjunction with the write enable and transfer enable function pins, each of which have their logic state latched in during the row address strobe signal. A second type of special cycle causes a multiplexer to select the contents of the color register, rather than the latched data state of the data input terminals, for the data to be written to the selected memory cells. The use of the color register may be used in conjunction with a mask register, where the writing of certain input/outputs is inhibited. In addition, a block write feature may be incorporated with the color register so that, in another type of special cycle, multiple columns per input/output can be simultaneously written with the contents of the color register.

Abstract: A nonvolatile semiconductor memory employs sense amplifiers, circuits for providing stabilized source voltages, and circuits for realizing high-speed and reliable read and write operations. The semiconductor memory has a matrix of nonvolatile erasable memory cell transistors.

Abstract: A memory cell including a storage element having a first structure with a plurality of layers, selected layers having magnetization vectors associated therewith, the first structure exhibiting giant magnetoresistance, wherein the storage element has a closed flux structure in at least one dimension, and wherein the magnetization vectors are confined to the at least one dimension during all stages of operation of the storage element. The memory cell includes a means for reading information from and writing information to the first structure and a selection conductor for applying one or more selection signals to the storage element to enable reading from and writing to the first structure. In one embodiment, the reading and writing means includes a read conductor electrically coupled to the first structure, and a write conductor electrically isolated from the read conductor and the first structure.

Abstract: A dynamic integrated circuit memory is described which has memory cells arranged in rows. The memory rows are selectively accessible using an addressing circuit and local phase lines. Distributed local phase driver circuits are used to drive the local phase lines to a pumped voltage which are coupled to the gate of a memory cell access transistor. Addressing circuitry is provided to selectively address the distributed local phase driver circuits.

Abstract: A double-row address decoding and selection circuitry for an electrically erasable and programmable non-volatile memory device with redundancy comprises a plurality of identical circuit blocks supplied with address signals and each one generating a respective selection signal which is activated by a particular logic configuration of said address signals for the selection of a particular row of the matrix; each one of said circuit blocks also generates a carry-out signal which is supplied to a carry-in input of a following circuit block and is activated when the respective selection signal is activated; a first circuit block of said plurality of circuit blocks has the respective carry-in input connected to a reference voltage; each of said circuit blocks is also supplied with a control signal, which is activated by a control circuitry of the memory device when, during a preprogramming operation preceding an electrical erasure of the memory device, a defective row is addressed, to enable the activation of the r

Abstract: An integrated circuit memory which includes at least some RAM/ROM hybrid columns. The RAM/ROM hybrid cells operate as normal SRAM cells forever, unless and until they are programmed to operate as ROM cells. Thus users who need the extra security permitted by ROM encoding can have this capability, while users who do not need ROM encoding can use off-the-shelf parts as RAM only.

Abstract: During a period corresponding to the former half of one cycle of a clock signal, a capacitor is charged to an intermediate potential between the respective precharged potentials of two level-shifters. Subsequently, during a period corresponding to the latter half of one cycle of the clock signal, the capacitor is connected to that one of the output nodes which shifts to a lower potential in the level-shifter on the upper stage, while a power source line is connected to the other output node which shifts to a higher potential. On the other hand, the capacitor is also connected to that one of the output nodes which shifts to the higher potential in the level-shifter on the lower stage, while the ground line is connected to the other output node which shifts to the lower potential. Consequently, there can be provided a semiconductor integrated circuit free from power dissipation that might have been caused by an internal power-source circuit.