Abstract: A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 ?m and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H1<H2 is established.

Abstract: Device (1) for displacing at least one assembly (2, 2?) between a provisioning zone (3) and a working zone (4) of at least one process chamber (5) of a process chamber apparatus (6) for soldering, in particular for reflow soldering, comprising at least one displacement device (7), wherein the at least one assembly (2, 2?) carries out, at least in sections, a displacement movement (9), or such a displacement movement (9) can be carried out, such that the at least one assembly (2, 2?) is displaced by means of a force (8), in particular pushing force, which is transmitted or generated by the displacement device (7), in particular directly, and acts on the assembly (2, 2?).

Abstract: A friction stir additive manufacturing device configured to join a first work-piece and a second work-piece is provided. In one aspect, the device includes a rotating spindle configured to deposit a filler material over a weld line as the device is advanced along an interface between the first work-piece and the second work-piece. The device also includes a deposition head configured to receive at least a portion of the spindle, the deposition head configured to remain stationary relative to the rotating spindle. The deposition head includes a first semi-cylindrical portion having an inner radius and an outer radius relative to a first axis, and a second semi-cylindrical portion having an inner radius and an outer radius relative to a second axis that is perpendicular to the first axis. The second semi-cylindrical portion can include a chamfered inner surface configured to define a weld profile.

Abstract: The objective of the present invention is to provide a friction pressure welding method with which the welding temperature can be controlled accurately, the welding temperature can be lowered, and the distribution of the welding temperature at an interface to be welded can be made uniform; and to provide a welded structure obtained by this method. The present invention relates to the friction pressure welding method in which one member is abutted against another member and is made to slide in a state in which a welding pressure substantially perpendicular to the interface to be welded is applied, said friction pressure welding method being characterized in that the maximum sliding speed is no greater than 53 mm/sec, the difference in the temperature increase rate between a center portion and an outer peripheral portion at the interface to be welded is 10° C.

Abstract: A method for bonding a cemented (or sintered) carbide element to a structural component is provided comprising cladding at least one surface of the cemented (or sintered) carbide element with a metal alloy using diffusion bonding or brazing and friction welding a cladded surface of the cemented (or sintered) carbide element to the structural component.

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

Abstract: The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.

Abstract: A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 ?m, preferably less than 25 ?m and particularly preferably less than 15 ?m.

Abstract: A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Abstract: Provided in this disclosure is a method of fabricating a backpack truck box, including a step of forming first and second patterned members from sheet material. Each of the patterned members includes multiple edges defining a first panel and a second panel each with one or more opposing tabs formed contiguously on opposing edges of each of panels. One or more bending operations are performed upon each of the opposing tabs to form first and second side portions extending at a predetermined angle from each of the panels. The side portions of the first panel are welded to respective corresponding side portions of the second panel to produce a welded backpack truck box housing.

Abstract: The present disclosure discloses a light-transmittance device and a use method, and belongs to the technical field of manufacturing of rotary equipment. The light-transmittance device includes cylinder sections, a two-column vertical lathe, and a vertical lathe platform; T-shaped supporting fixtures are arranged inside the cylinder sections; light-transmittance tools are arranged at center positions of the cylinder sections; two ends of the cylinder sections are provided with rolling ring base plates which are paired and mounted with the cylinder sections; a roller frame is arranged on a lower side of each group of cylinder section; furthermore, the rolling frames are slidably connected with a rigid rail; a theodolite is arranged on one side close to the cylinder sections; and a triangular bracket and a light-transmittance platform are arranged on a lower side of a shell of the theodolite.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface, a target substrate, a target substrate, and a light-transmissible pin having a pressing end are provided. The flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate. The flexible carrier is deformed by exerting the pin to press the second surface with the pressing end thereof at a position corresponding to the electronic device until the electronic device is in contact with the target substrate. An energy beam emitted from a light source standing outside the pin and then traveling through the pin and going out from the pressing end to bond the electronic device onto the target substrate is applied. The pin is released from pressing the flexible carrier.

