Patents Examined by Kiley S. Stoner
  • Patent number: 10443958
    Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: October 15, 2019
    Assignee: Raytheon Company
    Inventors: Michael L. Andersen, Travis L. Mayberry, Gregory P. Schaefer
  • Patent number: 10442030
    Abstract: Described are tools useful to produce a friction stir weld, methods of forming a friction stir weld, and assemblies such as electronic devices that include a friction stir weld.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: October 15, 2019
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Samuel Edward Severson, Jeffrey L. Bruce, Jerome Thomas Coffey
  • Patent number: 10442029
    Abstract: The method of friction stir spot welding uses a database of stored optimization parameters to maximize welding strength for an input type of material and an input geometrical parameter of the material, such as its thickness. Experiments are performed for a variety of different materials having different thicknesses. Each experiment performed for each material and each thickness associated with the material measures the welding strength of a friction stir spot welding process for varying values of an initial dynamic welding parameter, a final dynamic welding parameter and a type of varying function. The values of the initial dynamic welding parameter, final dynamic welding parameter and type of varying function that maximize the measured welding strength for the selected material and its selected thickness are stored in a lookup table. A rotating tool may then be controlled using these optimized values in order to maximize welding strength.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: October 15, 2019
    Assignee: King Saud University
    Inventors: Ali Mohamad Ali Alsamhan, Ahmed Nageeb Ahmed Badwelan
  • Patent number: 10435330
    Abstract: A method for producing a connection between two surfaces or surface sections of two ceramic parts comprises: provision of a first ceramic part and of a second ceramic part; provision of an active brazing solder material on at least one surface section of at least one of the ceramic parts; and heating the active brazing solder in a vacuum brazing process. The whole active brazing solder material is provided for connecting the first and the second ceramic part by a sputtering method, wherein at least one surface section of at least one of the ceramic parts, preferably of the two ceramic parts, is layered with a layer sequence of individual components of the active brazing solder material, wherein the average strength of the layers of an individual component of the active brazing solder is no more than 0.5%, in particular not more than 0.2%, preferably not more than 0.1% and especially preferably not more than 0.05% of the strength of the joining region.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: October 8, 2019
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Ulfert Drewes, Nils Ponath, Andreas Rossberg, Anh Tuan Tham
  • Patent number: 10433824
    Abstract: A tubular body for a medical device for insertion within a body passageway of a patient. The tubular body includes a tubular inner liner. A braided member is disposed along an outer surface of the liner. The braided member includes intersecting filaments and cells defined by the filaments. A securement mechanism, such as radiopaque solder, is disposed along a circumferential region of the braided member. The securement mechanism is attached to portions of the filaments and spans the cells that correspond to the circumferential region to inhibit relative movement of filament ends. An outer surface of the securement mechanism is sized to extend radially outward to a position up to an outer surface of the braided member to not add to the overall wall thickness of the tubular body. An outer jacket is positioned longitudinally around the braided member and connected to the inner liner.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: October 8, 2019
    Assignee: COOK MEDICAL TECHNOLOGIES LLC
    Inventors: Mahendran Ravichandran, Kurt J. Tekulve, Michael D. Deckard, Michelle Reynolds
  • Patent number: 10434265
    Abstract: A medical hollow needle assembly includes an outer cylindrical body including a through-hole; a hollow needle having an outer peripheral surface, wherein a proximal portion of the hollow needle is disposed in the through-hole of the outer cylindrical body, and wherein the outer peripheral surface of the hollow needle has an outer reduced-diameter surface that has a smaller outer diameter than that of a more proximal portion of the outer peripheral surface of the hollow needle; and an inner cylindrical body including an insertion hole in which the hollow needle is disposed, wherein the inner cylindrical body is disposed between the hollow needle and an inner peripheral surface of the through-hole of the outer cylindrical body, and wherein the inner cylindrical body joins the outer cylindrical body and the hollow needle.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: October 8, 2019
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventors: Tetsuya Ooyauchi, Kenta Gotou, Yukio Imai, Hidenori Fujiwara, Madoka Horie, Hideo Kawamoto, Ayumi Kumagai
  • Patent number: 10436192
    Abstract: A sliding component and its producing method are provided. The sliding component includes a base section made of steel or cast iron, and a sliding section having a sliding surface, made of copper alloy including hard particles, and joined to the base section. The hard particles in the sliding section are arranged such that those in a region including an outer periphery of the interface with the base section have their longitudinal directions coinciding with the directions along the outer periphery as compared to those in an inner peripheral side. This improves the durability of the sliding section in its region including the outer periphery of the interface with the base section.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: October 8, 2019
    Assignee: KOMATSU LTD.
    Inventors: Toshikazu Matsuyama, Masaharu Amano, Yoshitaka Shibata
  • Patent number: 10426025
    Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: September 24, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Mueller, Michael Niedermayer, Ulrich Wittreich
  • Patent number: 10424688
    Abstract: Provided is a wire transfer apparatus of a tabbing apparatus. A wire transfer apparatus of a tabbing apparatus according to the present invention includes: a first transfer gripper unit configured to grip a wire; a second transfer gripper unit disposed in parallel to the first transfer gripper unit and configured to grip the wire at a location spaced apart from the first transfer gripper unit together with the first transfer gripper unit; and a gripper transfer unit configured to transfer the wire while moving the first transfer gripper unit and the second transfer gripper unit.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: September 24, 2019
    Assignee: ZEUS CO., LTD.
