Patents Examined by Kaying Kue
  • Patent number: 10542648
    Abstract: A tape feeder (part feeding device) includes a main body including a transporting passage for guiding a part feeding tape to a part removing position, a conveyor for positioning a storage of the part feeding tape which is inserted to the transporting passage to the part removing position, and a part detector for detecting the part stored in the storage in the transporting passage at the upstream side of the part removing position. The transporting passage includes a travelling surface for supporting the part feeding tape from underneath, a pair of side guides for guiding two side surfaces of the part feeding tape, and a squeezed portion in which a distance between the pair of side guides is gradually reduced from the upstream side of the part detector toward a part detecting position of the part detector.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: January 21, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masashi Matsumori, Takashi Nakamura
  • Patent number: 10537051
    Abstract: A mounting machine determines whether or not there is running out of a component in a mounting process based on initial order information and the number of remaining components, and when the mounting machine determines that there is running out of a component, a modified order in which the determined component is preferentially mounted is set as the mounting order. In addition, during the mounting process when a component of a subsequent mounting target in the mounting order runs out, and a component later in the mounting order than the component does not run out, the component that does not run out is previously mounted on the board. Furthermore, the initial order which is indicated by the initial order information is set in advance as an order such that a component in the plurality of components that has a higher frequency of running out than another component is preferentially mounted.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: January 14, 2020
    Assignee: FUJI CORPORATION
    Inventors: Shigeto Oyama, Jun Iisaka
  • Patent number: 10522961
    Abstract: A wiring harness evaluation apparatus includes a functional allocation means which allocates functions realized by a plurality of ECUs installed in a vehicle to the ECUs, a routing path setting means which sets a routing path of a wiring harness in conformity with the allocation by the functional allocation means, a component selection means which selects components for configuring the wiring harness in conformity with the routing path set by the routing path setting means, and an evaluation value calculation means which calculates an evaluation value for at least one of a total weight of the components, total cost of the components, and total length of electric wires configuring the wiring harness on the basis of information on the components selected by the component selection means.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: December 31, 2019
    Assignee: DENSO CORPORATION
    Inventors: Tomoya Tokunaga, Hidetoshi Morita
  • Patent number: 10524357
    Abstract: A method for producing a flexible mounting substrate. The method comprises preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump, arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region, arranging the electronic component on the anisotropic conductive film, and pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate, and adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion located on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: December 31, 2019
    Assignee: DEXERIALS CORPORATION
    Inventor: Takayuki Matsushima
  • Patent number: 10509322
    Abstract: A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Hsiung Hsu, Huang-Yu Chen, Tsong-Hua Ou, Wen-Hao Chen
  • Patent number: 10512175
    Abstract: A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: December 17, 2019
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: O-Chung Kwon, Jeong-Sang Yu, Jae-Sic Kim, Yong-Il Kim, Hyun-Soo Jang
  • Patent number: 10506858
    Abstract: A securing system for a container includes a securing system and an ornamental system selectively securable thereto for operably enabling a multitude of adaptive attractant features for greater expression of individuality. The securing system includes opposing elements effective to releasably secure opposing open side elements of the container against an unintended opening. The ornamental system includes an attractant feature and may optionally include additional attractant systems for presentation of a sound, a scent, a motion, or a secure access function.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: December 17, 2019
    Assignee: DIVA V.
    Inventor: Veronica Van Rooyen
  • Patent number: 10502002
    Abstract: A method for manufacturing a system for drilling includes receiving a drive shaft for transmitting a torque to a downhole tool and forming a hollow central passage in a tubular wall of the drive shaft extending along a longitudinal axis L. The hollow central passage allows a flow of a drilling fluid through a bearing section of the system. The method further includes disposing an elongated flow diverter in the tubular wall of the drive shaft. The elongated flow diverter has a body that includes axially-spaced apertures distributed along the longitudinal axis L of the drive shaft and the hollow central passage. The distribution of the apertures along the longitudinal axis L reduce the impingement of the drilling fluid while diverting the flow of the drilling fluid from an upstream annulus section of the system to the hollow central passage.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: December 10, 2019
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventor: Joachim Sihler
  • Patent number: 10498202
    Abstract: The manufacturing method for a rotor includes steps of: applying an adhesive to a first surface of a magnet material member that becomes a permanent magnet after magnetization, the adhesive being applied such that a total thickness of the magnet material member and the adhesive is less than a radial width of a magnet insertion aperture; disposing a rotor core such that an axial direction thereof is horizontal, and inserting the magnet material member into a magnet insertion aperture that is positioned vertically uppermost among the magnet insertion apertures so as to orient the adhesive vertically upward; positioning each of the magnet material members by pressing the magnet material member against an inner wall surface on an outer circumferential side of the magnet insertion aperture after inserting the magnet material member into each of the magnet insertion apertures; and curing the adhesive after the magnet material member is positioned.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hirohisa Yokota, Akihiro Yamamura, Yoshinobu Sugimoto, Shinji Sano
