Patents Examined by Kyung S. Lee
  • Switch cell having a semiconductor switch element and micro-electromechanical switch element
    Patent number: 10727017
    Abstract: Various embodiments include a switch cell comprising: a semiconductor switch element; a micro-electromechanical switch element; and an electronic actuation circuit. The semiconductor switch element and the micro-electromechanical switch element are connected in parallel. In a switch-off process for the switch cell, the semiconductor switch element is switched off after the micro-electromechanical switch element is switched off.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: July 28, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Anne Bauer, Werner Hartmann, Holger Schönherr
  • Monitoring a fault in an electrical equipment item
    Patent number: 10712209
    Abstract: The monitoring of an electrical equipment item includes two electrically insulated circuits, a screen in the form of a film arranged between the two circuits, the screen comprising a substrate and a conductive filament arranged on the substrate, a module configured to circulate a current in the conductive filament and to monitor the current.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: July 14, 2020
    Assignee: THALES
    Inventors: Francis Abdesselam, Joël Devautour
  • Chip varistor
    Patent number: 10706995
    Abstract: A chip varistor includes two functional layers (that is, a first functional layer and a second functional layer) inside an element body, and the two functional layers have substantially the same electrostatic capacitance. In the chip varistor, the element body is made highly resistive from an outer surface due to alkali metal containing portion. However, the alkali metal containing portion does not reach the first functional layer and the second functional layer. Therefore, the alkali metal containing portion curbs a parasitic capacitance of the chip varistor without affecting the electrostatic capacitances of the first functional layer and the second functional layer. Accordingly, the chip varistor includes the two functional layers in which variations in capacitance are curbed.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: July 7, 2020
    Assignee: TDK CORPORATION
    Inventor: Masayuki Uchida
  • Varistor
    Patent number: 10706994
    Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ic Seob Kim, Jung Il Kim, Yong Sung Kim, Eun Ju Oh, Su Rim Bae, Hae In Kim
  • Electrical connection to keycap
    Patent number: 10699857
    Abstract: There is disclosed in an example a key having a tactile element; and a flexible and conductive external element disposed over the tactile element. There is also disclosed an example method of manufacturing the key, and an electronic device comprising a plurality of active keys, including at least one of the key.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: June 30, 2020
    Assignee: Intel Corporation
    Inventors: Ayeshwarya B. Mahajan, Sukanya Sundaresan
  • Resistor with upper surface heat dissipation
    Patent number: 10692633
    Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 23, 2020
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Todd L. Wyatt, Darin W. Glenn
  • Surface mount resistors and methods of manufacturing same
    Patent number: 10692632
    Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: June 23, 2020
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Clark Smith, Todd Wyatt
  • Circuit protection assembly
    Patent number: 10674599
    Abstract: A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: June 2, 2020
    Assignee: CYG WAYON CIRCUIT PROTECTION CO., LTD.
    Inventors: Quanquan Yang, Yutang Liu, Rong Fan, Yong Fang, Guochen Wu
  • Resistors for dynamic braking
    Patent number: 10665369
    Abstract: A resistor of a powered system includes an elongated body that extends from a first terminal end to an opposite second terminal end. The body forms a continuous path that extends from the first terminal end to the second terminal end and that forms a disc. The body is configured to receive electric current from the powered system at the first terminal end and conduct and provide electric resistance to the electric current received from the powered system to dissipate at least part of the electric current as heat from the body. The second terminal end of the body is configured to be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: May 26, 2020
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Sudeep Pradhan Sadananda Rao, Jaime Garcia, Mahantesh Hosur, Jeffrey John Wolff, Laura Cooper
  • Co-wound resistor
    Patent number: 10665370
    Abstract: A co-wound resistor with a low parasitic inductance includes a first resistive strip having an input and a second resistive strip having an output. The second resistive strip has a similar shape as the first resistive strip. The second resistive strip is co-wound in a same direction as the first resistive strip. The second resistive strip and the first resistive strip are configured to generate a mutual inductance that cancels an inductance of the first resistive strip and the second resistive strip. The first interconnect coupling the first resistive strip to the second resistive strip. The first resistive strip, the second resistive strip and the first interconnect are on a same level.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: May 26, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Chao Song, Ye Lu
  • Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance
    Patent number: 10653013
    Abstract: A resistor assembly is disclosed and comprises a surface mounted layer comprising a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a second layer disposed underneath the surface mounted layer. The second layer comprises an embedded thin film resistor electrically coupled to the surface mounted layer. The plurality of trimming bridges are each removable to increase a resistance of the embedded thin film resistor. The resistor assembly also comprises a plurality of vias that electrically couple the first conductive trace of the surface mounted layer to the embedded thin film resistor.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: May 12, 2020