    Inventors: Young Ik Park, Jin Woo Park, Dong Jin Chung
  • Patent number: 10413992
    Abstract: A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: September 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Ishino, Yoshihiro Kawaguchi, Kosuke Nakano, Hidekiyo Takaoka, Wataru Yanase
  • Patent number: 10406774
    Abstract: An exemplary method of bonding of silicon carbide and objects having a hermetic silicon carbide-iridium-silicon carbide bond. The method includes the steps of inserting an iridium foil between two SiC layers; heating the iridium foil and SiC layers at a temperature of 1500 C in a vacuum of <10?5 ton; applying a pressure between 1 ksi and 7 ksi to the iridium foil and SiC layers; maintaining the temperature and pressure for 6-10 hours; and forming a hermetic seal having a leak rate <3×10?9 cm3/sec between the iridium foil and the two SiC layers. The SiC-iridium bonds lack cracks and are hermetic.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: September 10, 2019
    Assignee: U.S. Department of Energy
    Inventor: Brian V. Cockeram
  • Patent number: 10406629
    Abstract: To provide a method for joining metal members, in which joining can be performed at relatively lower temperature, and deformation caused when joining the metal members can be reduced. The present invention includes a step of joining a plurality of metal members with a sheet sandwiched between the joining surfaces of the plurality of metal members, wherein the sheet is obtained by forming an organic acid metal salt film on the surface of a metal sheet; wherein aluminum or an aluminum alloy is used as the metal members, and a sheet made of any one of zinc, copper and magnesium is used as the metal sheet.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: September 10, 2019
    Assignee: NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
    Inventors: Shinji Koyama, Xiaojuan Ma, Tatsunori Tsunetou, Tsukasa Akiyama, Yohei Tomikawa
  • Patent number: 10406628
    Abstract: The invention relates to a device for welding rod-shaped electrical conductors (28, 29) provided with an outer insulating sheath (30), the device comprising a compression space (18) for receiving connecting regions of the conductors to be connected to each other, said compression space comprising at least one guiding element (41, 42) for axially positioning the conductors.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: September 10, 2019
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Heiko Strobel, Peter Wagner, Dieter Stroh
  • Patent number: 10391572
    Abstract: The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: August 27, 2019
    Assignee: SEMIKRON ELEKTRONIK GbmH & CO. KG
    Inventors: Jörg Ammon, Harald Kobolla
  • Patent number: 10391589
    Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 27, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Patent number: 10384312
    Abstract: The present invention relates to an aluminum alloy brazing sheet with a thickness of 0.30 nm or less, including: a core material; a sacrificial material cladding one surface of the core material; and a brazing material cladding the other surface of the core material, in which the core material is made of A1—Mn—Si-based aluminum alloy containing by mass %, Cu: 0.5 to 1.3%, the sacrificial material is made of aluminum alloy containing, by mass %, Zn: 4.0 to 7.0%, the brazing material is made of aluminum alloy containing, by mass %, Si: 6.0 to 11.0% and Zn: 0.1 to 3.0%, in a pitting potential after brazing beat treatment, a thickness of a region in which a potential difference from the noblest potential in the core material is 100 mV or more is 10% to 50% of the thickness of the brazing sheet.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: August 20, 2019
    Assignee: Mitsubishi Aluminum Co., Ltd.
    Inventors: Sho Ishigami, Shohei Iwao
  • Patent number: 10390440
    Abstract: In a die-substrate assembly, a copper inter-component joint is formed by bonding corresponding copper interconnect structures together directly, without using solder. The copper interconnect structures have distal layers of (111) crystalline copper that enable them to bond together at a relatively low temperature (e.g., below 300° C.) compared to the relatively high melting point (about 1085° C.) for the bulk copper of the rest of the interconnect structures. By avoiding the use of solder, the resulting inter-component joint will not suffer from the adverse IMC/EM effects of conventional, solder-based joints. The distal surfaces of the interconnect structures may be curved (e.g., one concave and the other convex) to facilitate mating the two structures and improve the reliability of the physical contact between the two interconnect structures. The bonding may be achieved using directed microwave radiation and microwave-sensitive flux, instead of uniform heating.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 20, 2019
    Assignee: NXP B.V.
    Inventors: Tsung Nan Lo, Chung Hsiung Ho
  • Patent number: 10384314
    Abstract: A metal particle having a particle diameter of 10 ?m or more and 1000 ?m or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: August 20, 2019
    Assignee: HITACHI METALS, LTD.
    Inventor: Motoki Wakano
  • Patent number: 10384302
    Abstract: A workpiece for use with a flash producing welding process comprises a revolute body, a plurality of first attachment portions, a plurality of second attachment portions. The revolute body has an axis of rotation. Each of the first attachment portions has a first radially outer weld joint surface, and each of the second attachment portions has a second radially outer weld joint surface. The revolute body comprises a plurality of first and second stub portions, with each of the first stub portions having a first radially inner weld joint surface, and each of the second stub portions having a second radially inner weld joint surface.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: August 20, 2019
    Assignee: ROLLS-ROYCE plc
    Inventor: Richard N. March
  • Patent number: 10385469
    Abstract: A thermal stress compensation layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity disposed between a pair of bonding layers. The thermal stress compensation layer has a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the MIO layer can be transient liquid phase bonded between a metal substrate and a semiconductor device. The pair of bonding layers may comprise a first pair of bonding layers and a second pair of bonding layers with the first pair of bonding layers disposed between the MIO layer and the second pair of bonding layers. The first pair of bonding layers may have a melting point above the TLP sintering temperature and the second pair of bonding layers may have a melting point below the TLP sintering temperature.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: August 20, 2019
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede