Abstract: A component mounting device stores a correspondence relationship between identification codes and head types in an HDD. A CPU of the component mounting device reads a two-dimensional bar-code of a head which is stored in a head storage area using a bar-code reader when exchanging a first head which is held in a head holding body of a head unit for a second head which is stored in the head storage area. The CPU looks up the identification code included in the two-dimensional bar-code in the correspondence relationship which is stored in the HDD and recognizes the head type which is stored in the head storage area. Subsequently, the CPU controls the head holding body of the head unit to perform head exchanging operations according to the recognized head type.

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract: A sensor assembly may be mounted in a ceiling used with an associated light fixture. The sensor assembly may include a body including a sensor end and a blade end opposite the sensor end. A sensor may be disposed on the body nearer the sensor end than the blade end. A cutting blade may be disposed on the body nearer the blade end than the sensor end. The cutting blade may be configured to cut an opening in the ceiling. At least one retainer protrusion may be disposed on the body between the sensor and the cutting blade. The at least one retainer protrusion may be configured to retain the sensor assembly in the opening of the ceiling.

Abstract: The method for manufacturing an insulated circuit board of the present invention includes: a ceramic/aluminum-joining step of joining an aluminum material to a ceramic substrate and thereby, forming an aluminum layer; a titanium material-disposing step of disposing a titanium material on a surface of the aluminum layer or the aluminum material in a circuit pattern shape; a titanium layer-forming step of performing a heat treatment in a state where the titanium material is laminated on the surface of the aluminum layer or the aluminum material and thereby, forming the titanium layer; and an etching treatment step of etching the aluminum layer on which the titanium layer is formed, into the circuit pattern shape.

Abstract: A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

Abstract: An electric machine having a housing assembly and a stator assembly coupled with a rotor assembly. A plurality of MOSFET assemblies are operably coupled with the stator assembly. The MOSFET assemblies are disposed in openings defined by the housing assembly and include a carrier that is secured within the openings with a press-fit engagement. The carrier defines an interior space extending the full longitudinal length of the carrier and includes at least one planar mounting surface wherein a MOSFET is mounted on the planar mounting surface. In some embodiments, the housing assembly includes an aluminum heat exchange member that defines an opening in which a MOSFET assembly is installed. The carrier may be formed by extruding copper and include longitudinally extending ribs that engage the housing assembly in press fit engagement. A method of manufacturing an electric machine is also disclosed.

Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.

Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.

Abstract: A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.

Abstract: Provided is an inductor winding method and an inductor winding device. The inductor winding method comprises steps of: A. dividing turns of coil of each winding of the inductor into a first winding and a second winding based on a preset ratio; B. winding the first winding on one of multiple magnetic columns, and winding the second winding on another one of the multiple magnetic columns which is different from the magnetic column on which the first winding is wound; and C. performing step A and step B cyclically until all the windings of the inductor are wound. With a coupling inductor having interleaving-wound structure, power frequency magnetic fluxes generated by magnetic lines in magnetic columns counteract one another, thereby solving the problem of high magnetic flux density in a magnetic core while achieving certain leakage inductance.

Abstract: The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

Abstract: A method for the batch production of acoustic wave filters comprises: synthesizing N theoretical filters, each filter defined by a set of j theoretical resonator(s) having a triplet C0ij,eq, ?rij,eq and ?aij,eq, these parameters grouped into subsets; determining a reference resonator structure for each subset, naturally having a resonant frequency ?r,ref, where ?aij,eq<?r,ref<?rij,eq; determining, for each theoretical resonator, an elementary building block comprising an intermediate resonator R?ij, a parallel reactance Xpij and/or a series reactance Xsij, the intermediate resonator R?ij having a triplet C0ij, ?r,ref and ?a,ref, the parameters C0ij, Xpij and/or Xsij defined so the elementary building block has a triplet: C0ij,eq, ?rij,eq and ?aij,eq; determining the geometrical dimensions of the actual resonators Rij of the filters so they have a capacitance C0ij; producing each actual resonator; associating series and/or parallel reactances with actual resonators in order to form the elementary buildin

Abstract: Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged.

Abstract: An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element.

Abstract: A heat-shrinkable tube fitting jig is used to fit a heat-shrinkable tube onto a terminal-attached electric wire formed by crimping a core wire crimp portion of a terminal onto a core wire of an electric wire. The heat-shrinkable tube fitting jig is provided with a first side abutting plate, a second side abutting plate member, and an electric wire holding portion. Columnar bodies and recessed surfaces, which constitute terminal positioning portions, are provided on the upper surface of the first side abutting plate. A first side end face and a second side end face of the heat-shrinkable tube are abutted against mutually opposing surfaces (a first side abutting surface 40S and a second side abutting surface 44S) of the first side abutting plate and the second side abutting plate.

Abstract: A stator manufacturing apparatus is equipped with spindles as twisting and bending jigs, an inner guide having a first supply flow path and a suction flow path formed in the interior thereof, and an outer guide having a second supply flow path formed in the interior thereof. Further, the spindles have receiving members in which insertion recesses are formed. Through holes are formed in the receiving members, and the receiving members are formed with lateral holes therein which allow the interiors of the insertion recesses to communicate with each other.

Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

Abstract: To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off. In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.

Abstract: An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.

Abstract: A method of connecting cables of a unitary pipe section that is to be assembled vertically to an undersea fluid transport pipe, by positioning around a low end of the unitary pipe section (40) a female annular connector (2) having connected thereto cables (14) extending along the unitary pipe section; positioning around a high end of the pipe (42) a male annular connector (24) having connected thereto cables (32) extending along the pipe; and connecting together the male and female connectors by sliding them vertically towards each other while assembling the unitary pipe section on the pipe.