Abstract: Disclosed are a manufacturing method for a laser chip and a laser chip. The manufacturing method comprises: step S1, forming a first electroplating substrate on an epitaxial layer; step S2, forming an organic pattern layer on the first electroplating substrate, wherein the pattern layer defines a hollowed-out area and a part of the first electroplating substrate is exposed to the pattern layer by means of the hollowed-out area; step S3, forming a first metal coating on the first electroplating substrate, wherein the first metal coating completely covers the pattern layer and the part of the first electroplating substrate not covered by the pattern layer; and step S4, removing the pattern layer to have a hollow channel formed between the first metal coating and the first electroplating substrate, wherein the channel is provided with at least one inlet and at least one outlet running through the first metal coating.

Abstract: An optical fiber configured to improve the pump conversion efficiency of an L-band fiber amplifier which uses the multimode pump source. By directly absorbing multimode light including 915 nm, an active fiber core region co-doped with both erbium and ytterbium can provide gain to the L-band signals via stimulated emission. The unwanted C-band amplified spontaneous emission (ASE) light generate from this active fiber core region can be absorbed by another active fiber core region doped with erbium, then provides additional gain to the L-band signals. Active regions and cladding can be configured to match a given spatial mode of the optical signal. Signal-pump combiners with end-coupling or side coupling can be used.

Abstract: A light-emitting element includes: a laminated structure body 20 which is formed from a GaN-based compound semiconductor and in which a first compound semiconductor layer 21 including a first surface 21a and a second surface 21b that is opposed to the first surface 21a, an active layer 23 that faces the second surface 21b of the first compound semiconductor layer 21, and a second compound semiconductor layer 22 including a first surface 22a that faces the active layer 23 and a second surface 22b that is opposed to the first surface 22a are laminated; a first light reflection layer 41 that is provided on the first surface 21a side of the first compound semiconductor layer 21; and a second light reflection layer 42 that is provided on the second surface 22b side of the second compound semiconductor layer 22. The first light reflection layer 41 includes a concave mirror portion 43, and the second light reflection layer 42 has a flat shape.

Abstract: The light-emitting element of an embodiment outputs a clear optical image while suppressing light output efficiency reduction, and includes a substrate, a light-emitting unit, and a bonding layer. The light-emitting unit has a semiconductor stack, including a phase modulation layer, between first and second electrodes. The phase modulation layer has a base layer and modified refractive index regions, and includes a first region having a size including the second electrode, and a second region. Each gravity center of the second region's modified refractive index region is arranged by an array condition. The light from the stack is a single beam, and regarding a first distance from the substrate to the stack's front surface and a second distance from the substrate to the stack's back surface, a variation amount of the first distance along a direction on the substrate is smaller than a variation amount of the second distance.

Abstract: A surface emitting laser element formed of a group III nitride semiconductor, comprising: a first clad layer of a first conductivity type; a first guide layer of the first conductivity type having a photonic crystal layer formed on the first clad layer including voids disposed having two-dimensional periodicity in a surface parallel to the layer and a first embedding layer formed on the photonic crystal layer; a second embedding layer formed on the first embedding layer by crystal growth; an active layer formed on the second embedding layer; a second guide layer formed on the active layer; and a second clad layer of a second conductivity type formed on the second guide layer, the second conductivity type being a conductivity type opposite to the first conductivity type. The first embedding layer has a surface including pits disposed at surface positions corresponding to the voids.

Abstract: A reflector includes a low refractive index layer having a first average refractive index; and a high refractive index layer having a second average refractive index. The low refractive index layer includes a laminate of alternate Ga-doped AlN layers and layers consisting essentially of GaN. The high refractive index layer includes an InGaN layer. The second average refractive index is higher than the first average refractive index.

Abstract: A semiconductor laser element that includes a semiconductor layer including a waveguide formed in an intra-layer direction of the semiconductor layer and a window region formed in a front-side end face of the waveguide, has a current-laser optical output characteristic in which, at an operating temperature of 25° C.±3° C., a laser optical output has a maximum value at a first driving current value and the laser optical output is at most 20% of the maximum value at a second driving current value greater than the first driving current value, and is not damaged at the second driving current value.

Abstract: A light absorbing layer which is bonded to a laser medium to configure a bonded body, wherein the light absorbing layer is formed from a glass material and, in an oscillation wavelength (wavelength of 650 nm or more and less than 1400 nm) of the laser medium, an absorption coefficient is 0.1 to 10.0 cm?1, a difference in refractive index between the light absorbing layer and the laser medium is within ±0.1, and a difference in linear thermal expansion coefficient between the light absorbing layer and the laser medium is within ±1 ppm/K. The present invention relates to a light absorbing layer for preventing parasitic oscillation, and aims to provide a material capable of suppressing the manufacturing cost and which can be easily processed for preparing a bonded body.

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.

