Abstract: A method is provided that integrates a unique set of structural features for concealing self-powered sensor and communication devices in aesthetically neutral, or camouflaged, packages that include energy harvesting systems that provide autonomous electrical power to sensors, data processing and wireless communication components in the portable, self-contained packages. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

Abstract: An assembly for opening or accessing an electronic communication and entertainment device holder for repair or replacement of its contents, including a latch which can be released by the contraction of an attached muscle wire actuator in response to a low current pulse sent by an attached wireless receiver.

Abstract: A method for making a wired drill pipe joint includes forming an electrically conductive material into a structure that is radially expandable to conform to an interior of the pipe joint substantially without plastic deformation of the electrically conductive material. An electrical connector is coupled to each longitudinal end of the formed electrically conductive material to form an electrical conductor assembly. An interior of the pipe joint is coated with an electrically insulating material. The electrical conductor assembly is inserted into the pipe joint. The electrically conductive material is radially expanded to conform to an interior surface of the pipe joint wherein a bonding material is applied to the interior wall of the pipe joint.

Abstract: A method for producing a resin multilayer board includes preparing a first resin layer including one or more conductor patterns that are disposed thereon and a conductor pattern including a first region that is to be connected to a conductor via; forming a paint layer by applying a paste including a LCP powder to a second region entirely covering the one or more conductor patterns; forming a cavity in the paint layer such that at least the first region is exposed, by performing laser processing; stacking a second resin layer including the conductor via on the first resin layer; and obtaining a resin multilayer board including a layer obtained by curing the paint layer, by applying pressure and heat to the multilayer body to perform thermal pressure-bonding.

Abstract: A method of manufacturing a micro-molded electrode (160) having multiple individually addressable sensors (140) along a shaft (180) can include forming a recess in a mold substrate, depositing a structural material therein, depositing a conductive material at specific locations, providing a coating (190), and removing the mold substrate. A micro-molded electrode (160) having a base (170) tapering to at least one shaft (180) can include an electrode substrate, multiple individually addressable sensors (140), and a coating (190).

Abstract: The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.

Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.

Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.

Abstract: In a joining method of an electric wire, an end of a first conductor is held by a holding surface of a first jig electrode from an outer circumference side and an end of a second conductor is held by a holding surface of a second jig electrode from an outer circumference side to butt and join the ends of the first conductor and the second conductor in the axial direction while heating the ends. Then, a melted material is bulged outward from an outer circumferential surface of a joining portion to a bulge molding portion formed to surround a joining portion of the ends of the first conductor and the second conductor.

Abstract: A method of producing a film including repeating a cycle comprised of an application step, a coat removal step and a sintering step N times (N?2), wherein relative to a liquid supply position in the (n)th (1?n?N?1) cycle coat removal step, a liquid supply position in the (n+1)th cycle coat removal step is the same or shifted in a direction approaching the center of a substrate for all n(s) and at the same time, shifted in a direction approaching the center of the substrate for at least one of the (n)s; or is the same or shifted in a direction away from the center of the substrate for all n(s) and at the same time, shifted in a direction away from the center of the substrate for at least one of the (n)s.

Abstract: A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.

Abstract: A digit for a prosthetic hand is provided. The digit has a base member (12) attachable to the hand and at least one digit member (18) pivotably connected to the base member. The at least one digit member (18) has a digit tip (22) remote from the base member (12), and the digit member is at least partially covered with at least one conductive substance (26,40) which defines a conductive path which leads from the digit tip towards the base member. A method of manufacturing such a digit is also provided.

Abstract: Embodiments disclosed herein include devices and methods for aligning an electrical device. The electrical device aligning tool may include a body member, comprising an end panel at each opposing longitudinal end of the body member and forming a longitudinally perpendicular angle with the body member. The tool may also include an intersecting member coupled to the body member and positioned such that a length of the intersecting member longitudinally intersects the body member at an angle. Additionally, the intersecting member may include an expanding and contracting mechanism, and lateral members coupled to the expanding and contracting mechanism such that the lateral members move horizontally along a front surface of the intersecting member, with respect to a movement of the expanding and contracting mechanism.

Abstract: The disclosure relates to a method for producing a stator, where, for one or both layers of a two-layer winding, a tool with receiving regions is respectively provided on an end face of a laminated core. A relative arrangement of the receiving regions corresponds to a relative end position for conductor ends of the conductor elements. In a positioning process, the tool is moved into a first turning position and each conductor end of a first group of the conductor elements is respectively inserted into one of the receiving regions. Then the tool is turned into at least one further turning position and each conductor end of a further group of the conductor elements is respectively inserted into one of the receiving regions until the conductor ends of all the conductor elements of the layer are in the relative end position in relation to one another.

Abstract: A method for adjusting a resonant frequency of a resonator without impairing piezoelectricity that includes preparing a lower lid; arranging a substrate with a lower surface that faces the lower lid and forming a first electrode layer, a piezoelectric film, and a second electrode layer on an upper surface of the substrate. Moreover, a vibration arm is formed that bends and vibrates from the first electrode layer, the second electrode layer, and the piezoelectric film and an upper lid faces the lower lid with the resonator interposed therebetween. The method further includes adjusting a frequency of the resonator before or after arranging the upper lid by exciting the vibration arm by applying a voltage between the first electrode layer and the second electrode layer and by causing a part of the vibration arm to collide with either or both of the lower lid and the upper lid.

Abstract: A method of forming a power-module assembly includes arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of the container. The method further includes inserting a core between each of the power stages, and installing a manifold on top of the power stages. The method also includes putting resin into the cavity to form a housing of the power-module assembly, and removing the core to reveal coolant chambers between each of the power stages.

Abstract: An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

Abstract: A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

Abstract: A hollow portion is formed in a holding jig. A first projection protrudes from a first inner side wall of the hollow portion. As the holding jig rotates to twist and bend a leg portion of a conductor, the projection bites into the leg portion.