Patents Examined by Kaying Kue
  • Patent number: 10658824
    Abstract: Apparatus and method for extracting the core and surrounding insulator from an outer sheath of a length of data transmission cable is disclosed. The apparatus comprises a pump operable to generate hydraulic pressure against one end of the core and insulator, and a drawing mechanism operable to simultaneously exert a pulling force on an opposite end of the core and insulator. The arrangement being such that hydraulic pressure applied to one end, and pulling force applied to the opposite end, together displace the core and insulator relative to its outer sheath.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: May 19, 2020
    Assignee: DEFLUX HOLDINGS LIMITED
    Inventor: Laslo Nusbaum
  • Patent number: 10649442
    Abstract: A method 500 of operating an automated machine 100 is provided for inserting wires into grommet cavity locations 110 of an electrical connector 112 to compensate for manufacturing tolerances associated with the electrical connector. The method comprises inserting wires into grommet cavity locations of the electrical connector based upon a plug map 300 having offset values to compensate for manufacturing tolerances associated with the electrical connector. The method may further comprise selecting from a plurality of pre-generated plug maps having offset values the closest matching pre-generated plug map for the electrical connector based upon offset values associated with each of the plurality of pre-generated plugs maps. The selected pre-generated plug map having offset values corresponds to the plug map used to insert wires into grommet cavity locations of the electrical connector.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: May 12, 2020
    Assignee: The Boeing Company
    Inventors: Eerik J. Helmick, Bradley J. Mitchell, Nick S. Evans
  • Patent number: 10650978
    Abstract: Some embodiments include an apparatus having horizontally-spaced bottom electrodes supported by a supporting structure. Leaker device material is directly against the bottom electrodes. Insulative material is over the bottom electrodes, and upper electrodes are over the insulative material. Plate material extends across the upper electrodes and couples the upper electrodes to one another. The plate material is directly against the leaker device material. The leaker device material electrically couples the bottom electrodes to the plate material, and may be configured to discharge at least a portion of excess charge from the bottom electrodes to the plate material. Some embodiments include methods of forming apparatuses which include capacitors having bottom electrodes and top electrodes, with the top electrodes being electrically coupled to one another through a conductive plate. Leaker devices are formed to electrically couple the bottom electrodes to the conductive plate.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 12, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Ashonita A. Chavan, Beth R. Cook, Manuj Nahar, Durai Vishak Nirmal Ramaswamy
  • Patent number: 10639091
    Abstract: A jaw member for an electrosurgical instrument is manufactured by providing a jaw housing (18) having a longitudinal jaw section (19), and an electrically conductive plate (1). The electrically conductive plate is placed into a mould, and a first flowable insulating material (15) is injected into the mould such that the flowable material (15) forms one or more stop members (16) that project a predetermined distance from the electrically conductive plate. The jaw housing (18) and the electrically conductive plate (1) are then placed into a second mould, and a second flowable material (25) is injected into the mould to secure the electrically conductive plate (1) to the jaw housing (18).
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: May 5, 2020
    Assignee: GYRUS MEDICAL LIMITED
    Inventor: Lewis Meurig Jones
  • Patent number: 10640290
    Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: May 5, 2020
    Assignee: Mycronic AB
    Inventors: Nils Jacobsson, Roger Jonasson
  • Patent number: 10644470
    Abstract: An apparatus and method for coupling ends of two insulated conductors includes coupling a core of a first insulated conductor to a core of a second insulated conductor. Exposed portions of the cores are located inside a box. Electrically insulating powder material is placed into the box and a force is applied to first and second plungers to compact the powder material. Additional electrically insulating powder material may placed into the box and a subsequent force applied to compact the powder material into compacted powder material that surrounds the exposed portions of the cores. The compacted powder material is formed into a substantially cylindrical shape. A sleeve is placed over the compacted powder material and coupled to the jackets of the insulated conductors.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: May 5, 2020
    Assignee: Salamander Soultions Inc.
    Inventors: Ted Wayne Adcock, Charles D'Angelo, Clive Stephen Varlack
  • Patent number: 10637336
    Abstract: A stator coil forming method includes a bending step of bending portions of a linear lead wire so as to form bent portions; a cutting step of cutting curve parts of the bent portions thus formed, along a perpendicular plane that is approximately perpendicular to an extending direction of the lead wire so as to form coil segments; a U-shape forming step of bending the coil segments in a U-shape; an assembling step of assembling the coil segments to respective slots of a stator core; a tilting step of tilting both distal ends of the coil segments in a circumferential direction of the stator core so that cut surfaces of the distal ends are oriented toward a central-axis direction of the stator core; and a joining step of joining the distal ends of the coil segments adjacent to each other in a radial direction of the stator core.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 28, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Yasuyuki Hirao
  • Patent number: 10631406
    Abstract: A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 21, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Chih-Cheng Lee
  • Patent number: 10602618
    Abstract: A parts mounting system includes: a parts checking section that detects parts information which is identification information applied to the electronic parts and includes a parts code for specifying parts of the electronic parts and a parts maker code for specifying the parts maker and checks the detected parts information with parts information previously registered in a storing part; and a parts data generation section that, when the detected parts information is unregistered parts information in which the parts code is stored in the storing part and the parts maker code of the parts code is not stored in the storing part, generates parts data of the electronic parts relating to the unregistered parts information based on previously registered parts data having the same parts code.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: March 24, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Maenishi, Nobuaki Sakamoto, Shunsuke Higashi, Hiroshi Ando
  • Patent number: 10601207
