Patents Examined by Kiley S. Stoner
  • Patent number: 11937979
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer body, wherein at least a portion of a surface of the transducer body includes a processed area. The processed area has a changed condition at the surface of the transducer body.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: March 26, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dominick Albert DeAngelis, Gary Walter Schulze
  • Patent number: 11935864
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • Patent number: 11929265
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yusuke Yadani
  • Patent number: 11920701
    Abstract: The invention relates to a method for producing a number of pipes (100) with a predetermined pipe diameter. The method includes feeding multiple pipe parts (101, 102) with the predetermined pipe diameter to a welding station (53), aligning in each case a first pipe part (101) and a second pipe part (102) coaxially with respect to one another and axially adjacent to one another, welding the pipe parts (101, 102) by means of a fully encircling weld seam (109) to form a pipe run (104), conveying the pipe run (104) to a cutting station (57) in a machine direction (A) downstream of the welding station (53), and cutting off the number of pipes (100) in a respectively designated length from the pipe run (104).
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 5, 2024
    Assignee: Minimax Viking Research & Development GmbH
    Inventors: Andreas Rönpagel, Jan Ehlers, Jendrik Schütt, Hanjo Diederley, Kai Zeugner
  • Patent number: 11904414
    Abstract: Apparatus for controlling a welding station used for welding seams extending along cylindrical can bodies, the welding station comprising a pair of welding rolls and a calibration unit for causing a desired cylinder overlap during welding. The calibration unit is adjustable along at least three different adjustment axes. The apparatus comprises: a weld monitor configured to monitor welded seams and provide an electrical signal indicative of weld thickness at a series of predetermined points along the seam length; a controller configured to receive said signal and to generate one or more control signals; and adjustment mechanisms for coupling to the calibration unit, or forming part of the calibration unit. The adjustment mechanisms are configured to receive the signal(s) and to be responsive thereto to adjust the calibration unit relative to one or more of said three adjustment axes, to provide the desired cylinder overlap and/or a desired weld quality.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: February 20, 2024
    Assignee: Crown Packaging Technology, Inc.
    Inventors: Joao Fernando Fanico Martins, Mark David Sollis, Stephen Robert Arnell
  • Patent number: 11910533
    Abstract: The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: February 20, 2024
    Assignee: PRAGMATIC PRINTING LTD.
    Inventors: Neil Davies, Stephen Devenport, Richard Price
  • Patent number: 11897057
    Abstract: A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: February 13, 2024
    Assignee: APEX BRANDS, INC.
    Inventors: Gert Mittmann, Bernhard Eigen, Michael Mohl, Ralf Zerweck, Dirk Schonau
  • Patent number: 11887766
    Abstract: A component includes a magnetic core having a body formed of a first material, defining a first opening and a second opening thereon. A duct formed of a second material extends at least partially through the body between the first opening and the second opening. The first opening and the second opening are in fluid communication by way of the duct.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: January 30, 2024
    Assignee: GE Aviation Systems LLC
    Inventors: Ramanujam Ramabhadran, Ruxi Wang, Juan Manuel Rivas Davila, Jiale Xu
  • Patent number: 11883907
    Abstract: Devices, systems, and methods are directed to automated techniques for fitting flanges to tubular sections used to form tubular structures, such as large-scale structures used in industrial applications (e.g., wind towers and pipelines). As compared to manual techniques for fitting flanges to tubular sections, the devices, systems, and methods of the present disclosure facilitate faster attachment of flanges, which may be useful for achieving cost-effective throughput. By way of further comparison to manual techniques, the devices, systems, and methods of the present disclosure may, further or instead, facilitate achieving tighter dimensional tolerances. In turn, such tighter dimensional tolerances may be useful for forming thinner-walled, lighter, and lower cost tubular structures. Still further or in the alternative, automated techniques for fitting flanges to tubular sections may facilitate attachment of multipiece flanges or other non-traditional flange geometries.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: January 30, 2024
    Assignee: KEYSTONE TOWER SYSTEMS, INC.
