Abstract: An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.

Abstract: A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A method for joining quartz pieces using metallic aluminum as the joining element. The aluminum may be placed between two quartz pieces and the assembly may be heated in the range of 500 C to 650 C. The joining atmosphere may be non-oxygenated. A method for the joining of quartz pieces which may include barrier layers on the quartz pieces. The barrier layers may be impervious to aluminum diffusion and may be of a metal oxide or metal nitride. The quartz pieces with the barrier layers may then be joined at temperatures higher than 650 C and less than 1200 C. A device such as an RF antenna or electrode in support of semiconductor processing using joined quartz pieces wherein the aluminum joining layer which has joined the pieces and also functions as antenna electrode.

Abstract: A method of manufacturing metal matrix composite (MMC) parts, including the steps of applying a metallic sheath around a bundle of MMC laminates, heating the bundle of MMC laminates in the metallic sheath at a curing or fusing temperature to consolidate the bundle of MMC laminates into a single cured or fused part, and then cooling the cured or fused part. The bundle of MMC laminates may be formed by removing surface contamination from the dry reinforcement fibers, creating a plurality of individual MMC laminates by plating dry reinforcement fibers with electroless nickel, and/or electrodeposited nickel or cobalt, and stacking each of the plurality of individual MMC laminates into a bundle. Autocatalytic and/or electroplating may be used as the primary means to incorporate fiber reinforcement into the metal matrix composite by covering and bonding fiber reinforcement into MMC laminates/plies and/or 3-D woven parts.

Abstract: A system for assembling vehicle body components includes an index table rotatably installed on a mounting frame, assembly units disposed on an upper surface of the index table in four directions by rotary plates, and each including a replacement jig and a fixing jig, the replacement jig and the fixing jig being configured to allow the first and second components to be loaded thereon, and the assembly units being configured to be rotated by a predetermined angle by the index table so that the first and second components are joined together by welding while passing through a plurality of assembly sections, a replacement jig palette positioned in a first assembly section, a component palette positioned in a second assembly section, a plurality of clamping units positioned in a third assembly section, and welders positioned in the third assembly section and the fourth assembly section.

Abstract: A wire billet butt-welding apparatus and a wire billet butt-welding method, the method including: S1: preparing a stock, S2: rotating a butt-welding stock receiver to a stock receiving position, and feeding a first coil of wire billet to a stock receiving rod of the butt-welding stock receiver; S3: welding the first coil of wire billet and the second coil of wire billet on a rotary plate at the butt-welding position end-to-head; S4: rotating the butt-welding stock receiver and the second coil of wire billet to the stock receiving position; S5: rotating the stock receiving rod to rotate to tighten the wire billet between the first coil of wire billet and the second coil of wire billet; and S6: repeating steps S3 to S5 to complete butt-welding operations on the 3rd to nth coils of wire billet sequentially.

Abstract: An apparatus for debonding a wafer from a bonded wafer stack is disclosed. The apparatus includes a flashlamp, a flashlamp control unit, and a wafer debonding unit. A processed wafer can be debonded from a bonded wafer stack by applying light pulses from the flashlamp. The flashlamp is controlled by the flashlamp control unit that includes a capacitor bank, a power supply for charging the capacitor bank, an IGBT-based switching device, and a frequency controller. The wafer debonding unit includes a debonding vacuum table, a wafer feeding robot for conveying the bonded wafer stack to the debonding vacuum table, a set of suction cups for applying vacuum to the bonded wafer stack when light pulses are being emitted by the flashlamp to debond the processed wafer from the bonded wafer stack.

Abstract: A robotic wire termination system for efficiently and accurately connecting a plurality of wires to an electrical connector having a plurality of connector pins with corresponding wire receptacles. The system generally includes a housing, a removable alignment plate, a robotic positioner, a heating device, a touch responsive display, and a control unit. The alignment plate removably holds a selected electrical connector in a specific position and orientation with the connector pins exposed in the housing and the wire receptacles exposed outside. The display provides a visual representation of the connector pins and selections of the connector pins. The control unit receives inputs indicating the pin selections and controls the robotic positioner to sequentially move the heating device along three orthogonal longitudinal axes to a series of heating positions relative to the selected connector pins to provide heat for melting solder to connect wires to the wire receptacles.

Abstract: According to one embodiment, a processing system includes a processing device. The processing device performs at least a first determination of determining whether or not a detector contacts a welding object. The detector includes a plurality of detection elements arranged in a first direction. The detector transmits an ultrasonic wave toward the welding object and detects a reflected wave. The first determination is based on a detection result when the reflected wave is detected by the detector.

Abstract: An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.

Abstract: A flange connection has two flanges and a weld ring gasket arranged between the flanges, wherein the weld ring gasket has two weld ring halves arranged one on top of the other, each having a base section and a lip arranged on it, wherein the weld ring halves are welded to the base section by way of a fillet weld with the flange that lies against it, and wherein the lips form a torus-shaped connection section having a hollow interior, and the weld ring halves are welded to one another at the torus-shaped connection section, by way of a caulking seam. The torus-shaped connection section is arranged to lie radially on the inside.

Abstract: A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.

Abstract: Disclosed is an iron-based amorphous alloy FeaBbSicREd, wherein a, b, and c represent, in atomic percentages, the contents of corresponding components, respectively; 83.0?a?87.0, 11.0<b<15.0, 2.0?c?4.0, and a+b+c=100; and d is the concentration of RE in the iron-based amorphous alloy, i.e. 10 ppm?d?30 ppm. The iron-based amorphous alloy has a saturation magnetic induction intensity of no less than 1.63 T, and same can be used to manufacture a magnetic core material for power transformers, motors and inverters.

Abstract: The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.

Abstract: A device to determine a state of an ultrasound welding process, which can be carried out using an ultrasound tool, includes a sensor element and an evaluation unit. The sensor element is configured to detect an electrical control signal from an ultrasound tool. The evaluation unit is configured to determine a signal property of the control signal and to determine the status of the ultrasound welding process based on a reference signal profile and on the determined signal property. An assembly with an ultrasound welding system and a method are also included.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

Abstract: A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.

Abstract: Moving unit for moving two soldering assemblies connected by a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.

Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.