    Abstract: A method of manufacturing a wire with a terminal includes a crimping process of crimping a crimping terminal on a wire by a terminal crimping apparatus that includes a first mold including a supporting surface supporting the crimping terminal, and a second mold disposed to face the supporting surface and including a recessed wall surface. The recessed wall surface includes a first wall surface and a second wall surface, and a third wall surface curved toward an opposite side of the supporting surface. The first wall surface and the second wall surface include inclined portions and parallel portions. The inclined portions are inclined with respect to the stroke direction so that an interval in the width direction becomes narrower toward the third wall surface. The parallel portions are parallel to the stroke direction.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: March 24, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Masayoshi Takayanagi, Naoki Ito, Keiichiroh Kurashige, Koichi Ikebe
  • Patent number: 10594128
    Abstract: A cover assembly for covering an elongate substrate includes a resilient, elastically expandable sleeve member and a holdout device. The sleeve member defines an axially extending inner sleeve passage. The holdout device includes a generally tubular, flexible bladder sleeve mounted in the inner sleeve passage. The bladder sleeve defines a cavity and a holdout passage to receive the elongate substrate. The cavity is inflated or inflatable with an inflation gas.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: March 17, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Mahmoud K. Seraj
  • Patent number: 10594103
    Abstract: A method is disclosed for moisture tight covering a connection point between an electrical conductor. The method includes exposing the conductor at its end by removing the insulation and subsequently electrically conductively connecting the end of the conductor, from which the insulation has been removed, to the contact element. After the connection point is finished, a foil of insulation material is positioned underneath the connection point, where the foil rests against the insulation of the conductor and at least partially against the contact element. Subsequently, a sealing material capable of hardening is applied from above onto the conductor, wherein the sealing material is flowable during its application and subsequently changes over by hardening into a mechanically stable state which extends beyond the insulation of the conductor and beyond the contact element and is connected tightly to the foil.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: March 17, 2020
    Assignee: NEXANS
    Inventors: Helmut Steinberg, Thomas Noetzel, Udo Mayer
  • Patent number: 10587102
    Abstract: A tool for facilitating the installation of a sealing boot on a cable includes: an arcuate main body having a tapered end, the main body having axially-disposed edges that define a gap therebetween, the main body defining a bore; and a gripping portion attached to an end of the main body opposite the tapered end, the gripping portion extending radially outwardly from the main body.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: March 10, 2020
    Assignee: CommScope Technologies LLC
    Inventor: Joseph J. Baltikas
  • Patent number: 10574014
    Abstract: A method is disclosed of sealing a wire terminal assembly including a conductive cable core connected to a conductive terminal along a conductive connection interface. According to the method, a coating composition is dispensed over the conductive connection interface. The coating composition includes (1) a polymerizable compound with an unsaturated bond, and (2) a free radical photoinitiator. The dispensed coating composition is then subjected to actinic radiation for a duration of less than 0.7 seconds.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 25, 2020
    Assignee: Aptiv Technologies Limited
    Inventors: Robert A. Smith, Gina Sacco, Sean P. Krompegel, Evangelia Rubino, Christopher R. Rudzinskas
  • Patent number: 10574042
    Abstract: A spacer assembly includes first and second clamping bodies. The first clamping body has a first slot therein and the second clamping body has an opening. A fastener is received by the first clamping body slot and the second clamping body opening to secure the first clamping body to the second clamping body such that rotation of the fastener moves the fastener in the first clamping body slot to move the first clamping body relative to the second clamping body.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: February 25, 2020
    Assignee: Hubbell Incorporated
    Inventors: Robert Victor De France, Daniel David Dobrinski
  • Patent number: 10566287
    Abstract: A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 18, 2020
    Assignee: INPHI CORPORATION
    Inventors: Liang Ding, Radhakrishnan L. Nagarajan
  • Patent number: 10568248
    Abstract: In a suction nozzle held on a mounting head of a component mounting machine, a nozzle section that sucks a component is swingably provided on a nozzle holder section of the suction nozzle, and an orientation of the nozzle section is changed by 90° to a downward orientation or a lateral orientation by swinging the nozzle section. The component is sucked by the nozzle section from above in a state in which the orientation of the nozzle section of the suction nozzle is downward in a component suction operation, and the component is mounted on an object such as a circuit board in a state in which the orientation of the component sucked by the nozzle section is set to the lateral orientation by the nozzle section the orientation of which is changed by 90° to the lateral orientation by swinging the nozzle section in the component mounting operation.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: February 18, 2020
    Assignee: FUJI CORPORATION
    Inventor: Futoshi Matsuda
  • Patent number: 10561048
    Abstract: A layer of the mixture that contains polymer and conductive particles is applied over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: February 11, 2020
    Assignee: CONDALIGN AS
    Inventors: Eldrid Svasand, Mark Buchanan, Matti Knaapila, Geir Helgesen
  • Patent number: 10553557
    Abstract: In an embodiment, an electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact layer protruding from a first side face of the dielectric core layer. The contact layer includes an electrically insulating layer and at least one contact pad arranged on the electrically insulating layer. The at least one contact pad is electrically coupled with the power semiconductor device.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: February 4, 2020
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Marcus Pawley, Andrew Roberts, Robert Clarke
  • Patent number: 10554005
    Abstract: A device for joining the end (3a) of a shielded coaxial cable (3) and a metal connector (10), the cable including a peripheral metal braid (4) and an axial conductor (2), and including a conductive overmoulding (5) that at least partially surrounds the end of the shielded cable (3) and one end of the connector (10), the overmoulding making contact with the metal braid (4) and the connector (10), so as to ensure the continuity of the electromagnetic shielding of the connection. A method for producing such a connection is also described.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: February 4, 2020
    Assignee: GETELEC
    Inventor: Francois Dusailly