Patents Examined by Kyoung Lee
  • Patent number: 11329070
    Abstract: Provided is an electronic panel. The electronic panel includes a display unit including a plurality of pixels, an encapsulation layer covering the pixels, and a planarization layer disposed on the encapsulation layer, the display unit in a plan view including an active area displaying an image and a peripheral area adjacent to the active area, and an input sensing unit disposed on the display unit and configured to detect an external input. An upper surface of the encapsulation layer includes a flat surface provided in the active area and a non-flat surface provided in the peripheral area and curved compared to the flat surface. The planarization layer covers the non-flat surface. The input sensing unit is disposed on the flat surface and on the non-flat surface.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyungjun Park, Wonkyu Kwak
  • Patent number: 11329252
    Abstract: A display module, a method of manufacturing the display module, and an electronic device include an array substrate, a light-emitting device layer, a thin film encapsulation layer, a touch layer, a polarizer layer, and a cover layer. The polarizer layer and the cover layer are formed on the light-emitting device layer through a deposition process.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 10, 2022
    Inventor: Chen Zhao
  • Patent number: 11329254
    Abstract: A display panel and a display device are provided and have a base substrate, a blocking wall, an encapsulation layer, and a touch capacitor layer. By forming a second-layer blocking wall and a first-layer blocking wall to form a second blocking wall, a height of the second blocking wall is increased. Further, a blocking block is disposed between the second blocking wall and the first blocking wall, thereby increasing a thickness and a height of the blocking wall. When inkjet printing an organic layer, a slope at edges of a display area is relatively smooth, which can make an entire encapsulation layer relatively flat, thereby reducing a height difference of wirings at the edges and avoiding a problem of inaccurate exposure and focus.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: May 10, 2022
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Kun Wang
  • Patent number: 11329250
    Abstract: A display device includes: a display panel including a front surface and a rear surface, the rear side being opposite to the front side; a front stacked structure on the front surface including a front bonding member disposed on the front surface; and a rear stacked structure on the rear surface including a rear bonding member disposed on the rear surface. A loss tangent of the front bonding member has a value greater than a loss tangent of the rear bonding member, the loss tangent being represented by an equation: (loss tangent)=(loss modulus)/(storage modulus), wherein the loss modulus refers to energy lost by viscosity of a material, and the storage modulus refers to energy stored without loss by elasticity of the material.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 10, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ju Hee Song, Sang Hyo Park, Byoung Su Lee, Tae Hyeog Jung, Won Ju Choi
  • Patent number: 11322716
    Abstract: The flexible light-emitting panel, the manufacturing method thereof and the display device, the flexible light-emitting panel comprises: a backplate; the adhesive layer comprises a first sub-adhesive layer disposed on the backplate and a plurality of protrusions from the first sub-adhesive layer away from the backplate a second sub-adhesive layer; the flexible layer is disposed on the first sub-adhesive layer, and the flexible layer comprises a plurality of spaced sub-flexible layers, the second sub-adhesive layer is located at spacings; and an array is sequentially stacked on each sub-flexible layer The substrate, the light-emitting component and the encapsulation layer; the cover plate is disposed on the encapsulation layer and the second sub-adhesive layer.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: May 3, 2022
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Fang Wang
  • Patent number: 11322370
    Abstract: There is provided a technique that includes adjusting a pressure of each of a plurality of process chambers, by adjusting an opening degree of a pressure-adjusting valve included in a common gas exhaust pipe, which is connected to a plurality of process chamber exhaust pipes and is disposed to merge respective process chamber exhaust pipes on a downstream side of the plurality of process chamber exhaust pipes, to a predetermined opening degree and by exhausting an atmosphere of each of the process chambers from the plurality of process chamber exhaust pipes and the common gas exhaust pipe while supplying an inert gas to the plurality of process chambers; processing a substrate in each of the process chambers; and detecting a fluctuation of pressures in the process chamber exhaust pipes by measuring, by one or more pressure detectors, the pressures of the process chamber exhaust pipes.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 3, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideharu Itatani, Toshiyuki Kikuchi, Naofumi Ohashi
  • Patent number: 11314115