Abstract: A friction stir welding tool for a machine tool having a frame and a spindle rotatable relative to the frame. The friction stir welding tool includes a pin, a shoulder, and a drive shaft connectable to the spindle to set the pin and shoulder in rotational motion about a rotation axis, wherein the shoulder is rotatable relative to the pin about the rotation axis. To obtain different speeds of the pin and shoulder in a simple and robust manner, a planetary transmission having a ring gear, a planet carrier, and a sun gear is connected to the drive shaft, pin, and shoulder. The pin or the shoulder is connected to the planet carrier so that the pin and shoulder are set in rotation about the rotation axis at different rotational speeds, but in the same rotation direction, by driving the drive shaft by the spindle.

Abstract: A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

Abstract: Embodiments of the present disclosure provide a method for welding cell strings and a series welding machine. The method includes: forming an arrangement of a plurality of solar cells; inspecting the arrangement of the plurality of solar cells; providing a plurality of initial welding strips including first initial welding strips and second initial welding strips, the first initial welding strips interleave with the second initial welding strips in a first direction; cutting each of the first initial welding strips at first cutting positions, and cutting each of the second initial welding strips at second cutting positions, to obtain a plurality of welding strips; moving each welding strip in a second direction to form a set of welding strips; transferring the set of welding strips onto the arrangement of the plurality of solar cells; and welding the plurality of welding strips to corresponding solar cells to form a cell string.

Abstract: Provided is a wire tension adjuster (60) that adjusts tension (T) applied to a wire (18) of a wire bonding apparatus (100). In the wire tension adjuster (60), in a state in which the wire (18) is gripped by a wire clamper (17), air is supplied to a wire tensioner (40) and a height position (H) of a tip (14f) of a bonding arm (14) is detected, and a flow rate (G) of the air supplied to the wire tensioner (40) is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire (18).

Abstract: A method of forming a rod feedstock for titanium stir friction welding additive manufacturing may comprise: mixing a plurality of powdered metals comprising titanium, iron, vanadium, and aluminum to produce a powder blend; at least one of die pressing the powder blend to form a die pressed powder or continuously powder rolling the powder blend to form a die pressed powder; and sintering the powder blend to form a rod feedstock having a cross-sectional profile.

Abstract: A bed mesh combination device includes a feeding assembly movable in a first direction, two groups of welding cutter assemblies and a welding head assembly oppositely arranged in a second direction. The feeding assembly can lay a spring string on the welding cutter assembly, the welding cutter assembly includes a plurality of welding cutters extending in a third direction, the welding cutters of a same group are arranged at intervals along the first direction, the welding cutters of different groups are staggered in the first direction, the two groups of welding cutter assemblies respectively correspond to first and second welding positions of the spring string. The welding cutter assembly can push the spring string to move in the second direction, and the welding cutter assembly can reciprocate relative to the spring string in the third direction. The welding head assembly includes an ultrasonic welding head and a first driving member.

Abstract: The invention relates to a work interface accessory, comprising an external body having a wall delimiting a recess for the introduction of a rotating portion of the friction stir welding head, an upper plate comprising fastening portions against the head, a central rotating shaft projecting to carry a work tool, the shaft comprising an internally toothed coupling sleeve to allow the shaft to be driven in rotation, when an externally toothed ring gear of the rotating portion of the head rotates in the sleeve.

Abstract: A welding backing insert (20) includes a body (22), a retention member (24) and an insertion member (26). The retention member (24) includes at least one leg (28) being deflectable to enable insertion into a hollow profile structural extrusions (14). At least one leg (28) tries to return to its original position exerting a force on the hollow profile structural extrusion (14) to retain the backing insert (20) in the hollow profile structural extrusion (14). The insertion member (26) projects from the body for inserting into a second hollow profile structural extrusion (14). A gap-control joint spacer (50) projects from the body to provide a gap between adjacent hollow profile structural extrusions.