  • Patent number: 10499496
    Abstract: A length- and width-deformable printed circuit board includes a first conductive circuit layer, an elastic film, and a plurality of conductive via holes. The first conductive circuit layer includes a plurality of first conductive circuits. The plurality of first conductive circuits is embedded in the elastic film. The first conductive circuit layer have a plurality of first honeycomb hole. Each of the plurality of conductive via holes corresponds to one of the first honeycomb holes.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: December 3, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Wei-Xiang Li, Ming-Liang Zuo
  • Patent number: 10491087
    Abstract: A method of manufacturing a rotor of an electric motor is disclosed. The method includes securing a plurality of permanent magnets to a sheet to form a magnet chain, bending the sheet to engage an inner surface of each permanent magnet with a curved outer surface of an insert mold, wrapping a metallic strip around an outer surface of the sheet to form a yoke of the rotor, and molding a polymeric material over the magnet chain and the yoke to form a cylindrical shell.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: November 26, 2019
    Assignee: Whirlpool Corporation
    Inventors: Luiz V. Dokonal, Evandro J. Meurer, Orlando Starke
  • Patent number: 10483027
    Abstract: A coil component includes a drum-shaped core having first and second flange portions and a plate-shaped core. The top surface of each of the flange portions has a convex curved surface. At least four protrusions are provided between the lower main surface of the plate-shaped core and the top surfaces of the flange portions and contact with the lower main surface and the top surfaces of the flange portions.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: November 19, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masashi Miyamoto
  • Patent number: 10477750
    Abstract: A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: November 12, 2019
    Assignee: FUJI CORPORATION
    Inventors: Tomokatsu Kubota, Yasushi Kato
  • Patent number: 10468206
    Abstract: A method for patterning an amorphous alloy is provided. The method includes forming a pattern for defining an amorphous alloy deposition region on a parent material, forming an amorphous alloy deposition layer on the parent material with the pattern formed thereon, and etching a region except for the amorphous alloy deposition region. A dome switch is provided. The dome switch includes a metal layer shaped like a dome, a central portion of which protrudes, and, in response to external force being received through the protruding central portion, the central portion contacting and electrically connected to a circuit board, and an amorphous alloy layer disposed on the metal layer. Accordingly, an amorphous alloy structure with enhanced durability and reliability is easily manufactured.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-soo Park, Keum-hwan Park, Ju-ho Lee, Jin-man Park
  • Patent number: 10468951
    Abstract: A stator heating apparatus that includes a support that supports a stator in which a stator coil is mounted to a stator core and that is driven by a rotary to rotate the stator; a first heater that includes an induction coil inserted into a cavity portion provided at an axial center of the stator core of the stator supported by the support to be disposed to heat the stator through induction heating, the first heater heating the stator from a radially inner side of the stator; and a second heater that includes a hot-air outlet port that blows hot air toward an outer surface of a coil end portion of the stator supported by the support to heat the stator using the hot air, the second heater heating the stator from a side of the outer surface of the coil end portion, wherein the stator is heated by the first heater and the second heater.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: November 5, 2019
    Assignee: AISIN AW CO., LTD.
    Inventors: Hideaki Kimura, Tsuyoshi Niwa, Takamitsu Sugimoto
  • Patent number: 10462901
    Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: October 29, 2019
    Assignee: International Business Machines Corporation
    Inventors: Samuel Connor, Stuart B. Benefield, Matthew S. Doyle, Joseph Kuczynski, Jonathan Jackson
  • Patent number: 10457345
    Abstract: A method for manufacturing an automotive mirror, in particular a side mirror, includes forming a printed circuit board as flexible printed circuit board with n+1 branches, n?N, providing n modules each including at least one electronic element housed within a plastic casting and connected to conducting paths on at least one of the surfaces of the plastic casting, and at least one standard gripping point, guiding structure, snap connection element and/or sealing member provided by the plastic casting, connecting up to n of said branches to one module each and connecting one branch to cables or a cable harness to be connected to a power supply and/or a control unit outside the mirror, providing mirror parts free of electronic elements, and assembling the mirror parts and the modules.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: October 29, 2019
    Assignee: SMR Patents S.à.r.l.
    Inventors: Andreas Herrmann, Johannes Woessner, Ludwig Neumann, Heiko Boehland, Muthu Kumaran
  • Patent number: 10462947
    Abstract: Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: October 29, 2019
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Yoshihiro Yasui
  • Patent number: 10433413
    Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: October 1, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Po Yu, Ming-Chia Li
  • Patent number: 10429040
    Abstract: An interchangeable adapter for changing a light bulb that includes a head piece that has a base plate with opposite first and second sides and that defines a platform at the first side. A primary gripping member extends from the platform of the first side of the base plate away from the second side. The primary gripping member is positioned substantially centrally with respect to the platform to engage the light bulb. A secondary gripping member extends from the platform of the first side of the base plate away from the second side. The secondary gripping member surrounds the primary gripping member and is configured to grip the light bulb. An engagement member extends from the second side of the base plate away from the first side for engaging a holder of the adapter.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: October 1, 2019
    Assignee: GR Ventures L.L.C.
    Inventors: Joseph Gurwicz, Michael Rosen