    Abstract: An array substrate, a manufacturing method of the same, a display panel and a display device are provided. The array substrate includes a display region and a peripheral region around the display region, a photosensitive layer is in the display region and a peripheral circuit is in the peripheral region. The array substrate further includes an alignment film covering the photosensitive layer and the peripheral circuit. The array substrate further includes an insulating layer between the peripheral circuit and the alignment film. The alignment film is a photo alignment film, and the insulating layer is configured to absorb and/or reflect an alignment light adopted for performing photoalignment to obtain the alignment film.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 26, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yang Xie, Weixin Meng, Jian Guo
  • Patent number: 11309513
    Abstract: An anode includes at least one first electrode, and a reflecting electrode disposed on a side of the at least one first electrode configured to face a light emitting portion of the light emitting device.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: April 19, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Wei Quan
  • Patent number: 11309520
    Abstract: An encapsulation structure includes a first inorganic layer, a first organic layer and a second inorganic layer, all of which are sequentially stacked in a thickness direction of the encapsulation structure. At least one of the first inorganic layer or the second inorganic layer is a crack-resistant layer.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 19, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tingliang Liu, Yunsheng Xiao, Xiangdan Dong, Yue Long, Kai Zhang, Yonglin Guo, Hongwei Ma
  • Patent number: 11308726
    Abstract: A display device and a fabricating method thereof are provided. The display device has a display panel and an optical fingerprint recognition sensor. The display panel has a transparent organic material layer, a barrier layer, a buffer layer, and an array substrate sequentially stacked and disposed from bottom to top. A surface of the transparent organic material layer opposite to the barrier layer is a back surface of the transparent organic material layer. The optical fingerprint recognition sensor is disposed on the back surface of the transparent organic material layer.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: April 19, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Haoran Cao, Pilgeun Chun
  • Patent number: 11302845
    Abstract: A semiconductor light-emitting element includes: an n-type clad layer of an n-type aluminum gallium nitride (AlGaN)-based semiconductor material provided on a substrate; an active layer of an AlGaN-based semiconductor material provided on the n-type clad layer and configured to emit deep ultraviolet light having a wavelength of not shorter than 300 nm and not longer than 360 nm; and a p-type semiconductor layer provided on the active layer. The n-type clad layer is configured such that a transmittance for deep ultraviolet light having a wavelength of 300 nm or shorter is 10% or lower.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: April 12, 2022
    Assignee: NIKKISO CO., LTD.
    Inventors: Tetsuhiko Inazu, Cyril Pernot
  • Patent number: 11302571
    Abstract: A method includes applying a first metallic layer having a first metallic material onto a substrate of a semiconductor component. The method further includes removing portions of the first metallic layer to form a first metallic line. The method further includes creating an opening in the first metallic line. The method also includes depositing a dielectric material on the substrate. The method further includes forming at least one trench in the dielectric material. The method also includes depositing a second metallic material within the at least one trench to form a second metallic line. At least the first and second metallic lines and the dielectric material form an interconnect structure of the semiconductor component.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: April 12, 2022
    Assignee: International Business Machines Corporation
    Inventors: Somnath Ghosh, Hsueh-Chung Chen, Yongan Xu, Jr., Yann Mignot, Lawrence A. Clevenger
  • Patent number: 11302683
    Abstract: A package structure and method of forming the same are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is laterally aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element insertion. The encapsulant laterally encapsulates the second die and the wall structure.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: April 12, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11302765
    Abstract: A display device includes a display panel including a display area including a plurality of pixels, and a pad area disposed around the display area; and a printed circuit board on which a plurality of lead wirings attached to the pad area of the display panel are disposed, wherein the display panel includes a plurality of signal wirings disposed on the pad area of the display panel and connected to the pixels, and an inorganic pattern disposed between each of the signal wirings and each of the lead wirings.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 12, 2022
    Assignee: Samsung Display Co., LTD.
