Patents Examined by Kiley S. Stoner
  • Patent number: 11980963
    Abstract: An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: May 14, 2024
    Inventors: Frank Gassert, Stefan Müller, Rainer Wagenbach, Waldemar Werner, Daniel Günther, Dariusz Kosecki, Stephan Becker, Eugen Koch
  • Patent number: 11980975
    Abstract: According to one embodiment, a processing system includes a processing device. The processing device performs at least a first determination of determining whether or not a detector contacts a welding object. The detector includes a plurality of detection elements arranged in a first direction. The detector transmits an ultrasonic wave toward the welding object and detects a reflected wave. The first determination is based on a detection result when the reflected wave is detected by the detector.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: May 14, 2024
    Inventors: Masahiro Saito, Hiromasa Takahashi
  • Patent number: 11976754
    Abstract: A flange connection has two flanges and a weld ring gasket arranged between the flanges, wherein the weld ring gasket has two weld ring halves arranged one on top of the other, each having a base section and a lip arranged on it, wherein the weld ring halves are welded to the base section by way of a fillet weld with the flange that lies against it, and wherein the lips form a torus-shaped connection section having a hollow interior, and the weld ring halves are welded to one another at the torus-shaped connection section, by way of a caulking seam. The torus-shaped connection section is arranged to lie radially on the inside.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: May 7, 2024
    Assignee: KLINGER Kempchen GmbH
    Inventors: Torsten Bial, Clemens Seifert
  • Patent number: 11975411
    Abstract: A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 7, 2024
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Patent number: 11973054
    Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: April 30, 2024
    Assignee: Stroke Precision Advanced Engineering Co., Ltd.
    Inventors: Yu-Min Huang, Sheng Che Huang, Chingju Lin, Wei-Hao Wang
  • Patent number: 11969829
    Abstract: The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.
    Type: Grant
    Filed: September 13, 2023
    Date of Patent: April 30, 2024
    Inventors: Fuke Qin, Qin Pan
  • Patent number: 11970761
    Abstract: Disclosed is an iron-based amorphous alloy FeaBbSicREd, wherein a, b, and c represent, in atomic percentages, the contents of corresponding components, respectively; 83.0?a?87.0, 11.0<b<15.0, 2.0?c?4.0, and a+b+c=100; and d is the concentration of RE in the iron-based amorphous alloy, i.e. 10 ppm?d?30 ppm. The iron-based amorphous alloy has a saturation magnetic induction intensity of no less than 1.63 T, and same can be used to manufacture a magnetic core material for power transformers, motors and inverters.
    Type: Grant
    Filed: February 11, 2018
    Date of Patent: April 30, 2024
    Inventors: Dong Yang, Qinghua Li, Jing Pang
  • Patent number: 11969817
    Abstract: A device to determine a state of an ultrasound welding process, which can be carried out using an ultrasound tool, includes a sensor element and an evaluation unit. The sensor element is configured to detect an electrical control signal from an ultrasound tool. The evaluation unit is configured to determine a signal property of the control signal and to determine the status of the ultrasound welding process based on a reference signal profile and on the determined signal property. An assembly with an ultrasound welding system and a method are also included.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: April 30, 2024
    Inventors: Felix Klimas, Thomas Herzing, Lutz Lehmann, Daniel Zemann, Gabriel Ertz, Jens Twiefel, Joerg Wallaschek, Michael Weinstein
  • Patent number: 11964915
    Abstract: A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 23, 2024
    Inventors: Tien-Heng Huang, Yu-Han Wu, Kuo-Chuang Chiu
  • Patent number: 11964345
    Abstract: Moving unit for moving two soldering assemblies connected by a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: April 23, 2024
    Assignee: ERSA GmbH
    Inventor: Markus Sendelbach
  • Patent number: 11951672
    Abstract: Methods of manufacturing multi-material fibers having one or more electrically-connectable devices disposed therein are described. In certain instances, the methods include the steps of: positioning the electrically-connectable device(s) within a corresponding pocket provided in a preform material; positioning a first electrical conductor longitudinally within a first conduit provided in the preform material; and drawing the multi-material fiber by causing the preform material to flow, such that the first electrical conductor extends within the multi-material fiber along a longitudinal axis thereof and makes an electrical contact with a first electrode located on each electrically-connectable device. A metallurgical bond may be formed between the first electrical conductor and the first electrode while drawing the multi-material fiber and/or, after drawing the multi-material fiber, the first electrical conductor may be located substantially along a neutral axis of the multi-material fiber.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 9, 2024
