Patents Examined by Kiley S. Stoner
  • Processes and/or machines for producing continuous plastic deformation, and/or compositions and/or manufactures produced thereby
    Patent number: 11691201
    Abstract: Certain exemplary embodiments can provide a manufacturing method, process, machine, and/or system for continuously consolidating granular materials, creating new alloys and/or composites, and/or modifying and/or refining material microstructure, by using plastic deformation of feedstock(s) provided in various structural forms. Materials produced during this process can be fabricated directly and/or in forms such as, e.g., wires, rods, tubes, sheets, plate and/or channels, etc.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 4, 2023
    Inventor: Kumar Kandasamy
  • Sleeve soldering device and method of producing electronic device
    Patent number: 11696411
    Abstract: A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 4, 2023
    Assignee: DENSO CORPORATION
    Inventors: Hayato Kiuchi, Atsushi Furumoto, Kazuyuki Hamamoto, Teruhiko Iwase, Masayuki Fujihira
  • Method for passive metal activation and uses thereof
    Patent number: 11688845
    Abstract: Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: June 27, 2023
    Assignee: Technion Research & Development Foundation Limited
    Inventors: Yair Ein-Eli, Danny Gelman, Boris Shvartsev, Alexander Kraytsberg
  • Heat assisted flip chip bonding apparatus
    Patent number: 11682650
    Abstract: A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: June 20, 2023
    Assignee: National Pingtung University of Science and Technology
    Inventor: Wei-Hua Lu
  • Pressurization jig for pressurizing busbar and battery module manufacturing system comprising same
    Patent number: 11660710
    Abstract: Disclosed is a pressing jig for welding an electrode lead located in a lead slit formed at the bus bar to the bus bar in a closely adhered state. The pressing jig includes a first frame having a first distance adjusting unit and a first pressing unit, and a second frame having a second distance adjusting unit facing the first distance adjusting unit and a second pressing unit facing the first pressing unit. The first frame and the second frame are coupled so that a distance between first pressing unit and the second pressing unit is increased when a distance between the first distance adjusting unit and the second distance adjusting unit is decreased, and the distance between first pressing unit and the second pressing unit is decreased when the distance between the first distance adjusting unit and the second distance adjusting unit is increased.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: May 30, 2023
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Kyung-Mo Kim, Jeong-O Mun, Jin-Yong Park, Jung-Hoon Lee, Ho-June Chi
  • Hand piece for tip and cartridge and method of use
    Patent number: 11654499
    Abstract: A soldering iron hand piece that may be used for both a soldering tip and a soldering cartridge, allowing the same hand piece to be used for both a soldering tip and a soldering cartridge.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: May 23, 2023
    Assignee: OK International, Inc.
    Inventors: Hoa Dinh Nguyen, Michael Carlomagno
  • Processing route to design and manufacture highly configurable non-magnetic down-hole sensor collars
    Patent number: 11654506
    Abstract: Drill collars may be constructed using solid-state welding processes. Solid-state welding produces robust drill collars with high fatigue lifespans and permits individual segments of the drill collar to be optimized based on their intended use. A drill collar may be formed of a first segment with a different material, density, modulus of elasticity and/or geometry than an adjacent second segment fused thereto. If a segment of a drill collar is damaged in use, the damaged segment may be removed and replaced, possibly without de-rating the drill collar. Methods of forming the solid-state welds may include friction welding adjacent segments to one another such that features in each segment are circumferentially aligned when the weld is formed. Supplemental energy sources may provide additional heat at the welded surfaces to ensure the segments are effectively fused.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: May 23, 2023
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Krutibas Panda, Michael Dewayne Finke, Brian David Breaux, Gregory D. Stark
  • Semiconductor manufacturing apparatus
    Patent number: 11658147
    Abstract: A semiconductor manufacturing apparatus includes; a component separating apparatus configured to separate a defective component from a substrate, a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate, and a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump, and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: May 23, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilhyoung Koo, Youngshin Choi, Changho Lee
  • Thermal compression bonder nozzle with vacuum relief features
    Patent number: 11652080
    Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Mihir Oka, Kartik Srinivasan, Wei Tan, James Mellody
  • Soldering of end chip components in series
    Patent number: 11641717
    Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 2, 2023
    Assignee: International Business Machines Corporation
    Inventors: John R. Dangler, Theron Lee Lewis, David J. Braun, Eric Nguyen Phan
  • Structure for retaining fastening element solder
    Patent number: 11638963
    Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: May 2, 2023
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Solder transfer integrated circuit packaging
    Patent number: 11631650
    Abstract: An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: April 18, 2023
    Assignee: International Business Machines Corporation
    Inventor: Katsuyuki Sakuma
  • Joining method
    Patent number: 11628514
    Abstract: A method of joining a first component to a second component at respective connection surfaces, comprising, in order, applying a local surface treatment to the connection surface of at least one of the first and second components in order to locally alter the microstructure to a depth of between 60 ?m and 10 mm below the connection surface; and joining the first component to the second component using a welding process.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: April 18, 2023
    Assignee: ROLLS-ROYCE plc
    Inventors: Andrew R Walpole, John P E Forsdike, Gavin J Baxter, Simon E Bray, Alistair J E Smith
  • Process and device for low-temperature pressure sintering
    Patent number: 11626383
    Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 11, 2023
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Holger Ulrich
  • Selective soldering system for selective wave soldering of circuit boards comprising gripping unit for exchanging solder nozzles
    Patent number: 11623291
    Abstract: Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 11, 2023
    Assignee: ERSA GmbH
    Inventors: Sven Proppert, Theresa Christ
  • Device for manufacturing electric component and method for manufacturing electric component
    Patent number: 11618107
    Abstract: An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 4, 2023
    Assignees: HAMANAKODENSO CO., LTD., DENSO CORPORATION
    Inventors: Sadayuki Tsuda, Atsushi Furumoto, Yoshinori Suzuki
  • Method of manufacturing plate-shaped solder and manufacturing device
    Patent number: 11618111
    Abstract: A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: April 4, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuji Uozumi, Kazuhiko Sakutani
  • Wire for electric bonding
    Patent number: 11618109
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 4, 2023
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Gwang-Mun Choi, Yong Sung Eom, Kwang-Seong Choi, Jiho Joo, Chanmi Lee, Ki Seok Jang
  • Braze gap control tool system
    Patent number: 11612968
    Abstract: A tool system controls and prevents gaps during processing of assemblies at elevated temperature. Gaps are prevented from arising at joints between components during temperature changes. The tool system includes a lever arm having a body, a connection configured to allow the body to pivot, a cam surface defined by the body and configured to engage the second component, and a weight arm extending from the body and over the second component. In response to movement of the second component, the lever arm is configured to pivot at the connection while the weight arm is configured to generate a force transferred through the body to the second component to maintain contact at the joint between the first component and the second component. A rod may be connected with the lever arm for added weight.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: March 28, 2023
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Gregory Eric Schalk, Peter Eichensehr, Christian Boncek, Mitchell Lee Vogatsky
  • Welding quality processing method and device, and circuit board
    Patent number: 11617258
    Abstract: A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 28, 2023
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Zhenya Kang, Jinbao Guo