    Inventor: Myong Hoon Roh
  • Patent number: 11296173
    Abstract: In example implementations, a display is provided. The display includes a first portion and a second portion. The first portion includes a first plurality of light emitting diodes (LEDs) that emit light in a first direction. The second portion includes a combination of the first plurality of LEDs that emit light in the first direction and a second plurality of LEDs that emit light in a second direction that is opposite the first direction to form a dual-sided display.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Ann Alejandro Villegas, Chi Hao Chang
  • Patent number: 11296223
    Abstract: A semiconductor device includes a semiconductor layer of a first conductivity type. A well region that is a second conductivity type well region is formed on a surface layer portion of the semiconductor layer and has a channel region defined therein. A source region that is a first conductivity type source region is formed on a surface layer portion of the well region. A gate insulating film is formed on the semiconductor layer and has a multilayer structure. A gate electrode is opposed to the channel region of the well region where a channel is formed through the gate insulating film.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 5, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Shuhei Mitani, Yuki Nakano, Heiji Watanabe, Takayoshi Shimura, Takuji Hosoi, Takashi Kirino
  • Patent number: 11296035
    Abstract: According to one embodiment, a semiconductor wafer includes a plurality of chip regions, a plurality of chip regions, a device layer, a first structure, and a second structure. The device layer includes an integrated circuit formed in each of the chip regions. The first structure is formed in the kerf region by filling a first cavity with a first filling material. The first cavity extends vertically with respect to a surface of a semiconductor substrate. The second structure is formed in the device layer by filling a second cavity with a second filling material. The second cavity extends vertically with respect to the surface of the semiconductor substrate.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: April 5, 2022
    Assignee: Kioxia Corporation
    Inventor: Mika Fujii
  • Patent number: 11289669
    Abstract: The present disclosure provides a light-emitting device, a pixel unit, a method for manufacturing the pixel unit, and a display device. The light-emitting device comprises a first electrode, an organic light-emitting layer and a second electrode which are sequentially disposed on a substrate; the first electrode comprises a reflecting layer, a transparent insulating layer and a transparent contact layer which are sequentially disposed on the substrate; and the second electrode is a semi-transparent electrode, so that a cavity is formed between the second electrode and the reflecting layer.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 29, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Hui Wang, Pengcheng Lu, Kuanta Huang
  • Patent number: 11289633
    Abstract: The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated layer formed on the base substrate; a plurality of solder balls formed on the semiconductor laminated layer of the plurality of light emitting devices, respectively; a molding member configured to surround the light emitting devices and the solder balls; and a circuit board formed on the molding member, in which upper surfaces of the solder balls are exposed from the molding member, the circuit board includes a contact layer consisted of a metal pattern layer electrically connected with the plurality of solder balls exposed from the molding member and an insulating layer adjacently disposed to the metal pattern layer, and a thickness from the base substrate of each of the plurality of light emitting devices to an upper surface of each of the exposed solder balls is the same each other.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: March 29, 2022
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Jung Hyun Park, In Yeol Hong
  • Patent number: 11289665
    Abstract: The disclosure provides an organic light-emitting display screen and a manufacturing method thereof. The organic light-emitting display screen includes a filter substrate, and further includes a color filter layer, a cathode layer, an organic light-emitting layer and an anode array sequentially formed on the filter substrate. The anode array includes a number of anode units spaced apart from each other, the color filter layer includes a number of filter units, and each of the anode units corresponds to each of the filter units.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: March 29, 2022
    Assignee: VISIONOX TECHNOLOGY INC.
    Inventors: Xiaolong Yang, Guizhou Qiao, Rubo Xing