    Inventors: Rosalind K. Takata, Loren Daniel Bridgers, Eric D. Smith, Eric Rubio
  • Patent number: 11872652
    Abstract: In one embodiment, sheathed thermite rods are provided. For instance, a sheathed thermite rod may comprise a mixture of thermite within an outer casing, such as an aluminum tube, that adds rigidity and allows for better continuity of a burn across breaks in the thermite rod. The sheathing also allows for manufacture of the thermite rods to have reduced drying period, increasing speed of production. In another embodiment, tablet-based thermite rods are provided. A thermite tablet rod herein may comprise a series of inline thermite tablets contained within an outer casing. The tablets may be consecutively adjacent to one another along the length of the outer casing, and substantially conforming to the interior cross section of the outer casing, where the tablets are adjoined by pressure, an adhesive, and/or a burn continuance material.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: January 16, 2024
    Assignee: ADVANCED DEFENSE COMPONENTS INC
    Inventors: Jeremy Keith Moore, James M. Behmke
  • Patent number: 11872650
    Abstract: Methods and systems for providing a cold plate assembly include providing a base and a cover. The cover can be fixedly coupled to the base. Each of the base and the cover can include spaced internal ribs, which can form flow paths when the base and cover are fixedly coupled together. The internal ribs of the base and the cover can have spaced tabs that can be fixedly coupled to the other of the base or the cover. The base and the cover may also include spaced external or outer sacrificial ribs.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: January 16, 2024
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: David James Munn, Leon E. Benjamin
  • Patent number: 11872651
    Abstract: A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface (1) to be bonded, at which the one member and the insert material are in contact with one another, and an interface (2) to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface (1) to be bonded and the interface (2) to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure (1) is applied substantially perpendicular to the interface (1) to be bonded; a bonding pressure (2) is applied substantially perpendicular to the interface (2) to be bonded; and the bonding pressure (1) and the bonding pressure (2) are set to different values.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 16, 2024
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masayoshi Kamai
  • Patent number: 11872663
    Abstract: A repair welding method according to at least one embodiment is for a member in which a first end and a second end of a parent material are connected by welding and includes: a step of removing a portion including at least a part of a first heat-affected zone of an existing welded portion of the member; and a step of performing repair welding after removing the portion. In a cross-section including the parent material and the existing welded portion, all intersection portions between the first heat-affected zone of the existing welded portion and a second heat-affected zone due to the repair welding have an intersection angle between the first heat-affected zone and the second heat-affected zone of 70° to 110°.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: January 16, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masaki Honda, Toshiaki Nishio, Nobuyoshi Komai, Takumi Tokiyoshi, Masaaki Fujita, Kimihiko Tominaga, Hiroyuki Ohyama, Fumitoshi Sakata, Koichi Teshima, Eiji Murakami, Akinori Yamaguchi, Fumio Nishi
  • Patent number: 11869792
    Abstract: An alignment mechanism of a bonding machine includes a support pedestal, three first alignment members, and three second alignment members. The support pedestal includes a supporting surface having a placement area for supporting a first substrate, and the first and second alignment members are arranged around the placement area. The first alignment members each include a protruding part and a base. The protruding part is used in supporting a second substrate, and protrudes from the base and directed to the placement area. The base is used to position the first substrate. The second alignment members position the second substrate to align the first and second substrates and facilitate the bonding of the first and second substrates.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: January 9, 2024
    Assignee: SKY TECH INC.
    Inventor: Jing-Cheng Lin
  • Patent number: 11865633
    Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: January 9, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, Wei Qin, D. Matthew Odhner
  • Patent number: 11865645
    Abstract: A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: January 9, 2024
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Yuta Saito
  • Patent number: 11862482
    Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Hao Huang, Chun-Yi Chen, I-Shi Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
  • Patent number: 11858062
    Abstract: A multi-position clamp is disclosed for positioning and holding a portable friction welding tool adjacent a substrate for friction welding a plurality of fixtures in a precise pattern referenced from a fixed position on a substrate. The clamp has a clamp base temporarily securable at the fixed position on the substrate, a traveling mount comprising a tool mount for receiving said portable friction welding tool, and a connection to the clamp base allowing relative movement of the tool mount over the substrate. Index stops help install the plurality of fixtures in the pattern and an articulated fixture loading system allow positioning and loading successive fixtures without disengaging and removing said portable friction welding tool from connection with the clamp base.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: January 2, 2024
    Assignee: Fusematic Corporation
    Inventors: Harvey Lau, Francis Baumann, John M. Griffin, Richard Jackson, Nicole Medina, Mark Andrew Smith
  • Patent number: 11850676
    Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: December 26, 2023
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Theodore J. Copperthite, Richard J. McCartney, Jr., Omid Niayesh
  • Patent number: 11850683
    Abstract: A flux tool allows the elastic pad to pressurize each flux pin individually in a process of dotting flux, so that even though a wafer or die may be deformed, high-quality flux dotting is achieved. Specifically, the flux tool allows the elastic pad pressurizing the flux pins to be made of rubber, especially silicone, so that primarily, the flux pins are entirely pressurized uniformly by means of the elastic force of the elastic pad, and secondarily, each flux pin is individually pressurized against the underside of the elastic pad, thereby adjusting the heights of the flux pins upon flux dotting according to the flatness or bent shape of the wafer or die to minimize the flux dotting defects.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: December 26, 2023
    Assignee: S.S.P. INC.
    Inventor: Kyouho Lee