Abstract: Integrated circuitry is fabricated from semiconductor layers formed on a substrate, which include at least one n-type layer, an inverted p-type modulation doped quantum well (mod-doped QW) structure, a non-inverted n-type mod-doped QW structure, and at least one p-type layer including a first P+-type layer formed below a second P-type layer. An etch operation exposes the second p-type layer. P-type ions are implanted into the exposed second p-type layer. A gate electrode of a n-channel HFET device is formed in contact with the p-type ion implanted region. Source and drain electrodes of the n-channel HFET device are formed in contact with n-type ion implanted regions formed in contact with the n-type mod-doped QW structure. P-channel HFET devices, complementary BICFET devices, stacked complementary HFET devices and circuits and/or logic gates based thereon, and a variety of optoelectronic devices and optical devices can also be formed as part of the integrated circuitry.

Abstract: A laser system for generating a narrow linewidth semiconductor light beam includes a substrate, a gain chip affixed on the substrate and configured to amplify light beam, and an optical feedback photonic chip affixed on the substrate, optically coupled to the gain chip, and configured to output light beam, which has a narrow linewidth around a resonant frequency of the optical feedback photonic chip, to the gain chip.

Abstract: The olive oil-tuned broadband conjugated polymer laser medium includes the conjugated polymer known as poly ((9,9-dihexyl-9H-fluorene-2,7-vinylene)-co-(1-methoxy-4-(2-ethylhexyloxy)-2,5-phenylenevinylene)) or “Poly(FV-co-MEHPV)” at a 90:10 mole ratio. The emission wavelength of the olive oil tuned broadband conjugated polymer laser can be reversibly tuned between 500 nm and 680 nm.

Abstract: A device includes a first cladding layer, a waveguide laser, an absorption layer, and a second cladding layer. The absorption layer is constituted by an oversaturation absorption body such as graphene. Also, the absorption layer is provided between the active layer and the distributed Bragg reflection portion. The absorption layer is formed below a core forming an optical waveguide between the active layer and a distributed Bragg reflection portion.

Abstract: A light source device including a light emitting unit in which multiple light emitting elements including vertical cavity surface emitting lasers are arranged is intended to curb temperature rise. A light source device according to the present technology includes a light emitting unit in which multiple light emitting elements including vertical cavity surface emitting lasers are arranged, and a driving unit that, regarding the light emitting element in the light emitting unit, causes multiple light emitting elements to be caused to emit light in a light emission target period to emit light in a time-divided manner in the light emission target period. By adopting time-division light emission, the number of light emitting elements that are caused to emit light simultaneously is reduced.

Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.

Abstract: A method for physical random number generation includes the steps of: modulating the gain of a vertical-cavity surface-emitting laser periodically from the lower threshold to the upper threshold and back; maintaining the gain per round trip positive for a longer period than the round trip time of the cavity; maintaining the net gain per round trip negative for a longer period than the round trip time of the cavity, in order to create optical pulses of random amplitude; detecting the optical pulses; converting the optical pulses into electrical analog pulses; and digitising the electrical analog pulses into random numbers.

Abstract: An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to an embodiment may comprise: a substrate; a first reflective layer arranged on the substrate; an active layer arranged on the first reflective layer; an aperture layer arranged on the active layer and comprising an opening; a second reflective layer arranged on the active layer; a transparent electrode layer arranged on the second reflective layer; and a metal electrode layer arranged on the transparent electrode layer. The transparent electrode layer may comprise a first area perpendicularly overlapping the opening and multiple second areas extending from the first area. The multiple second areas may be arranged outside the opening along the circumferential direction of the opening and spaced apart from each other. The multiple second areas may be arranged and spaced apart from each other so as to correspond to the circumference of the opening.

Abstract: An injection locking laser source is provided for an optical communications system. The injection locking laser source includes a laser cavity configured to receive an externally injected low linewidth primary light source. The laser cavity includes a cavity length, a cavity facet reflectivity, and a cavity quality factor. The injection locking laser source further includes an emitting region configured to output a secondary light source injection locked to the externally injected low linewidth primary light source at a stable detuning frequency based on a photon number, a steady-state phase, and a carrier number of the primary light source injected into the cavity.

Abstract: Apparatuses and methods are disclosed for applying laser energy having desired pulse characteristics, including a sufficiently short duration and/or a sufficiently high energy for the photomechanical treatment of skin pigmentations and pigmented lesions, both naturally-occurring (e.g., birthmarks), as well as artificial (e.g., tattoos). The laser energy may be generated with an apparatus having a resonator with the capability of switching between a modelocked pulse operating mode and an amplification operating mode. The operating modes are carried out through the application of a time-dependent bias voltage, having waveforms as described herein, to an electro-optical device positioned along the optical axis of the resonator.

Abstract: A high-contrast grating (HCG) structure and method of fabrication. The grating of the HCG is formed over a structural spacer layer, allowing a wider range of grating patterns, such as post and other forms which are lack structural support when fabricated over an air spacing beneath the grating elements. The technique involves etching the HCG grating, followed by oxidizing through this HCG grating into an oxide spacer layer beneath it creating a low-index area beneath the grating. This form of HCG reflector can be utilizes as upper and/or lower reflectors in fabricating vertical cavity surface emitting lasers (VCSELs).