    Assignees: Advanced Functional Fabrics of America, Inc., Massachusetts Institute of Technology
    Inventors: Chia-Chun Chung, Jason Cox, Kristina McCarthy, Kristen Mulherin, Jimmy Nguyen, Michael Rein, Matthew Bernasconi, Lauren Cantley, Lalitha Parameswaran, Michael Rickley, Alexander Stolyarov
  • Patent number: 11951556
    Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 9, 2024
    Inventor: Ting-Jui Wang
  • Patent number: 11955850
    Abstract: The cold pressure welding apparatus includes a first holding part capable of sandwiching a first flat conductor, a second holding part disposed opposite to the first holding part and capable of sandwiching a second flat conductor, and a drive part for moving the first holding part and the second holding part. The drive part can move the first holding part and the second holding part between a first direction separated position and a close position along a first direction. The drive part can move the first holding part and the second holding part between a second direction separated position and a sandwiching position along a second direction.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 9, 2024
    Assignee: Aster Co., Ltd.
    Inventor: Takenobu Hongo
  • Patent number: 11951557
    Abstract: A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 9, 2024
    Assignee: General Electric Company
    Inventors: Ethan Conrad Schaeffer, James Scott Flanagan, James J. Murray, III, Archie L Swanner, Jr., Logan Tyler Nelson
  • Patent number: 11949033
    Abstract: Embodiments of the present disclosure provide a method for welding cell strings and a series welding machine. The method includes: forming an arrangement of a plurality of solar cells; inspecting the arrangement of the plurality of solar cells; providing a plurality of initial welding strips including first initial welding strips and second initial welding strips, the first initial welding strips interleave with the second initial welding strips in a first direction; cutting each of the first initial welding strips at first cutting positions, and cutting each of the second initial welding strips at second cutting positions, to obtain a plurality of welding strips; moving each welding strip in a second direction to form a set of welding strips; transferring the set of welding strips onto the arrangement of the plurality of solar cells; and welding the plurality of welding strips to corresponding solar cells to form a cell string.
    Type: Grant
    Filed: October 27, 2023
    Date of Patent: April 2, 2024
    Inventors: Hao Jin, Dongdong Sun, Niannian Qin, Jingguo Yang, Luchuang Wang, Wusong Tao
  • Patent number: 11945052
    Abstract: The present invention provides a brazing material application method that can stably discharge a brazing material containing a fluoride-based flux over a long period of time. The brazing material application method of the present invention includes: a supply step of supplying a liquid brazing material containing a fluoride-based flux to a liquid chamber of a discharge apparatus that is configured to have the liquid chamber having a discharge channel, a plunger disposed in the liquid chamber movably forward and backward, and a drive device for moving the plunger forward and backward and to satisfy a predetermined relationship; and an application step of discharging the brazing material in the liquid chamber from the discharge channel by moving the plunger toward the discharge channel of the liquid chamber by the drive device, and applying the brazing material to a metal member.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: April 2, 2024
    Inventors: Aoi Tazuru, Satoshi Moriya, Daigo Kiga, Tomoaki Akazawa
  • Patent number: 11945054
    Abstract: A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: April 2, 2024
    Inventors: Karsten Schmidt, Andreas Meyer, Stefan Britting
  • Patent number: 11937979
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer body, wherein at least a portion of a surface of the transducer body includes a processed area. The processed area has a changed condition at the surface of the transducer body.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: March 26, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dominick Albert DeAngelis, Gary Walter Schulze
  • Patent number: 11935864
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • Patent number: 11929265
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yusuke Yadani