    Assignee: The Boeing Company
    Inventors: Kyu-Pyung Hwang, Young Kyu Song
  • Thermistor sintered body and thermistor element
    Patent number: 10643768
    Abstract: A thermistor sintered body that can control a B constant at 1000° C. to the same level as that of a conventional wide range type. The thermistor sintered body according to the present invention has a composite structure that includes a Y2O3 phase and a Y(Cr, Mn)O3 phase or a YMnO3 phase. In the thermistor sintered body according to one aspect of the present invention, a chemical composition of Cr, Mn, Ca and Y excluding oxygen is Cr: 3 to 9 mol %, Mn: 5 to 15 mol %, Ca: 1 to 8 mol % (where Cr/Mn<1.0), and the balance being unavoidable impurities and Y. In the thermistor sintered body, the B constant (B(0/1000)) determined by the following Expression (1) is 2400 K or lower; B=(lnRm?lnRn)/(1/Tm?1/Tn) . . . (1). Rm: resistance value at 0° C., Rn: resistance value at 1000° C., Tm: 0° C., and Tn: 1000° C.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: May 5, 2020
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Akitaka Takeuchi, Naohiro Niizeki
  • Resistor element and resistor element assembly
    Patent number: 10643769
    Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Hyun Park, Jang Seok Yun, Kyung Seon Baek
  • Shift operating element
    Patent number: 10636588
    Abstract: The invention relates to a shift operating element, specifically for a motor vehicle, having an actuation surface which can be moved by the manual application of force by means of an element, wherein the element is specifically the finger of a human hand. The shift operating element comprises a sensor which interacts with the actuation surface such that the sensor, upon the movement of the actuation surface by means of the element, generates a signal. The signal is specifically employed to shift and/or trigger a function, in the manner of a shift signal. A mechanical damping and/or restoring element is provided which interacts with the actuation surface upon the movement thereof. The mechanical damping and/or restoring element is a constituent of the sensor, specifically the mechanical damping and/or restoring element is integrated into the sensor.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: April 28, 2020
    Assignee: Marquardt GmbH
    Inventors: Achim Mink, Roland Neitzel
  • Composite thermistor chip and preparation method thereof
    Patent number: 10636550
    Abstract: A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 28, 2020
    Assignee: Exsense Electronics Technology Co., Ltd.
    Inventors: Zhaoxiang Duan, Jiankai Ye, Jun Yang, Qixing Bai, Limin Tang
  • Waterproof button module
    Patent number: 10636591
    Abstract: A waterproof button module includes a casing, a button, a resilient member, and a first waterproof portion. The casing has a first recess and a first through hole located at a bottom of the first recess. The button is located in the first recess and partially passes through the first through hole. The resilient member is located in the first recess. The button and the bottom of the first recess are respectively located on opposite sides of the resilient member. The first waterproof portion surrounds the first through hole and abuts against the resilient member and the first recess in an airtight manner.
    Type: Grant
    Filed: December 16, 2018
    Date of Patent: April 28, 2020
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Yi-Chou Lin
  • Electronic component
    Patent number: 10636549
    Abstract: An insulating sheet and a conductive terminal are provided in an electronic component, where at least one of the conductive terminals has a missing part, and where a remaining part positioned on both ends of the missing part is connected through a resistor element affixed to the insulating sheet.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 28, 2020
    Assignee: Molex, LLC
    Inventor: Toshihiro Niitsu
  • Multi-function electronic device having memristor and memcapacitor and method for manufacturing the same
    Patent number: 10636552
    Abstract: The present invention relates to a multi-function electronic device having a memristor and a memcapacitor and a method for manufacturing the same. The multi-function electronic device having a memristor and a memcapacitor has a laminated structure of a first insulating layer comprising an organic material/an active layer/a second insulating layer comprising an organic material, and thus has a resistance and capacitance varying with the applied voltage.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: April 28, 2020
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Moon Ho Ham, Myung Woo Son, Yun Bin Jeong
  • Resistor element
    Patent number: 10636551
    Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: April 28, 2020
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Katsuya Okumura, Kazuhiro Eguchi, Daisuke Muramatsu
  • Housing structure of planar resistor
    Patent number: 10636548
    Abstract: A housing structure of a planar resistor is provided, wherein electrode extraction ends of the planar resistor are on the same side of the resistor. A housing structure body is made of an insulating material covering the surface of the resistor. An insulating structure having a groove opening facing toward or away from the resistor is provided around each electrode extraction end of the resistor. The insulating structure is configured to be a multi-tooth or multi-groove insulating structure.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: April 28, 2020
    Assignees: NR ENGINEERING CO., LTD, NR ELECTRIC CO., LTD, NR ELECTRIC POWER ELECTRONICS CO., LTD
    Inventors: Xiang Zhang, Chihan Chen, Zhao Li, Ge Song, Li Zheng, Fan Yang